[특허]Heat pipe-electrical interconnect integration for chip modules

Heat pipe-electrical interconnect integration for chip modules 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0806997 (1991-12-13)
발명자 / 주소	Crawford Robert K. (Palo Alto CA) Leibovitz Jacques (San Jose CA) Miller Daniel J. (San Francisco CA) Chen Kim H. (Fremont CA)
출원인 / 주소	Hewlett-Packard Company (Palo Alto CA 02)
인용정보	피인용 횟수 : 28 인용 특허 : 0

초록 ▼

Method and apparatus for controlling the temperature of one or more electrical component chips positioned on a face of a substrate and for providing component-to-component electrical interconnect traces between the chips. One or a selected set of electrical interconnections, contained within the substrate and connected to a chip, is also connected to a column of high electrical and thermal conductivity material within the substrate that is in direct thermal contact with the working fluid in a heat pipe. The heat pipe is sealed and is contained in the substrate interior and is in electrical and thermal contact with the electronic components on a chip. The heat pipe working fluid receives heat from the electronic components through the thermally conducting column, changes phase through absorption of this heat, and transports the heat to heat dissipation means located elsewhere.

대표청구항 ▼

An apparatus for controlling the temperature of one or more chips with electronic components thereon and for providing electrical interconnection between two or more such chips, the apparatus comprising: a substrate having at least one channel completely contained therein, each said channel defining a hollow extending from a first end to a second end of the channel, the substrate having one or more faces with one or more chips positioned on at least one face over the first end of said channel; a heat pipe wick, having a working fluid contained therein, completely situated within the hollow of the channel, extending from the first end of the channel toward the second end of the channel; a heat pipe evaporator chamber in fluid communication with the wick at the first end of the channel, for receiving working fluid from the wick, adding thermal energy to the working fluid, and directing the working fluid to the second end of the channel; a heat pipe condenser chamber in fluid communication with the wick at the second end of the channel, for receiving working fluid as a gas from the wick at a high temperature, withdrawing thermal energy from the working fluid, and returning the working fluid as a liquid within the wick to the first end of the channel; heat dissipation means in thermal contact with the condenser chamber, for withdrawing thermal energy from the condenser chamber, dispersing or dissipating this thermal energy, and maintaining the temperature of the condenser chamber within a predetermined temperature range; a plurality of columns of material of high electrical and thermal conductivity, each of said plurality of conducting columns being effective for direct thermal contact between at least one chip on a substrate face and the working fluid in the evaporator chamber; and a plurality of electrical interconnect traces of material located on the substrate, each trace electrically connecting at least two distinct chips through at least two conducting columns, whereby a substantial portion of the heat generated by electronic components on said chips and said plurality of electrical interconnect traces of material is removed by said working fluid in said wick.

이 특허를 인용한 특허 (28)

Carson, Flynn, Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor.
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Light, David; Tostado, Paula Lagattuta; Warner, Michael, Connection components with anisotropic conductive material interconnection.
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Yoshikawa, Minoru; Sakamoto, Hitoshi; Hashiguchi, Takeya, Cooling device.
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Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.
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Feng, Taqing; Li, Zhijian; Hong, Yuping; Chen, Hongliang; Shi, Jian, Heat dissipation device and radio frequency module with the same.
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Katsui, Tadashi, Heat sink and information processor using heat sink.
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Tadashi Katsui JP, Heat sink and information processor using heat sink.
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Tadashi Katsui JP, Heat sink and information processor using heat sink.
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Lee Sui Yung,TWX ; Hsu Chien-hung,TWX, Heat-radiating structure.
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Jensen Eric Dean ; Crumly William R. ; Feigenbaum Haim ; Schreiber Chris M., Integrated circuit with a chip on dot and a heat sink.
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Do, Byung Tai; Kuan, Heap Hoe; Chow, Seng Guan, Package-in-package using through-hole via die on saw streets.
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Do, Byung Tai; Kuan, Heap Hoe; Chow, Seng Guan, Package-on-package using through-hole via die on saw streets.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
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Furman, Bruce K.; Iruvanti, Sushumna; Lauro, Paul A.; Martin, Yves C.; Shih, Da Yuan; Van Kessel, Theodore G.; Zou, Wei, Patterned metal thermal interface.
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Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
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Igor Y. Khandros ; Thomas H. DiStefano, Semiconductor chip assembly with anisotropic conductive adhesive connections.
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Pagaila, Reza A.; Lin, Yaojian; Koo, Jun Mo, Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation.
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Pagaila, Reza A.; Lin, Yaojian; Koo, Jun Mo, Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation.
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Pagaila, Reza A.; Lin, Yaojian; Koo, JunMo, Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation.
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Do, Byung Tai; Kuan, Heap Hoe; Chua, Linda Pei Ee, Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer.
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Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
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Winter, Bradley J.; Zeyen, Benedikt, Systems, devices, and methods for semiconductor device temperature management.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
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June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
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Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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Higuchi, Masato; Kawanami, Yasuhiko; Terazono, Katsushi; Higashikawa, Koji; Sasaki, Akira; Morihara, Takayuki; Aoki, Takashi; Ito, Tetsuya; Nakabayashi, Yukihisa; Isobe, Tasuku; Koguma, Kiyonori, Wiring board and power conversion device.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Heat pipe-electrical interconnect integration for chip modules 원문보기

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Heat pipe-electrical interconnect integration for chip modules 원문보기

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이 특허를 인용한 특허 (28)

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