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Adapter for connection of an integrated circuit package to a circuit board

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/02
출원번호 US-0846974 (1992-03-06)
발명자 / 주소
  • Murphy James V. (Warwick RI) Murphy Michael J. (East Greenwich RI)
출원인 / 주소
  • Advanced Interconnections Corporation (West Warwick RI 02)
인용정보 피인용 횟수 : 37  인용 특허 : 0

초록

An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having solder leads, and the adapter comprising a plurality of pins for connection to the circuit board, a plurality of lead frame elements, each lead frame element connected to a pin, and ea

대표청구항

An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having a plurality of solder leads which are soldered to the adapter after the package is placed on said adapter, said adapter comprising a plurality of pins for connection to the circuit boa

이 특허를 인용한 특허 (37)

  1. Hsieh, Ming-Chih; Kuo, Heng-Chen, Chip adapter.
  2. Provencher, Daniel B.; Gailus, Mark W.; Manter, David; Sivarajan, Vysakh, Compliant shield for very high speed, high density electrical interconnection.
  3. Kirk, Brian; Si, Jason; Pham, Ba; Kocsis, Sam; Chan, David; Wang, Wonder; Tang, Bob; Li, Martin; Wu, Smith, Connector configurable for high performance.
  4. James Gregory A. ; Frutschy Kristopher J. ; Moresco Larry L., Controlling the heat expansion of electrical couplings.
  5. Cartier, Jr., Marc B.; Gailus, Mark W.; Sivarajan, Vysakh, Differential electrical connector with improved skew control.
  6. Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
  7. Paniagua, Jose Ricardo, Electrical connector with hybrid shield.
  8. Atkinson, Prescott B.; Gailus, Mark W.; Hanrahan, Mark G., High bandwidth connector.
  9. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  10. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  11. Atkinson, Prescott B.; Kirk, Brian; Gailus, Mark W.; Manter, David; Cohen, Thomas S., High frequency electrical connector.
  12. Milbrand, Jr., Donald W.; Atkinson, Prescott B.; Kirk, Brian, High performance cable connector.
  13. Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., High performance connector contact structure.
  14. Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector.
  15. Kirk, Brian; Kasturi, Vijay, High performance, small form factor connector with common mode impedance control.
  16. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  17. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  18. Cartier, Jr., Marc B.; Dunham, John Robert; Gailus, Mark W.; Girard, Jr., Donald A.; Manter, David; Pitten, Tom; Sivarajan, Vysakh; Snyder, Michael Joseph, High speed, high density electrical connector with shielded signal paths.
  19. Cohen, Thomas S., High-frequency electrical connector.
  20. Cartier, Jr., Marc B.; Gailus, Mark W.; Cohen, Thomas S.; Dunham, John Robert; Sivarajan, Vysakh, Housing for a high speed electrical connector.
  21. Chen Shu-Hui,TWX ; Chang Nai-Shung,TWX, Integrated circuit mounting board with bypass capacitors.
  22. Dosdos, S. Gabriel R.; Kim, Dong Wook, Integrated circuit package and method of forming an integrated circuit package.
  23. Zohni, Nael; Nagarajan, Kumar; Boja, Ronilo, Integrated circuit packaging devices and methods.
  24. Sanjuan, Eric A.; Cahill, Sean S., Low cost high frequency device package and methods.
  25. Sanjuan, Eric A.; Cahill, Sean S., Low cost high frequency device package and methods.
  26. Cartier, Jr., Marc B.; Manter, David; Atkinson, Prescott B.; Stokoe, Philip T.; Cohen, Thomas S.; Gailus, Mark W., Low cost, high performance RF connector.
  27. Kim Choul-Su,KRX ; Kim Woo-Sik,KRX ; Sim Sung-Beom,KRX ; Sukue Masaharu,KRX ; Woo Byung-Woo,KRX, Method for mounting an integrated circuit from a tape carrier package on a printed circuit board.
  28. Sanjuan, Eric A.; Cahill, Sean S., Method of making a high frequency device package.
  29. Werther William E. (Wood Ranch CA), Methods for interconnecting integrated circuits.
  30. McNamara, David M.; Kirk, Brian, Mezzanine connector.
  31. Cottrell Stephen E. (Pilot Hill CA), Printed circuit board adapter carrier for input/output cards.
  32. Kaller, Dierk; Recktenwald, Willi; Ruehle, Gerhard, Removable housing for mounting pin grid array.
  33. Fujiyama,Terumi; Fukunaga,Kazuo; Fukuda,Morihiro; Kuwada,Yoshiaki; Mori,Hiromasa; Hashimoto,Yoshio, Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor.
  34. Fujiyama,Terumi; Fukunaga,Kazuo; Fukuda,Morihiro; Kuwada,Yoshiaki; Mori,Hiromasa; Hashimoto,Yoshio, Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor.
  35. Menzies L. William ; Menzies Stephen W. ; Mackey Dale S., Signal adaptor board for a pin grid array.
  36. Werther William E., Space-saving assemblies for connecting integrated circuits to circuit boards.
  37. Komurasaki Keiichi (Himeji JPX) Kurusu Kyoko (Himeji JPX), Vehicle alternating-current generator control device and vehicle alternating-current generator.
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