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Ceramic-metal bonding 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/19
  • B23K-001/20
  • B23K-031/02
  • B23K-103/16
출원번호 US-0499707 (1990-03-27)
발명자 / 주소
  • Li Chou H. (379 Elm Dr. Roslyn NY 11576)
인용정보 피인용 횟수 : 55  인용 특허 : 0

초록

A method for reproducibly making a structural joint between a metal and a ceramic for practical uses above 600°C. comprises uniformly metallizing the ceramic and increasing the ratio of the ceramic material strength to the dynamic and static mismatch stresses due to differential thermal expansions s

대표청구항

A method for making a liquid-diffusion formed, fully dense and substantially defect-free ceramic-metal joint for practical uses at temperatures over about 630°C., comprising: providing a ceramic; providing a metal; selecting a ceramic metallizing composition having a plurality of mixed powdered meta

이 특허를 인용한 특허 (55)

  1. Makino, Takuma; Shinkai, Masayuki, Adhesive composition for bonding different kinds of members.
  2. Takuma Makino JP; Masayuki Shinkai JP, Adhesive composition for bonding different kinds of members.
  3. Rzany, Alexander; Mueller, Heinz, Biocorrodible implant having a corrosion-inhibiting coating.
  4. Chou H. Li, Ceramic coating method.
  5. Li Chou H., Ceramic composite.
  6. Marcus A. Ritland ; Dennis W. Readey ; Richard N. Kleiner ; Jack D. Sibold ; Kyle Knudson ; Steven Landin ; Paul Thoen, Ceramic filter element.
  7. Li, Chou H., Chemical mechanical polishing.
  8. Li, Chou H.; Li, Suzanne C., Chemical mechanical polishing slurry.
  9. Zheng, Qingjun; Liu, Yixiong; Faust, James A; De Wet, Danie J; Subbaiyan, Sudharsan; Komolwit, Piyamanee; Rowe, Mark J, Cladded articles and methods of making the same.
  10. Fernie, John Andrew; Roberts, Martyn David; Wang, Yong; Kavilveedu, Narayanan Rajesh; Brown, David J., Double transition joint for the joining of ceramics to metals.
  11. Marcus A. Ritland ; Dennis W. Readey ; Jack D. Sibold ; James E. Stephan, Electronic components incorporating ceramic-metal composites.
  12. Ritland Marcus A. ; Readey Dennis W. ; Stephan James E. ; Rulis Dean A. ; Sibold Jack D., Electronic components incorporating ceramic-metal composites.
  13. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S.; Thomas, Kurt, Faucet.
  14. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  15. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  16. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  17. Brondum, Klaus, Faucet with wear-resistant valve component.
  18. Roger Duffield GB; Randall M. German ; Teh Fu Yen ; Ronald G. Iacocca, Fuel filter and production process.
  19. Zheng, Qingjun; Komolwit, Piyamanee; Liu, Yixiong; Faust, Jim; Bitler, Jonathan; Boddapati, Srinivasarao, Functionally graded coating.
  20. Holtzapple, Mark T.; Rabroker, George A., Gerotor apparatus for a quasi-isothermal Brayton cycle engine.
  21. Holtzapple, Mark T.; Rabroker, George A., Gerotor apparatus for a quasi-isothermal Brayton cycle engine.
  22. Li Chou H., Heat-resistant electronic systems and circuit boards.
  23. Li, Chou H., Heat-resistant electronic systems and circuit boards.
  24. Chou H. Li, Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal.
  25. Dawson, Joel T.; DeWet, Danie; Zheng, Qingjun, Imparting high-temperature wear resistance to turbine blade Z-notches.
  26. Richard John Grylls ; Curtiss Mitchell Austin, Joined structure utilizing a ceramic foam bonding element, and its fabrication.
  27. Li, Chao; Rigby, Stephen John; Fellers, Clay Lynwood; Mason, Marco James; Azar, Saboura Rokhsair, Joining dissimilar materials using an epoxy resin composition.
  28. Li, Chao; Rigby, Stephen John; Fellers, Clay Lynwood; Mason, Marco James; Azar, Saboura Rokhsair, Joining dissimilar materials using an epoxy resin composition.
  29. Marcus A. Ritland ; William Todd Howe, Metal-infiltrated ceramic seal.
  30. Wei, Ming-Hsiung; Kuo, Dong-Hau; Shiue, Ren-Kae; Yeh, Kai-Ting, Method for bonding aluminum oxide to stainless steel.
  31. Ritland Marcus A. ; Landin Steven M., Method for producing filled vias in electronic components.
  32. Gaynes Michael Anthony ; Pierson Mark Vincent ; Zubelewicz Aleksander, Method for reinforcing a semiconductor device to prevent cracking.
  33. Ritland Marcus A. ; Readey Dennis W. ; Kleiner Richard N. ; Sibold Jack D. ; Knudson Kyle ; Landin Steven ; Thoen Paul, Method for sealing and/or joining an end of a ceramic filter.
  34. Lemelson Jerome H. (868 Tyler Way Incline Village NV 89540) Conley James G. (443 Jefferson Ave. Glencoe IL 60022), Method of depositing synthetic diamond coatings with intermediates bonding layers.
  35. Welty,Richard P.; Brondum,Klaus; Richmond,Douglas S.; Jonte,Patrick B., Method of forming a wear resistant component.
  36. Reddy, Srinivasa S. N.; Wall, Donald R., Method of forming features on a ceramic substrate using platible pastes.
  37. Kramer, Daniel P., Method of joining metals to ceramic matrix composites.
  38. Li,Chou H., Method of making atomic integrated circuit device.
  39. Ami, Norihiro; Okamoto, Masahide; Ishihara, Shosaku; Tanaka, Minoru; Horikoshi, Mutsumi; Yasuda, Akihiro, Method of manufacturing via interconnection of glass-ceramic wiring board.
  40. Anton, Bryce; Welty, Richard P.; Sullivan, Patrick, Method of producing an article having patterned decorative coating.
  41. Zheng, Qingjun; Liu, Yixiong; Faust, James A; Rowe, Mark J; De Wet, Danie J; Subbaiyan, Sudharsan; Meyer, Michael J, Methods of making metal matrix composite and alloy articles.
  42. Chou H. Li ; Suzanne C. Li, Planarizing method.
  43. Reddy Srinivasa S. N. ; Wall Donald R., Platible non-metallic filler material for metallurgical screening paste.
  44. Chang, Hsin-Pei; Chen, Wen-Rong; Chiang, Huann-Wu; Chen, Cheng-Shi; Hu, Wen-Feng, Process for joining brass part and silicone carbide ceramics part and composite articles made by same.
  45. Matsubara Yoshihisa,JPX, Simulation method of silicide reaction for use with production of semiconductor devices.
  46. Michael Anthony Gaynes ; Mark Vincent Pierson ; Aleksander Zubelewicz, Structure for reinforcing a semiconductor device to prevent cracking.
  47. Lemelson Jerome H. ; Conley James G., Synthetic diamond coatings with intermediate amorphous metal bonding layers and methods of applying such coatings.
  48. Tochi,Kenichi; Noguchi,Takao; Yamazaki,Hiroshi; Unno,Ken; Miyazaki,Masahiro; Shoji,Shigeru, Thin-film piezoelectric element and method of making same.
  49. McAfee James L. ; Deuser Donald A. ; Niemann John T. ; Schwartz Daniel S., Two-step brazing process for joining materials with different coefficients of thermal expansion.
  50. Brondum, Klaus; Welty, Richard P.; Richmond, Douglas S.; Jonte, Patrick B.; Thomas, Kurt, Valve component for faucet.
  51. Brondum, Klaus; Welty, Richard P.; Richmond, Douglas S.; Jonte, Patrick B.; Thomas, Kurt, Valve component for faucet.
  52. Welty,Richard P.; Brondum,Klaus; Richmond,Douglas S.; Jonte,Patrick B., Valve component with improved wear resistance.
  53. Welty, Richard P.; Brondum, Klaus; Richmond, Douglas S.; Jonte, Patrick B., Valve component with multiple surface layers.
  54. Kim, Kwang Hwan; Lee, Seung Yeon; Chu, Dong Ho; Park, Ui Yeon; Jin, Kyung-Wook; Yang, Sung-Jin; Park, Jun Gwan; Lee, Gil-Beom; Jung, Kyung-Jae, Waste gate valve.
  55. Baker Martin L. ; Cashion William F. ; Hagedorn Fred B., Zero stress bonding of silicon carbide to diamond.
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