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Accelerometer with central mass in support 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/84
출원번호 US-0718523 (1991-06-21)
발명자 / 주소
  • Beringhause Steven (North Attleboro MA) Mandeville Raymond E. (Cumberland RI) Rolph
  • III W. Donald (East Walpole MA)
출원인 / 주소
  • Texas Instruments Incorporated (Dallas TX 02)
인용정보 피인용 횟수 : 46  인용 특허 : 0

초록

An accelerometer is shown with improved drop resistance for regulating automotive safety air-bag systems and the like. The device comprises a member of silicon semiconducting material having a central seismic mass mounted on a surrounding support by intervening beams, a pair of beams extending from

대표청구항

An accelerometer comprising: a member of silicon semiconducting material having a central mass having a support disposed in a plane around the mass, having two spaced-apart portions of each of four rectilinearly disposed sides of the mass connected to the support by intervening beams, and having all

이 특허를 인용한 특허 (46)

  1. Machida,Atsushi; Yamada,Sumio; Tanaka,Hiroshi; Aizawa,Hisanori; Nagata,Kenji; Miyashita,Tsutomu; Ishikawa,Hiroshi, Acceleration sensor.
  2. Yasuo Yamaguchi JP; Kunihiro Nakamura JP; Shiro Yamasaki JP; Teruya Fukaura JP, Acceleration sensor and method of manufacturing the same.
  3. Adams, Scott G.; Davis, Tim, Boundary isolation for microelectromechanical devices.
  4. MacDonald Noel C. (Ithaca NY) Bertsch Fred M. (Ithaca NY) Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY), Capacitance based tunable micromechanical resonators.
  5. Masahito Mizukoshi JP, Dynamical quantity sensor.
  6. Mizukoshi Masahito,JPX, Dynamical quantity sensor.
  7. Adams, Scott; Davis, Tim; Miller, Scott; Shaw, Kevin; Chong, John Matthew; Lee, Seung Bok (Chris), Electrostatic actuator for micromechanical systems.
  8. Hao, Zhili; Ayazi, Farrokh, High-Q longitudinal block resonators with annexed platforms for mass sensing applications.
  9. Davis, Timothy J.; Adams, Scott G., Integrated large area microstructures and micromechanical devices.
  10. Takeuchi, Yukihisa; Ohnishi, Takao; Kimura, Koji, Mass sensor and mass sensing method.
  11. Takeuchi, Yukihisa; Ohnishi, Takao; Kimura, Koji, Mass sensor and mass sensing method.
  12. Takeuchi,Yukihisa; Ohnishi,Takao; Kimura,Koji, Mass sensor and mass sensing method.
  13. Burns David W. ; Frische Richard H., Mechanical resonance, silicon accelerometer.
  14. Deng, Ken Kan, Method and apparatus for sensing signals.
  15. Deng, Ken Kan, Method and apparatus for sensing underwater signals.
  16. Chong, John M.; Waldrop, Paul; Davis, Tim; Adams, Scott, Method of fabricating semiconductor wafers having multiple height subsurface layers.
  17. Martin, John R.; Roberts, Carl M., Methods for packaging and sealing an integrated circuit die.
  18. Bowers, John Edward; Helkey, Roger Jonathan; Corbalis, Charles; Sink, Robert Kehl; Lee, Seung Bok; MacDonald, Noel, Micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same.
  19. Galvin Gregory J. ; Davis Timothy J. ; MacDonald Noel C., Microelectromechanical accelerometer for automotive applications.
  20. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  21. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  22. Helkey, Roger Jonathan, Micromachined apparatus for improved reflection of light.
  23. Helkey, Roger Jonathan, Micromachined apparatus for improved reflection of light.
  24. Helkey, Roger Jonathan, Micromachined apparatus for improved reflection of light.
  25. MacDonald Noel C. ; Shaw Kevin A. ; Adams Scott G., Micromechanical accelerometer for automotive applications.
  26. Werner Wolfgang,DEX, Micromechanical device and method for its production.
  27. Werner Wolfgang,DEX, Micromechanical sensor device.
  28. Adams Scott G. ; Wang Yongmei Cindy ; Macdonald Noel C. ; Thorp James S., Multistable tunable micromechanical resonators.
  29. Helkey, Roger Jonathan; Koenig, Herbert Paul; Bowers, John Edward; Sink, Robert Kehl, Optical switch having mirrors arranged to accommodate freedom of movement.
  30. Martin John R. ; Roberts ; Jr. Carl M., Package for sealing an integrated circuit die.
  31. Martin, John R.; Roberts, Jr., Carl M., Package for sealing an integrated circuit die.
  32. Martin, John R.; Roberts, Jr., Carl M., Package for sealing an integrated circuit die.
  33. Martin,John R.; Roberts, Jr.,Carl M., Package for sealing an integrated circuit die.
  34. Swanson Gregory D. (Indianapolis IN), Piezoresistive force rebalance accelerometer.
  35. Wilner, Leslie Bruce; Kwa, Tom, Proof mass for maximized, bi-directional and symmetric damping in high g-range acceleration sensors.
  36. Hajduk, Damian; Carlson, Eric; Srinivasan, Ravi, Rheometer for rapidly measuring small quantity samples.
  37. Hartauer Siegbert (Landshut DEX), Semiconductor device with force and/or acceleration sensor.
  38. Seto,Masami, Semiconductor sensor.
  39. Katsumichi Ueyanagi JP; Mutsuo Nishikawa JP; Mitsuo Sasaki JP, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  40. Katsumichi Ueyanagi JP; Mutsuo Nishikawa JP; Mitsuo Sasaki JP, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  41. Ueyanagi Katsumichi,JPX ; Nishikawa Mutsuo,JPX ; Sasaki Mitsuo,JPX, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  42. Ueyanagi, Katsumichi; Nishikawa, Mutsuo; Sasaki, Mitsuo, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  43. Ueyanagi, Katsumichi; Nishikawa, Mutsuo; Sasaki, Mitsuo, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  44. Ueyanagi, Katsumichi; Nishikawa, Mutsuo; Sasaki, Mitsuo, Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor.
  45. Ip Matthew W., Sensor structure with L-shaped spring legs.
  46. Chong, John; Lee, Seung Bok; MacDonald, Noel; Lewis, Robert; Hunt, Peter, Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same.
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