[특허]Shielded low-profile electronic component assembly

Shielded low-profile electronic component assembly 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-009/00 H01L-023/02 H01L-023/28
출원번호	US-0594448 (1990-10-09)
발명자 / 주소	Guzuk Andrzej T. (Pompano Beach FL) Roshitsh Todd W. (No. Lauderdale FL) Engstrom Scott M. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL)
출원인 / 주소	Motorola, Inc. (Schaumburg IL 02)
인용정보	피인용 횟수 : 89 인용 특허 : 0

초록 ▼

A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112. In a third embodiment the metallized shield is slightly smaller in area than the substrate 124 and is attached at each of the four ground pads 114, with the shield edges 204 resting on substrate 124.

대표청구항 ▼

An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern: the electronic component affixed to the one major surface of said electronic component carrier. the electronic component being encapsulated with encapsulant material substantially covering the electronic component; and a metallized shield attached to the ground pad pattern and substantially covering the electronic component.

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Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone.
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Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
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Minervini, Anthony D., Top port multi-part surface mount silicon condenser microphone package.
상세보기
Minervini, Anthony D., Top port surface mount MEMS microphone.
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Minervini, Anthony D., Top port surface mount MEMS microphone.
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Minervini, Anthony D., Top port surface mount silicon condenser microphone package.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Shielded low-profile electronic component assembly 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (89)

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연합인증

Shielded low-profile electronic component assembly 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (89)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

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