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Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suc 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/56
  • H01L-021/58
  • H01L-021/60
  • H01L-021/603
출원번호 US-0786205 (1991-10-31)
발명자 / 주소
  • McShane Michael B. (Austin TX) Casto James J. (Austin TX) Joiner Bennett A. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 52  인용 특허 : 0

초록 ▼

A method for making a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounting surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has

대표청구항 ▼

A method for making an encapsulated thermally enhanced semiconductor device, comprising the steps of: providing a leadframe having a semiconductor die attached to a mounting surface of the leadframe; providing a heat sink having an opening therein which extends through the heat sink; positioning the

이 특허를 인용한 특허 (52)

  1. Leonard E. Mess, Ball grid array (BGA) encapsulation mold.
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  2. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
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  3. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  4. Jeong Tae Sung,KRX ; Ryu Ki Tae,KRX ; Lee Tae Keun,KRX ; Choi Keun Hyoung,KRX ; Youn Han Shin,KRX ; Park Jum Sook,KRX, Ball grid array package.
    상세보기
  5. Kao, Huahung; Liou, Shiann Ming, Drop-in heat sink and exposed die-back for molded flip die package.
    상세보기
  6. Mess, Leonard E., Encapsulation method in a molding machine for an electronic device.
    상세보기
  7. Eslamy Mohammad ; Jacobsen Larry L., Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process.
    상세보기
  8. Joshi, Rajeev; Tangpuz, Consuelo N.; Manatad, Romel N., Flip chip in leaded molded package and method of manufacture thereof.
    상세보기
  9. Joshi, Rajeev; Tangpuz, Consuelo N.; Manatad, Romel N., Flip chip in leaded molded package and method of manufacture thereof.
    상세보기
  10. Joshi,Rajeev; Tangpuz,Consuelo N.; Manatad,Romel N., Flip chip in leaded molded package and method of manufacture thereof.
    상세보기
  11. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
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  12. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  13. Chiang Cheng-Lien,TWX, Lead frame having a detachable and interchangeable die-attach paddle.
    상세보기
  14. Thompson, Joseph B., Light emitting assemblies and portions thereof.
    상세보기
  15. Takase, Shinji; Kawakubo, Kazuki; Onishi, Yohei, Manufacturing method of optical electronic components and optical electronic components manufactured using the same.
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  16. Takase, Shinji; Kawakubo, Kazuki; Onishi, Yohei, Manufacturing method of optical electronic components and optical electronic components manufactured using the same.
    상세보기
  17. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
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  18. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
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  19. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  20. Brand,Joseph M., Method and apparatus for removing encapsulating material from a packaged microelectronic device.
    상세보기
  21. Coico, Patrick A.; Edwards, David L.; Indyk, Richard F.; Long, David C., Method and structure to improve thermal dissipation from semiconductor devices.
    상세보기
  22. Jeng Jian Dih,TWX ; Wang Hsing Seng,TWX, Method for assembling a heat sink to a die paddle.
    상세보기
  23. Katoh, Yoshitsugu; Abe, Mitsuo; Ikemoto, Yoshihiko; Hosoyamada, Sumikazu, Method for making semiconductor device.
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  24. Baumann Helmut (Gomaringen DEX), Method for producing a component according to the anodic bonding method and component.
    상세보기
  25. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  26. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
    상세보기
  27. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
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  28. Sato, Yuko, Method of manufacturing a semiconductor device and molding die.
    상세보기
  29. Takase, Shinji; Kawakubo, Kazuki; Onishi, Yohei, Method of resin-sealing and molding an optical device.
    상세보기
  30. Ashida, Takeshi, Method transparent member, optical device using transparent member and method of manufacturing optical device.
    상세보기
  31. Leonard E. Mess, Methods for ball grid array (BGA) encapsulation mold.
    상세보기
  32. Bolken, Todd O., Microelectronic devices and microelectronic die packages.
    상세보기
  33. Levine, Robert B.; Horst, Geoffrey P.; LeBrun, Jeffrey R., Modulation of plant immune system function.
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  34. Takase, Shinji; Kawakubo, Kazuki; Onishi, Yohei, Optical electronic component.
    상세보기
  35. Lee, Jae-Seob; Jin, Dong-Un, Organic light emitting diode display and method of manufacturing the same.
    상세보기
  36. Lim, Ken Beng; Toong, Teik Tiong, Package having spaced apart heat sink.
    상세보기
  37. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
    상세보기
  38. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
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  39. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  40. Tanaka Sueyoshi (Fukuoka JPX) Sakakibara Zyunzi (Fukuoka JPX) Tsutsumi Yasutsugu (Fukuoka JPX), Plastic molding method for semiconductor devices.
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  41. Jeserer, Gunther; Varol, Efe, Plunger for holding and moving electrical components.
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  42. Schaule, Max; Thiel, Stefan; Pichl, Franz; Jeserer, Günther; Wiesböck, Andreas; Bauer, Alexander, Plunger for holding and moving electronic components in particular ICS.
    상세보기
  43. Shimizu, Kazuo; Tsuruta, Hisayuki, Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies.
    상세보기
  44. Schneider Mark R., Powder metal heat sink for integrated circuit devices.
    상세보기
  45. Katoh, Yoshitsugu; Abe, Mitsuo; Ikemoto, Yoshihiko; Hosoyamada, Sumikazu, Semiconductor device having a heat spreading plate.
    상세보기
  46. Sono Michio (Kawasaki JPX) Saito Kouji (Kawasaki JPX) Takenaka Masashi (Kawasaki JPX) Yoshimoto Masanori (Kawasaki JPX), Semiconductor device having radiator structure.
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  47. Tomita Yoshihiro,JPX, Semiconductor device including a heat radiation plate.
    상세보기
  48. Kiritani, Mika, Semiconductor resin molding method.
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  49. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
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  50. Yang,Ching Hsu, Thermal enhance package with universal heat spreader.
    상세보기
  51. Dunaway Thomas J. ; Cullinan Deborah A., Vacuum die bond for known good die assembly.
    상세보기
  52. Li, Zong-Fu; Sengupta, Kabul; Thompson, Deborah L., Windowed non-ceramic package having embedded frame.
    상세보기

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