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Integrated circuit package with laminated backup cell

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/16
  • H01L-023/48
  • H01L-029/44
  • H01L-029/60
출원번호 US-0736412 (1991-07-26)
발명자 / 주소
  • McCain Joseph H. (Plano TX)
출원인 / 주소
  • SGS-Thomson Microelectronics, Inc. (Carrollton TX 02)
인용정보 피인용 횟수 : 64  인용 특허 : 0

초록

An integrated circuit package encapsulates a memory chip and a laminated backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a device su

대표청구항

An electronic circuit package comprising, in combination: a body of insulating material; a lead frame assembly encapsulated within said body of insulating material, said lead frame assembly including multiple conductive finger leads and a device support plate; an electronic circuit device mounted on

이 특허를 인용한 특허 (64)

  1. Matsuzaki Kazuo,JPX, Battery mounted integrated circuit device.
  2. Mayya, Subramanya; Kim, Hee-seok; Kim, Ik-Soo; Park, Min-Young; Kwon, Hyun-Suk, Data storage device having self-powered semiconductor device.
  3. Zhang, Hongmei; Demaray, Richard E., Deposition of LiCoO2.
  4. Gerber Mark A., Electrical contact clip.
  5. Tuttle, John R., Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication.
  6. Snyder, Shawn W.; Neudecker, Bernd J., Electrochemical apparatus with barrier layer protected substrate.
  7. Snyder, Shawn W.; Neudecker, Bernd J., Electrochemical apparatus with barrier layer protected substrate.
  8. Snyder, Shawn W.; Neudecker, Bernd J., Electrochemical apparatus with barrier layer protected substrate.
  9. Snyder, Shawn W.; Neudecker, Bernd J., Electrochemical apparatus with barrier layer protected substrate.
  10. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
  11. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component including conductor connected to electrode and anodically bonded to insulating coating.
  12. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with a lead frame and insulating coating.
  13. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with an insulating coating.
  14. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Electronic component with anodically bonded contact.
  15. Brantner, Paul C., Energy device with integral collector surface for electromagnetic energy harvesting and method thereof.
  16. Brantner, Paul C., Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof.
  17. Keating, Joseph A.; Bradow, Timothy N.; Johnson, Raymond R.; Narayan, Prativadi B., Environmentally-powered wireless sensor module.
  18. Kramer,Bradley Allen, Expeditious and low cost testing of RFID ICs.
  19. Neudecker, Bernd J.; Snyder, Shawn W., Hybrid thin-film battery.
  20. Neudecker, Bernd J.; Snyder, Shawn W., Hybrid thin-film battery.
  21. Hundt, Michael J.; Du, Haibin; Kelappan, Krishnan; Sigmund, Frank, Integrated circuit package including embedded thin-film battery.
  22. McCain,Joseph, Integrated circuit package with laminated power cell having coplanar electrode.
  23. Lauffer John M. ; Marcello Heike ; Russell David J., Laminate substrate having joining layer of photoimageable material.
  24. Snyder, Shawn W.; Brantner, Paul C.; Zoetewey, Henry L., Masking of and material constraint for depositing battery layers on flexible substrates.
  25. Snyder, Shawn W.; Neudecker, Bernd J.; Brantner, Paul C., Metal film encapsulation.
  26. Snyder, Shawn W.; Neudecker, Bernd J.; Brantner, Paul C., Metal film encapsulation.
  27. Neudecker, Bernd J.; Whitacre, Jay F., Method for sputter targets for electrolyte films.
  28. Eskildsen, Steven R.; Mills, Duane R., Method for using an in package power supply to supply power to an integrated circuit and to a component.
  29. Lauffer, John M.; Marcello, Heike; Russell, David J., Method of forming a chip carrier by joining a laminate layer and stiffener.
  30. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  31. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  32. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  33. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  34. Tuttle Mark E. ; Tuttle John R. ; Lake Rickie C., Method of manufacturing an enclosed transceiver.
  35. Tuttle, Mark E.; Tuttle, John R.; Lake, Rickie C., Method of manufacturing an enclosed transceiver.
  36. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Method of manufacturing ball grid array electronic component.
  37. Takahashi Yoshiharu,JPX ; Shinohara Toshiaki,JPX, Method of manufacturing the electronic using the anode junction method.
  38. Tuttle,Mark E.; Lake,Rickie C., Methods for forming integrated circuits within substrates.
  39. McCain, Joseph H., Microelectronic device with integrated energy source.
  40. McCain, Joseph H., Microelectronic device with integrated energy source.
  41. McCain, Joseph H., Microelectronic device with integrated energy source.
  42. Tuttle John R., Miniature Radio Frequency Transceiver.
  43. Brantner, Paul C.; Keating, Joseph A.; Johnson, Raymond R.; Bradow, Timothy N.; Narayan, Prativadi B.; Neudecker, Bernd J., Passive over/under voltage control and protection for energy storage devices associated with energy harvesting.
  44. Wohlgemuth, Christian; Thiele, Peter, Pressure sensor with a closed cavity containing an inert filling medium.
  45. Neudecker, Bernd J.; Keating, Joseph A., Printed circuit board with integrated thin film battery.
  46. Neudecker, Bernd J.; Keating, Joseph A., Printed circuit board with integrated thin film battery.
  47. Neudecker, Bernd J.; Keating, Joseph A., Printed circuit board with integrated thin film battery.
  48. Tuttle, John R., Radio frequency identification device and method.
  49. Tuttle, John R., Radio frequency identification device and method.
  50. Tuttle, John R., Radio frequency identification device and method.
  51. Snyder, Shawn W.; Brantner, Paul C.; Keating, Joseph A.; Bradow, Timothy N.; Narayan, Prativadi B.; Neudecker, Bernd J., Robust metal film encapsulation.
  52. Isa, Satoshi; Katagiri, Mitsuaki; Nagata, Kyoichi; Narui, Seiji, Semiconductor device.
  53. Neudecker, Bernd J.; Milonopoulou, Vassiliki, Sputtering target of Li3PO4 and method for producing same.
  54. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
  55. McCabe Arthur Barney ; Tuttle John R. ; Wood ; Jr. Clifton W., Tamper resistant smart card and method of protecting data in a smart card.
  56. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
  57. Tuttle John R. ; Wood ; Jr. Clifton W. ; McCabe Arthur Barney, Tamper resistant smart card and method of protecting data in a smart card.
  58. Johnson, Raymond R.; Snyder, Shawn W.; Brantner, Paul C.; Bradow, Timothy J.; Neudecker, Bernd J., Thin film battery on an integrated circuit or circuit board and method thereof.
  59. Neudecker, Bernd J., Thin film electrolyte for thin film batteries.
  60. Neudecker, Bernd J.; Snyder, Shawn W., Thin film encapsulation for thin film batteries and other devices.
  61. Neudecker, Bernd J.; Snyder, Shawn W., Thin film encapsulation for thin film batteries and other devices.
  62. Tuttle,John R., Thin flexible, RFID labels, and method and apparatus for use.
  63. Tuttle,John R., Thin, flexible, RFID label and system for use.
  64. Demaray, Richard E.; Narasimhan, Mukundan, Transparent conductive oxides.
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