[특허]Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th

Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01B-007/14 G01R-027/26 B24B-049/04 H01L-021/306
출원번호	US-0525352 (1990-05-16)
발명자 / 주소	Leach Michael A. (South Burlington VT) Machesney Brian J. (Burlington VT) Nowak Edward J. (Essex Junction VT)
출원인 / 주소	International Business Machines Corp. (Armonk NY 02)
인용정보	피인용 횟수 : 35 인용 특허 : 0

초록 ▼

The present invention relates to a method and apparatus for remotely detecting impedance. It is specifically adapted for use on a polishing machine wherein the end point of polishing for removing a surface layer during the processing of semiconductor substrates is detected. A first, or stationary coil having a high permeability core is wound having an air gap and an AC voltage is applied to the stationary coil to provide a magnetic flux in the air gap. A second coil is mounted for rotation on the polishing table, in a position to periodically pass through the air gap of the stationary coil as the table rotates. The second coil is connected at its opposite ends to contacts which are embedded in the surface of the polishing wheel. The contacts are positioned to engage the surface of the substrate which is being polished and provide a load on the second or rotating coil. The rotating coil, when it is in the air gap of the stationary coil, will perturb the flux field therein as a function of the resistance of the load caused by the contacts contacting either a conducting surface or a non-conducting surface. This perturbance of the flux field is measured as a change in the induced voltage in the stationary coil which in turn is converted to a signal which is processed to indicate the end point of polishing, the end point being when a metallic layer has been removed to expose a dielectric layer therebeneath or, conversely, when a dielectric layer has been removed to expose a metallic layer therebeneath.

대표청구항 ▼

A method of measuring changes in impedance of a variable impedance load, comprising the steps of: providing a first circuit including a first core having ends which oppose each other and which are separated by an air gap, a first coil wound around said first core, and a current source connected electrically in parallel across said first coil to energize said first coil and induce a magnetic flux density within said air gap; providing a second circuit including a second core, a second coil wound around said second core, and an electrical contact closure connected electrically in parallel across said second coil; disposing said second coil within said air gap; alternatively opening and closing said electrical contact closure to provide said variable impedance load to vary the magnetic flux density within said air gap; and measuring said varied magnetic flux density.

이 특허를 인용한 특허 (35)

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Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
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Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
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Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
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Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
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Nikolenko, Yury; Fauss, Matthew, Apparatus and method of using impedance resonance sensor for thickness measurement.
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Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.
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Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Block for polishing a wafer during manufacture of integrated circuits.
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Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
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Rostoker, Michael D., Detecting the endpoint of chem-mech polishing, and resulting semiconductor device.
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Chen Lai-Juh (Hsin-Chu TWX), Electrochemical simulator for chemical-mechanical polishing (CMP).
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Nikolenko, Yury, Impedance resonance sensor for real time monitoring of different processes and methods of using same.
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Kesil, Boris; Nikolenko, Yury, Impedance sensing systems and methods for use in measuring constituents in solid and fluid objects.
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Li Leping ; Barbee Steven George ; Halperin Arnold ; Heinz Tony Frederick, In-situ monitoring and control of conductive films by detecting changes in induced eddy currents.
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Li Leping ; Barbee Steven George ; Halperin Arnold ; Heinz Tony Frederick, In-situ monitoring of the change in thickness of films.
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Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
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Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
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Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
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Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
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Mei Len,TWX, Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping.
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Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
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Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
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Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.
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Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.
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Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.
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Draaisma Eeltje A.,NLX ; Neerhof Hendrik A. J.,NLX, Method of manufacturing a thin-film magnetic head.
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Nikolenko, Yury, NMR spectroscopy device based on resonance type impedance (IR) sensor and method of NMR spectra acquisition.
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Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
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Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
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Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
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Cullen, John J A; Chong, Ellis F H; Langley, Felix L, Rotary transformer.
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Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
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Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
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Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
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Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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연합인증

Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th 원문보기

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Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within th 원문보기

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이 특허를 인용한 특허 (35)

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