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Housing structure for housing a plurality of electric components

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0687734 (1991-04-19)
우선권정보 JP-0103120 (1990-04-20)
발명자 / 주소
  • Ohmori Akimitsu (Tokorozawa JPX)
출원인 / 주소
  • Kabushiki Kaisha Toshiba (Kawasaki JPX 03)
인용정보 피인용 횟수 : 52  인용 특허 : 0

초록

A housing structure for housing a plurality of electric components includes a skeleton frame, an air intake section, an air exhaust section, an air passage section, a plurality of electric component housing bodies, and a confluence preventing member. The skeleton frame has a polyhedron space defined

대표청구항

A housing structure for housing a plurality of electric components comprising: a skeleton frame member having a hexahedron space defined therein; a plurality of panels, disposed on said skeleton frame member, for providing the skeleton frame member with a front panel, a rear panel, a pair of side pa

이 특허를 인용한 특허 (52)

  1. Mumper, Robert Walters, Air cooling system for an electronics rack.
  2. Campbell,Levi A.; Chu,Ricahrd C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region.
  3. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region.
  4. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region.
  5. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Apparatus including processor.
  6. Gravell, Anthony R.; Barlow, Richard J., Balanced flow cooling.
  7. Kenichi Wakabayashi JP; Chitoshi Takayama JP; Tadashi Shiozaki JP, Cartridge for electronic devices.
  8. Wakabayashi Kenichi,JPX ; Takayama Chitoshi,JPX ; Shiozaki Tadashi,JPX, Cartridge for electronic devices.
  9. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
  10. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
  11. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
  12. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
  13. Shearman, Simon John Edward; Mayenburg, Anthony, Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages.
  14. Sonobe,Hideki; Hirafuji,Kazuo; Nakagawa,Yoshihisa, Communication apparatus and rack structure.
  15. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer chassis for dual offset opposing main boards.
  16. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer rack cooling system.
  17. Coglitore,Giovanni; Gallo,Nikolai; Randall,Jack, Computer rack cooling system.
  18. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  19. Nishiyama,Shinichi; Morishita,Yasuji; Katakura,Yasuyuki; Okabe,Youji; Maeda,Tadaharu, Cooling structure for electronic devices.
  20. Scafidi Christopher J. ; Pierce David J., Electronic component cooling system.
  21. Nagata, Hideo; Takamoto, Junji; Hori, Yuji, Electronic equipment and television game machine having heat radiation structure.
  22. Straznicky, Ivan; Ratliff, William Edward, Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module.
  23. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  24. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  25. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  26. Giovanni Coglitore ; Nikolai Gallo ; Jack Randall, High density computer equipment storage system.
  27. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage systems.
  28. Mayenburg, Anthony J.; Shearman, Simon J. E.; Bishop, Michael; Tabatchnik, Michael; Cosman, Lloyd, High density networking shelf and system.
  29. Mayenburg, Anthony J.; Shearman, Simon J. E.; Bishop, Michael; Tabatchnik, Michael; Cosman, Lloyd, High density networking shelf and system.
  30. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Information processing device.
  31. Modica, Steve, Method and rack for exchanging air with modular bricks in a computer system.
  32. Sharma, Viswa N.; Chu, William; James, Allen D.; Tseng, Ming Siu; Schlegel, Neil; Lentz, David; Sonnek, Christopher D., Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards.
  33. Sharma, Viswa; Holschbach, Roger; Stuck, Bart; Chu, William, Omni-protocol engine for reconfigurable bit-stream processing in high-speed networks.
  34. Cunningham James J. (Hamilton Square NJ) Muzikant Boris (Pipersville PA) Reznik Solomon (North Wales PA), Panel mounted cooling system.
  35. Smith Grant M. ; Klein Peter P., Passively cooled display door.
  36. Coglitore, Giovanni, Portion of a bank of computer chassis mounted to rack bars.
  37. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Printer apparatus.
  38. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Processing device.
  39. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Processor apparatus.
  40. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  41. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  42. Sharma, Viswa N.; Ketchum, Breton A., Shelf management controller with hardware/software implemented dual redundant configuration.
  43. Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
  44. Nishiyama, Shinichi; Miyamoto, Kenichi; Tanaka, Shigeaki, Storage apparatus.
  45. Katakura, Yasuyuki; Kobayashi, Toru, Storage control device.
  46. Katakura,Yasuyuki; Miyamoto,Kenichi, Storage control device.
  47. French,F. William; Nigro, Jr.,Arthur Robert, Techniques for cooling a set of circuit boards within a rack mount cabinet.
  48. French,F. William; Nigro, Jr.,Arthur Robert, Techniques for cooling a set of circuit boards within a rack mount cabinet.
  49. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James A.; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore G., Techniques for data center cooling.
  50. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James Andrew; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore Gerard, Techniques for data center cooling.
  51. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James Andrew; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore Gerard, Techniques for data center cooling.
  52. Knoop Franz-Josef,DEX ; Schmidt Heinrich,DEX, Ventilation system for cabinets with electronic functional units which produce considerable heat.
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