[특허]Method for fabricating metal core layers for a multi-layer circuit board

Method for fabricating metal core layers for a multi-layer circuit board 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-003/02
출원번호	US-0731598 (1991-07-17)
발명자 / 주소	Brauer John M. (Binghamton NY) Christie Frederick R. (Endicott NY) Lawrence William H. (Greene NY) Mehta Ashit A. (Vestal NY) Reid Jonathan D. (Johnson City NY) Summa William J. (Endwell NY)
출원인 / 주소	International Business Machines (Armonk NY 02)
인용정보	피인용 횟수 : 68 인용 특허 : 0

초록 ▼

Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer. After lamination, one or more chips are attached to the completed package.

대표청구항 ▼

A method of fabricating a multilayer electronic circuit package, having at least one layer thereof comprising a polymer encapsulated metal core, which method comprises: a. providing a metal foil for the metal core of the layer; b. forming at least one hole in the metal foil; c. applying an adhesion promoter to the perforate metal foil for subsequent adhesion of polymer thereto; d. depositing a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the hole; e. thermally processing the dielectric polymer or precursor thereof to form a substantially uniform, conformal coating thereof on surfaces of the perforate metal foil; f. circuitizing the surface of the dielectric polymer to form a circuitized, polymer coated, metal core layer; and g. joining the circuitized, polymer coated, metal core layer to at least one other layer.

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Method for fabricating metal core layers for a multi-layer circuit board 원문보기

초록 ▼

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Method for fabricating metal core layers for a multi-layer circuit board 원문보기

초록 ▼

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연구과제 타임라인

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이 특허를 인용한 특허 (68)

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