$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Composite semiconductive thermoelectric refrigerating device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01V-001/30
출원번호 US-0603995 (1990-10-24)
우선권정보 CN-0108041 (1989-10-27)
발명자 / 주소
  • Wu Hong-ping (7 Wei Ying Yu Tong Xuan Wu Men Beijing CNX) Wang Ying-Ru (7 Wei Ying Yu Tong Xuan Wu Men Beijing CNX)
출원인 / 주소
  • Wu
  • Hong-Ping (Bejing CNX 05) Wang
  • Ying-Ru (Bejing CNX 05) Ferris
  • Michael (Montreal CAX 05) Wan
  • Shao-Hong (Bejing CNX 05) Chen
  • Xiao Q. (Bejing CNX 05)
인용정보 피인용 횟수 : 31  인용 특허 : 0

초록

A composite semiconductive thermoelectric refrigerating module comprises dozens or hundreds composite P-N couples which are electrically connected in series to form an array of required configuration which is fixed with electrical and thermal insulator and combined with the heat absorber and a therm

대표청구항

A composite semiconductor thermoelectric element for use in a thermoelectric module assembly for transfering heat between a hot and a cold junction, said element comprising two semiconductor layers of like type, each said layer having inner and outer surfaces and having interposed between said inner

이 특허를 인용한 특허 (31)

  1. Fleurial Jean-Pierre ; Caillat Thierry F. ; Borshchevsky Alexander, Advanced thermoelectric materials with enhanced crystal lattice structure and methods of preparation.
  2. Radhakrishnan, PraveenKumar, Electronic device including thermal sensor and peltier cooler and related methods.
  3. Fleurial Jean-Pierre (Pasadena CA) Caillat Thierry F. (Pasadena CA) Borshchevsky Alexander (Santa Monica CA), High performance thermoelectric materials and methods of preparation.
  4. Kyle, Robert Joseph Stephen; Shelton, Gail D.; McKenney, Sam, High strength composite thermoelectric cooler and method for making same.
  5. Harman Theodore C., Lead-chalcogenide superlattice structures.
  6. Bhatia Rakesh ; Padilla Robert D. ; Hermerding ; II James G., Method and apparatus for cooling integrated circuits using a thermoelectric module.
  7. Adelman Lonnie W., Microelectronic thermoelectric device and systems incorporating such device.
  8. Park Sang Wook,KRX ; Baig Hyung Gil,KRX, Packaged integrated circuit device.
  9. Jovanovic,Velimir; Bass,John C.; Ghamaty,Saeid, Quantum well thermoelectric power source.
  10. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  11. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  12. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  13. Fleurial Jean-Pierre ; Caillat Thierry F. ; Borshchevsky Alexander, Semiconductor apparatus utilizing gradient freeze and liquid-solid techniques.
  14. Dresselhaus Mildred S. ; Harman Theodore C. ; Cronin Stephen B. ; Koga Takaaki ; Sun Xiangzhong ; Wang Kang L., Si/SiGe superlattice structures for use in thermoelectric devices.
  15. Suzuki Masayuki,JPX, Silicon-based functional matrix substrate and optical integrated oxide device.
  16. Suzuki Masayuki,JPX, Silicon-based functional matrix substrate and optical integrated oxide device.
  17. Theodore C. Harman ; Mildred S. Dresselhaus ; David L. Spears ; Michael P. Walsh ; Stephen B. Cronin ; Xiangzhong Sun ; Takaaki Koga, Superlattice structures for use in thermoelectric devices.
  18. Harman Theodore C., Superlattice structures particularly suitable for use as thermoelectric materials.
  19. Cohen,David A.; Banerji,Sunand; Denninger,Michael J., Thermal cycler with protection from atmospheric moisture.
  20. Gutkin Timofei, Thermal generator and method of producing same.
  21. Li, John H., Thermoelectric composite semiconductor.
  22. Li, John H., Thermoelectric composite semiconductor.
  23. Imanishi Yuichiro,JPX ; Miyoshi Makoto,JPX ; Watanabe Tetsuo,JPX ; Kushibiki Keiko,JPX ; Shinohara Kazuhiko,JPX ; Kobayashi Masakazu,JPX ; Furuya Kenji,JPX, Thermoelectric conversion module and method of manufacturing the same.
  24. Imanishi Yuichiro,JPX ; Miyoshi Makoto,JPX ; Watanabe Tetsuo,JPX ; Kushibiki Keiko,JPX ; Shinohara Kazuhiko,JPX ; Kobayashi Masakazu,JPX ; Furuya Kenji,JPX, Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers.
  25. Shankar, Ravi; Le Neel, Olivier, Thermoelectric cooler system, method and device.
  26. Lin Wei T. (No. 20 ; Sec. 5 ; 3rd Fl. ; Cheng Teh Rd. Taipei TWX), Thermoelectric couple device.
  27. Sakuragi Shiro,JPX, Thermoelectric element and cooling or heating device provided with the same.
  28. Yamada, Kazukiyo; Tashiro, Kohei; Esaki, Hidenori; Kudou, Tomohide, Thermoelectric module.
  29. Hiller, Nathan D.; Bass, John C.; Allen, Daniel T., Thermoelectric power from environmental temperature cycles.
  30. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  31. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로