이 특허를 인용한 특허 (144)

1. Scott, Simon P; Sutcliffe, Chris, Additive manufacturing apparatus and method.

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2. Swanson, William J.; Mannella, Dominic F., Additive manufacturing with soluble build sheet and part marking.

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3. Farnworth,Warren M; Duesman,Kevin G., Apparatus for increased dimensional accuracy of 3-D object creation.

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4. Farnworth,Warren M., Apparatus for stereolithographic processing of components and assemblies.

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5. Hickerson,Kevin P.; Bedal,Bryan; Diephuis,Richard J., Apparatus for three dimensional printing using image layers.

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6. Renn, Michael J.; King, Bruce H.; Essien, Marcelino; Marquez, Gregory J.; Giridharan, Manampathy G.; Sheu, Jyh-Cherng, Apparatuses and methods for maskless mesoscale material deposition.

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7. Swanson, William J.; Mannella, Dominic F.; LaBossiere, Joseph E.; Hansen, Michael W.; Upadhyaya, Saurav; Schloesser, Ronald G., Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof.

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8. Swanson, William J.; Mannella, Dominic F.; LaBossiere, Joseph E.; Hansen, Michael W.; Upadhyaya, Saurav; Schloesser, Ronald G., Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof.

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9. Mulder, Edwin J., Casting nozzle with dimensional repeatability for viscous liquid dispensing.

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10. Akram, Salman; Ahmad, Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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11. Akram, Salman; Ahmad, Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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12. Akram,Salman; Ahmad,Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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13. Akram,Salman; Ahmad,Syed Sajid, Collars, support structures, and forms for protruding conductive structures.

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14. Keicher, David M.; Brewer, Lucas B.; Grylls, Richard John, Deep deposition head.

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15. Farnworth,Warren M.; Hiatt,William M.; Watkins,Charles M., Electrical contacts with dielectric cores.

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16. Farnworth, Warren M., Energy beam patterning of protective layers for semiconductor devices.

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17. Keicher, David M.; Love, James W.; Dullea, Kevin J.; Bullen, James L.; Gorman, Pierrette H.; Smith, Mark E., Forming structures from CAD solid models.

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18. Renn, Michael J.; King, Bruce H., Forming structures using aerosol jet® deposition.

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19. Nevins, Joel, Game object advances for the 3D printing entertainment industry.

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20. Williams,Vernon M.; Street,Bret K., Heat sinks including nonlinear passageways.

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21. Robert V. Kieronski, High-strength parts formed using stereolithography.

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22. Akram, Salman; Wood, Alan G.; Farnworth, Warren M., Interposer and methods for fabricating same.

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23. Akram, Salman; Wood, Alan G.; Farnworth, Warren M., Interposer and methods for fabricating same.

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24. Grigg, Ford B., Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods.

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25. Tompkins James V. (Austin TX) Birmingham Britton R. (Austin TX) Jakubenas Kevin J. (Austin TX) Marcus Harris L. (Austin TX), Joining ceramics and attaching fasteners to ceramics by gas phase selective beam deposition.

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26. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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27. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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28. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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29. Farnworth,Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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30. Keicher, David M.; Love, James W., Manufacturable geometries for thermal management of complex three-dimensional shapes.

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31. Bredt, James F.; Anderson, Timothy; Russell, David B.; Clark, Sarah L.; DiCologero, Matthew J., Material systems and methods of three-dimensional printing.

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32. King, Bruce H.; Marquez, Gregory James; Renn, Michael J., Mechanically integrated and closely coupled print head and mist source.

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33. Kamperman, Nicodemus Frederikus; Tacken, Roland Anthony; Van De Vorst, Lambertus Theodorus Gerardus, Method and apparatus for making partially coated products.

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34. Zagagi, Zvi; Gothait, Hanan; Miller, Gershon, Method for building a three dimensional object.

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35. Kozlak, David M.; Chillscyzn, Steven A.; Batchelder, J. Samuel, Method for building and using three-dimensional objects containing embedded identification-tag inserts.

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36. Kozlak, David M.; Chillscyzn, Steven A.; Batchelder, J. Samuel, Method for building and using three-dimensional objects containing embedded identification-tag inserts.

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37. Kozlak, David M.; Chillscyzn, Steven A.; Batchelder, J. Samuel, Method for building and using three-dimensional objects containing embedded identification-tag inserts.

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38. Akram,Salman; Wood,Alan G.; Farnworth,Warren M., Method for fabricating an interposer.

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39. Grigg,Ford B., Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers.

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40. Farnworth, Warren M.; Duesman, Kevin G., Method for forming three dimensional structures from liquid with improved surface finish.

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41. Heide, Erik K., Method for generating and building support structures with deposition-based digital manufacturing systems.

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42. Heide, Erik K., Method for generating and building support structures with deposition-based digital manufacturing systems.

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43. Nakagawa, Takuji; Wakino, Kikuo, Method for manufacturing three-dimensional photonic structure.

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44. Wilkening Christian,DEX ; Lohner Andreas,DEX, Method for producing a three-dimensional object.

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45. Götzen, Reiner, Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows.

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46. Jochen Philippi DE; Andreas Lohner DE, Method of calibrating an apparatus for producing a three-dimensional object, calibration apparatus and method and apparatus for producing a three-dimensional object.

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47. Higashi, Yoshikazu; Yoshida, Norio; Fuwa, Isao; Uchinono, Yoshiyuki, Method of manufacturing a three-dimensional object.

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48. Schmidt, Benjamin; Singer, Erwin, Method of producing a housing shell or ear mold to be worn in the ear.

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49. Bredt, James F.; Clark, Sarah L.; Uy, Evert F.; DiCologero, Matthew J.; Anderson, Timothy; Tarkanian, Michael; Williams, Derek X., Methods and compositions for three-dimensional printing of solid objects.

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50. Williams,Vernon M., Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads.

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51. Grigg,Ford B., Methods for fabricating interposers including upwardly protruding dams.

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52. Akram, Salman, Methods for fabricating protective structures for bond wires.

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53. Akram, Salman, Methods for fabricating protective structures for bond wires.

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54. Akram, Salman, Methods for fabricating semiconductor device test apparatus that include protective structures for intermediate conductive elements.

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55. Grigg,Ford B., Methods for fabricating stiffeners for flexible substrates.

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56. Farnworth,Warren M.; Wood,Alan G., Methods for forming protective layers on semiconductor device substrates.

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57. Akram,Salman, Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates.

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58. Grigg, Ford B.; Ocker, James M.; Leininger, Rick A., Methods for labeling semiconductor device components.

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59. Grigg, Ford B.; Ocker, James M.; Leininger, Rick A., Methods for labeling semiconductor device components.

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60. Akram, Salman, Methods for protecting intermediate conductive elements of semiconductor device assemblies.

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61. Akram,Salman, Methods for protecting intermediate conductive elements of semiconductor device assemblies.

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62. Grigg,Ford B., Methods for providing support for conductive structures protruding from semiconductor device components.

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63. Farnworth, Warren M., Methods for stereolithographic processing of components and assemblies.

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64. Wood, Alan G.; Farnworth, Warren M.; Watkins, Charles M.; Benson, Peter A., Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material.

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65. Farnworth, Warren M.; Duesman, Kevin G., Methods of fabricating housing structures and micromachines incorporating such structures.

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66. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials.

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67. Peterson, Darin L.; Wensel, Richard W.; Lee, Choon Kuan; Faull, James A., Microelectronic component assemblies having exposed contacts.

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68. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same.

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69. King, Bruce H.; Renn, Michael J.; Paulsen, Jason A., Miniature aerosol jet and aerosol jet array.

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70. Williams,Vernon M.; Street,Bret K., Programmed material consolidation methods for fabricating heat sinks.

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71. Williams,Vernon M., Programmed material consolidation methods for fabricating printed circuit board.

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72. Akram,Salman, Programmed material consolidation processes for protecting intermediate conductive structures.

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73. Akram, Salman, Protective structure for bond wires.

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74. Akram, Salman, Protective structures for bond wires.

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75. Williams, Vernon M.; Grigg, Ford B.; Street, Bret K., Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same.

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76. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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77. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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78. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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79. Akram, Salman, SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE S.

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80. Pruett, James A.; Mayberry, Travis; Clairmont, Fred H.; Seymour, Earl E., Selective composite manufacturing for components having multiple material properties.

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81. Williams, Vernon M., Selective consolidation processes for electrically connecting contacts of semiconductor device components.

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82. Grigg, Ford B., Semiconductor device assemblies including interposers with dams protruding therefrom.

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83. Grigg,Ford B., Semiconductor device assemblies including interposers with dams protruding therefrom.

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84. Akram, Salman, Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof.

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85. Hembree,David R.; Farnworth,Warren M., Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material.

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86. Akram, Salman, Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same.

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87. Akram,Salman, Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same.

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88. Farnworth,Warren M.; Wood,Alan G., Semiconductor devices including protective layers on active surfaces thereof.

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89. Akram, Salman; Ahmad, Syed Sajid, Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same.

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90. Earnworth, Warren M.; Wood, Alan G., Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures.

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91. Farnworth, Warren M.; Wood, Alan G., Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures.

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92. Farnworth, Warren M.; Wood, Alan G., Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures.

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93. Warren M. Farnworth ; Alan G. Wood, Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures.

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94. Farnworth, Warren M.; Johnson, Mark S., Stereolithographic method and apparatus for packaging electronic components.

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95. Farnworth, Warren M.; Johnson, Mark S., Stereolithographic method and apparatus for packaging electronic components and resulting structures.

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96. Farnworth, Warren M., Stereolithographic method for applying materials to electronic component substrates and resulting structures.

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97. Bamford, Mark D, Stereolithographic method for combining components of varying densities.

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98. Williams, Vernon M.; Street, Bret K., Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same.

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99. Williams,Vernon M.; Street,Bret K., Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same.

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100. Akram,Salman; Ahmad,Syed Sajid, Stereolithographic method for fabricating stabilizers for semiconductor devices.

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101. Williams, Vernon M., Stereolithographic methods for fabricating conductive elements.

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102. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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103. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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104. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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105. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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106. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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107. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.

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108. Farnworth, Warren M.; Wood, Alan G., Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed.

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109. Williams, Vernon M., Stereolithographic methods for securing conductive elements to contacts of semiconductor device components.

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110. Akram, Salman, Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed.

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111. Akram, Salman, Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed.

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112. Vernon M. Williams, Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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113. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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114. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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115. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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116. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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117. Grigg, Ford B.; Ocker, James M.; Leininger, Rick A., Stereolithographically marked semiconductor devices and methods.

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118. Grigg, Ford B.; Ocker, James M.; Leininger, Rick A., Stereolithographically marked semiconductor devices and methods.

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119. Farnworth, Warren M.; Duesman, Kevin G., Stereolithographically packaged, in-process semiconductor die.

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120. Akram,Salman, Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers.

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121. Grigg, Ford B., Support ring for use with a contact pad and semiconductor device components including the same.

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122. Grigg,Ford B., Support ring for use with a contact pad and semiconductor device components including the same.

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123. Farnworth, Warren M.; Duesman, Kevin G, Surface smoothing of stereolithographically formed 3-D objects.

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124. Farnworth, Warren M.; Duesman, Kevin G., Surface smoothing of stereolithographically formed 3-D objects.

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125. Farnworth,Warren M.; Duesman,Kevin G., Surface smoothing of stereolithographically formed 3-D objects.

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126. Warren M. Farnworth ; Kevin G. Duesman, Surface smoothing of stereolithographically formed 3-D objects.

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127. Nevins, Joel, Synchronizing instructional media with object builds to advance the 3D printing industry.

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128. Grigg, Ford B., Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same.

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129. Grigg, Ford B., Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same.

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130. Grigg, Ford B., Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same.

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131. Grigg, Ford B., Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same.

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132. Grigg,Ford B., Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same.

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133. Bredt, James F.; Clark, Sarah L.; Williams, Derek X.; DiCologero, Matthew J., Thermoplastic powder material system for appearance models from 3D printing systems.

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134. Bredt,James F.; Anderson,Timothy C.; Russell,David B., Three dimensional printing material system and method.

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135. Williams, Derek X., Three dimensional printing material system and method using peroxide cure.

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136. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.

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137. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.

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138. Alam, Amir; Bredt, James F.; Clark, Nanette; Flynn, Mary; Sprauer, Jean; Williams, Derek X., Three-dimensional printing material system with improved color, article performance, and ease of use.

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139. Farnworth,Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components.

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140. Farnworth, Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography.

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141. Farnworth, Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography.

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142. Farnworth, Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography.

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143. Farnworth, Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography.

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144. Hembree, David R.; Farnworth, Warren M., Underfill and encapsulation of semiconductor assemblies with materials having differing properties.

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