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|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||228/219 ; 228/222 ; 228/42 ; 219/399|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 9 인용 특허 : 0|
A reflow soldering method and the apparatus thereof is described for soldering a base board having electronic elements located thereon by an inert gas circulated through heater means in a plurality of chambers while the base board is transported through all the chambers, the inert gas being circulated by ventilating means driven by drive means, the method and the apparatus thereof comprising a shield case for enclosing at least the chambers, the ventilating means and the drive means to shut off the same from an outer air and refrigerating means for cooli...
A reflow soldering method for circulating an inert gas through heater means by ventilating means in a plurality of chambers to thereby solder a base board having electronic elements located thereon while the base board is transported through all the chambers, the ventilating means being driven by drive means, said reflow soldering method comprising the steps of: enclosing at least said chambers, said ventilating means and said drive means by means of a shield case to isolate same from ambient air; filling said shield case with said inert gas; and cooling...