이 특허를 인용한 특허 (48)

1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot, Asymmetrical flexible edge seal for vacuum insulating glass.

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2. Burtzlaff,Robert; Haba,Belgacem; Humpston,Giles; Tuckerman,David B.; Warner,Michael; Mitchell,Craig S., Back-face and edge interconnects for lidded package.

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3. Park Chul Ho (Chungcheongbuk-do KRX) Song Kwang Bok (Seoul KRX), Charge coupled device with microlens.

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4. Huang, Yin-Chun; Huang, Chih-Wen, Charge coupled device with multi-focus lengths.

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5. Whitney, David; Souza, Anthony V., Electrically-conductive grid shield for semiconductors.

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6. Horio, Tomoharu; Murakawa, Shigehiro, Electromagnetic shield cap and infrared data communication module.

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7. Bettger, Kenneth J.; Stark, David H., Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units.

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8. Bettger, Kenneth J.; Stark, David H., Flexible edge seal for vacuum insulating glazing units.

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9. Stark, David H., Hermetically sealed micro-device package using cold-gas dynamic spray material deposition.

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10. Stark, David H., Hermetically sealed micro-device package with window.

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11. Stark, David H., Hermetically sealed micro-device package with window.

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12. Stark,David H., Hermetically sealed micro-device package with window.

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13. Warner, Michael, High-frequency chip packages.

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14. Tuckerman, David B.; Honer, Kenneth Allen; McWilliams, Bruce M.; Colella, Nicholas J.; Goudge, Charles Liam, Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture.

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15. Stark, David H, Insulated glazing units.

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16. Stark, David H., Insulating glass unit having multi-height internal standoffs and visible decoration.

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17. Badehi, Avner, Integrated circuit device.

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18. Badehi, Avner, Integrated circuit device.

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19. Badehi, Avner, Integrated circuit device.

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20. Badehi, Avner, Integrated circuit device.

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21. Badehi,Avner, Integrated circuit device.

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22. Arakawa, Fumihiro; Tsuchiya, Mitsuru; Katagiri, Hiroomi; Suga, Taiji; Masaki, Tadahiro, Lens film with conductive lens layer or conductive layer.

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23. Wu,Melinda W.; Embry,Carl; Teng,Yman; Kaneshiro,Ron, Low cost, high speed, high efficiency infrared transceiver.

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24. Suzuki, Nobuo; Masukane, Kazuyuki, MOS type image pickup device having pixel interleaved array layout and one analog to digital conversion unit provided per each pair of adjacent photoelectric conversion columns.

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25. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael, Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit.

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26. Park Chul Ho,KRX ; Song Kwang Bok,KRX, Method of making charge-coupled device with microlens.

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27. Aoki Tetsuro (Fukuyama JPX), Method of manufacturing solid state imaging device having high sensitivity and exhibiting high degree of light utilizati.

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28. Zilber, Gil; Katraro, Reuven; Aksenton, Julia; Oganesian, Vage, Methods and apparatus for packaging integrated circuit devices.

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29. Zilber, Gil; Katraro, Reuven; Aksenton, Julia; Oganesian, Vage, Methods and apparatus for packaging integrated circuit devices.

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30. Zilber,Gil; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.

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31. Zilber,Gil; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.

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32. Zilber,Gil; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.

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33. Zilber,Gil; Katraro,Reuven; Aksenton,Julia; Oganesian,Vage, Methods and apparatus for packaging integrated circuit devices.

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34. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.

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35. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.

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36. Rhodes Howard E., Microlens array with improved fill factor.

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37. Huang Ji-Chung,TWX ; Sheu Yea-Dean,TWX ; Hsu Chung-En,TWX ; Tseng Han-Liang,TWX, Microlens process.

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38. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John, Multi-pane glass unit having seal with adhesive and hermetic coating layer.

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39. Badihi,Avner, Packaged integrated circuits and methods of producing thereof.

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40. Son,Ho Sung; Bae,Sung Ryoul; Nam,Dong Kyun, Photodiode and method of manufacturing the same.

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41. Syri, Erich; Gruendler, Gerold; Hoegerl, Juergen; Killer, Thomas; Strutz, Volker, Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape.

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42. Honer, Kenneth Allen, Sequential fabrication of vertical conductive interconnects in capped chips.

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43. Enomoto, Tadashi, Solid state image pickup device having light conversion lens formed on a strip layer.

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44. Takao, Hiroaki, Solid state imaging device and manufacturing method thereof.

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45. Kochi Tetsunobu,JPX ; Sugawa Shigetoshi,JPX ; Ueno Isamu,JPX ; Ogawa Katsuhisa,JPX ; Koizumi Toru,JPX ; Sakurai Katsuhito,JPX ; Hiyama Hiroki,JPX, Solid-state image pickup device.

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46. Kochi, Tetsunobu; Sugawa, Shigetoshi; Ueno, Isamu; Ogawa, Katsuhisa; Koizumi, Toru; Sakurai, Katsuhito; Hiyama, Hiroki, Solid-state image pickup device using layers having different refractive indices.

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47. Stark, David H., Wafer-level hermetic micro-device packages.

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48. Stark, David H., Wafer-level hermetic micro-device packages.

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