이 특허를 인용한 특허 (98)

1. Huh Dong-Chul,KRX ; Jung Chang-Yong,KRX, Apparatus and method for cleaning semiconductor devices without leaving water droplets.

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2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.

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3. Puskas William L., Apparatus and methods for cleaning and/or processing delicate parts.

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4. Puskas William L., Apparatus and methods for cleaning and/or processing delicate parts.

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5. Puskas William L., Apparatus and methods for cleaning and/or processing delicate parts.

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6. Puskas, William L., Apparatus and methods for cleaning and/or processing delicate parts.

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7. Puskas, William L., Apparatus and methods for cleaning and/or processing delicate parts.

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8. William L. Puskas, Apparatus and methods for cleaning and/or processing delicate parts.

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9. Jur, Jesse Stephen; McCullough, Kenneth J.; Moreau, Wayne Martin; Simons, John Patrick; Taft, Charles Jesse, Apparatus and process for supercritical carbon dioxide phase processing.

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10. Jur, Jesse Stephen; McCullough, Kenneth J.; Moreau, Wayne Martin; Simons, John Patrick; Taft, Charles Jesse, Apparatus and process for supercritical carbon dioxide phase processing.

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11. Erk Henry F. (St. Louis MO) Bartram Ronald D. (Webster Groves MO) Hollander Eugene R. (Wentzville MO) Chai Jing (St. Charles MO), Apparatus for cleaning semiconductor wafers.

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12. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.

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13. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.

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14. Puskas, William L., Apparatus, circuitry and methods for cleaning and/or processing with sound waves.

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15. Puskas,William L., Apparatus, circuitry, signals and methods for cleaning and/or processing with sound.

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16. Puskas, William L., Apparatus, circuitry, signals, probes and methods for cleaning and/or processing with sound.

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17. Puskas,William L., Apparatus, circuitry, signals, probes and methods for cleaning and/or processing with sound.

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18. Olesen Michael B. ; Bran Mario E., Centrifugal wafer processor and method.

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19. Kamikawa, Yuji, Cleaning and drying method and apparatus.

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20. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Anderson ; Sr. John H. ; Nowell Jeffrey, Cleaning and drying photoresist coated wafers.

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21. Katsumata, Kazuhiko; Mitsuzuka, Masatoshi; Sakamoto, Osamu; Nagata, Takahiro, Cleaning apparatus.

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22. Kobayashi Kanji,JPX ; Yamaguchi Masao,JPX ; Yoshihara Shinya,JPX ; Kubota Toshio,JPX ; Kudo Jun,JPX, Cleaning apparatus and method.

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23. Kobayashi Kanji,JPX ; Yamaguchi Masao,JPX ; Yoshihara Shinya,JPX ; Kubota Toshio,JPX ; Kudo Jun,JPX, Cleaning apparatus and method.

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24. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.

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25. Hartmann, Christoph; Worm, Sven, Device for cleaning substrates on a carrier.

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26. Kundalgurki,Srivatsa, Enhanced megasonic based clean using an alternative cleaning chemistry.

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27. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.

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28. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.

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29. Jones, William D., High pressure fourier transform infrared cell.

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30. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.

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31. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.

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32. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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33. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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34. Scotto Alain,FRX ; Janin Jean Louis,FRX, Immersed metal cleaning by subjecting object to natural resonant frequency.

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35. Stavenga, Marco Koert; Jansen, Hans; Wanten, Peter Franciscus; Cuijpers, Johannes Wilhelmus Jacobus Leonardus; Beeren, Raymond Gerardus Marius, Lithographic apparatus and lithographic apparatus cleaning method.

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36. Bhushan Rajiv ; Chang Ru ; Mohindra Raj ; Chiu Vincent ; Tran Dong T., Mandrel device and method for hard disks.

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37. Yin, Yaobo; Jiang, Linda (Tong), Megasonic precision cleaning of semiconductor process equipment components and parts.

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38. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.

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39. Mohindra Raj ; Wong David C. ; Puri Suraj, Method and apparatus for cleaning wafers using multiple tanks.

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40. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.

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41. Ohsawa Tadayasu,JPX ; Kurauchi Hiromitsu,JPX, Method and apparatus for drying substrate.

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42. Ottow,Stefan; Welzel,Martin; Wissel,Dan, Method and apparatus for measuring and controlling the water content of a water-containing liquid mixture.

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43. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.

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44. Boyd,John M.; Ravkin,Michael; Redecker,Fred C., Method and apparatus to decouple power and cavitation for megasonic cleaning applications.

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45. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.

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46. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.

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47. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.

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48. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.

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49. Branco, Walter G.; Qiao, Jianmiu, Method for cleaning plasma etch chamber structures.

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50. Yasushi Sasaki JP, Method for drying a semiconductor wafer, a mixture for drying, and a dryer.

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51. Ohsawa Tadayasu,JPX ; Kurauchi Hiromitsu,JPX, Method for drying substrate.

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52. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.

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53. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.

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54. Kenji Yamagata JP; Satoshi Matsumura JP, Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate.

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55. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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56. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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57. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.

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58. Alan E. Walter, Methods for treating objects.

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59. Walter Alan E., Methods for treating objects.

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60. Puskas,William, Multi-generator system for an ultrasonic processing tank.

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61. Puskas William L., Multiple frequency cleaning system.

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62. Puskas, William L., Multiple frequency cleaning system.

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63. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.

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64. Yang Ming-Sheng,TWX ; Wu Juan-Yuan,TWX ; Lur Water,TWX, Post-CMP wafer clean process.

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65. Malcolm R. Schuler ; Robert F. Longenberger ; Rodney S. Ridley ; Thomas E. Grebs ; Jason R. Trost ; Raymond J. Webb ; Michael A. Caravaggio ; Terry L. Fenstermacher, Potted transducer array with matching network in a multiple pass configuration.

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66. Schuler Malcolm R. ; Longenberger Robert F. ; Ridley Rodney S. ; Grebs Thomas E. ; Trost Jason R. ; Webb Raymond J. ; Caravaggio Michael A. ; Fenstermacher Terry L., Potted transducer array with matching network in a multiple pass configuration.

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67. Puskas William L., Power system for impressing AC voltage across a capacitive element.

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68. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.

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69. Puskas,William L., Probe system for ultrasonic processing tank.

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70. Wuester,Christopher D., Process flow thermocouple.

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71. Jur, Jesse Stephen; McCullough, Kenneth J.; Moreau, Wayne Martin; Simons, John Patrick; Taft, Charles Jesse, Process for cleaning a workpiece using supercritical carbon dioxide.

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72. Dittmer Eckhard,DEX ; Schluttig Alexander,DEX, Process for regenerating catalytic converters.

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73. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.

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74. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.

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75. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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76. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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77. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.

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78. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.

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79. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.

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80. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning method.

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81. Michael B. Olesen ; Mario E. Bran, Semiconductor wafer cleaning system.

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82. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.

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83. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.

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84. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.

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85. Malcolm R. Schuler ; Rodney S. Ridley ; Thomas E. Grebs, Simplified ozonator for a semiconductor wafer cleaner.

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86. Oshinowo John,DEX, Substrate treatment device.

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87. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.

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88. Puskas William L., Systems and methods for ultrasonically processing delicate parts.

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89. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.

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90. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.

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91. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Anderson ; Sr. John H. ; Nowell Jeffrey, Ultra-low particle semiconductor cleaner.

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92. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Anderson ; Sr. John H. ; Nowell Jeffrey, Ultra-low particle semiconductor cleaner.

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93. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Wong David, Ultra-low particle semiconductor cleaner using heated fluids.

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94. Puskas William L., Ultrasonic transducer with bias bolt compression bolt.

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95. Puskas William L., Ultrasonic transducer with epoxy compression elements.

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96. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.

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97. Elsawy Tamer ; Hall R. Mark ; Butler Josh, Vapor drying system and method.

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98. Lawson Margaret Jane (Poughkeepsie NY) Leonard Edward Joseph (Milton VT) Nansen Jon Howard (Clinton Corners NY), Vapor rinse-vapor dry processing tool.

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