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Dielectric medium for capacitor of semiconductor device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-027/02
  • H01L-029/04
출원번호 US-0637314 (1991-01-03)
우선권정보 KR-0009966 (1990-07-02)
발명자 / 주소
  • Lee Sangin (Suwon KRX)
출원인 / 주소
  • Samsung Electronics Co., Ltd. (Kwonseon KRX 03)
인용정보 피인용 횟수 : 74  인용 특허 : 0

초록

A dielectric medium for the capacitor of a semiconductor device is disclosed. The dielectric material is prepared by replacing Sr and Ba in (Sr, Ba)Nb2O6 with La, and the replacement is carried out by adding 2 mole % or more of La2O3 to (Sr,Ba)Nb2O6, thereby forming a composition (SrxBa1-x)1-(3/2)yL

대표청구항

A dielectric medium for the capacitor of semiconductor device, comprising a composition of (SrxBa1-x)1-(3/2)yLayNb2O6(0.25≤x≤0.5, 0.04≤y).

이 특허를 인용한 특허 (74)

  1. Radosavljevic,Marko; Majumdar,Amlan; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark L.; Brask,Justin K.; Shah,Uday; Datta,Suman; Chau,Robert S., Block contact architectures for nanoscale channel transistors.
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  27. Hayashi, Shinichiro; Joshi, Vikram; Solayappan, Narayan; Cuchiaro, Joseph D.; Paz de Araujo, Carlos A., Method for forming an integrated circuit.
  28. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  29. Brask,Justin K.; Doyle,Brian S.; Kavalleros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Method of forming a metal oxide dielectric.
  30. Brask, Justin K.; Doyle, Brian S.; Kavalieros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material.
  31. Doyle,Brian S.; Datta,Suman; Kavalieros,Jack T.; Majumdar,Amlan, Method of ion implanting for tri-gate devices.
  32. Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Chau, Robert S., Method of patterning a film.
  33. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
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  38. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Datta,Suman; Jin,Been Yih, Nonplanar device with stress incorporation layer and method of fabrication.
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  40. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
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  46. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
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  50. Brask,Justin K.; Doyle,Brian S.; Doczy,Mark L.; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
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  53. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  54. Cuchiaro Joseph D. ; Joshi Vikram ; DaCruz Claudia P. ; McNelis John M. ; Paz de Araujo Carlos A., Process for making an integrated circuit with high dielectric constant barium-strontium-niobium oxide.
  55. Kwon Hong KR; Yong-Sik Yu KR, Semiconductor device having a ferroelectric capacitor and method for the manufacture thereof.
  56. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
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  70. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman; Hareland,Scott A., Tri-gate devices and methods of fabrication.
  71. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  72. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  73. Chau,Robert; Datta,Suman; Doyle,Brian S; Jin,Been Yih, Tri-gate transistors and methods to fabricate same.
  74. Shaheen, Mohamad A.; Rachmady, Willy; Tolchinsky, Peter, Ultra-thin oxide bonding for S1 to S1 dual orientation bonding.
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