$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Semiconductor device package and method of making such a package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/18
출원번호 US-0543989 (1990-06-25)
발명자 / 주소
  • Long Jon M. (Livermore CA) Sidorovsky Rachel S. (San Jose CA) Steidl Michael J. (San Jose CA) Murphy Adrian (San Jose CA) Sen Bidyut (Milpitas CA)
출원인 / 주소
  • LSI Logic Corporation (Milpitas CA 02)
인용정보 피인용 횟수 : 179  인용 특허 : 0

초록 ▼

A semiconductor device package and a method of making such a package is described. The package comprises a flexible packaging substrate having a patterned metal layer onto which a semiconductor die is attached and a patterned insulative layer attached to the metal layer. The insulative layer include

대표청구항 ▼

A package for encapsulating a semiconductor device comprising: a flexible substrate having a patterned insulative layer defined at a top side thereof and a patterned metal layer defined at a bottom side thereof; a backside layer, made of a first moisture-blocking material, connected to the bottom si

이 특허를 인용한 특허 (179)

  1. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages.
    상세보기
  2. McKeeth, Dave J.; Fitzmaurice, Tim; Kosmosky, Roger A., Apparatus, system, and method for cutting tubes.
    상세보기
  3. Wessling, Bernhard, Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof.
    상세보기
  4. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
    상세보기
  5. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
    상세보기
  6. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
    상세보기
  7. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Ball grid array package enhanced with a thermal and electrical connector.
    상세보기
  8. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Ball grid array package fabrication with IC die support structures.
    상세보기
  9. Zhao, Sam Ziqun; Khan, Rezaur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package having one or more stiffeners.
    상세보기
  10. Khan, Reza-ur Rahman; Zhong, Chong Hua, Ball grid array package substrates and method of making the same.
    상세보기
  11. Khan,Reza ur Rahman; Zhong,Chong Hua, Ball grid array package substrates with a modified central opening and method for making the same.
    상세보기
  12. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package with multiple interposers.
    상세보기
  13. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Ball grid array package with patterned stiffener layer.
    상세보기
  14. Zhao, Sam Ziqun; Khan, Reza ur Rahman; Law, Edward; Papageorge, Marc, Ball grid array package with patterned stiffener surface and method of assembling the same.
    상세보기
  15. Zhao, Sam Ziqun; Rahman Khan, Reza ur, Ball grid array package with separated stiffener layer.
    상세보기
  16. Khan,Reza ur Rahman; Zhao,Sam Ziqun, Ball grid array package with stepped stiffener layer.
    상세보기
  17. Weyerman Morley J., Belt-feed trim and form apparatus.
    상세보기
  18. Dickey, Brenton L., Carrier for substrate film.
    상세보기
  19. Crumly William Robert ; Hudson Pete Henry ; Cochrane Robert Joseph ; Feigenbaum Haim ; Jensen Eric Dean, Chip scale package.
    상세보기
  20. Derwin Mark Daniel ; Labzentis Daniel Peter ; Reid Jonathan David ; Sharp Timothy Lee, Circuitized substrate with material containment means and method of making same.
    상세보기
  21. Crotzer David R. ; Goodwin Jonathan W. ; Michaud Arthur G. ; DeDonato David A., Conductive elastomers and methods for fabricating the same.
    상세보기
  22. White, Bertram J., Corner bonding to lead frame.
    상세보기
  23. Wensel Richard W., De-wetting material for glob top applications.
    상세보기
  24. Sirard, Stephen M.; Hymes, Diane; Schoepp, Alan M.; Limary, Ratchana, Delamination drying apparatus and method.
    상세보기
  25. Gall, Michael R., Detachable magnetic ground strap assembly.
    상세보기
  26. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Die down ball grid array package.
    상세보기
  27. Khan, Reza-Ur Rahman; Zhao, Sam Ziqun, Die down ball grid array packages and method for making same.
    상세보기
  28. Khan, Reza-ur Rahman; Zhao, Sam Ziqun, Die-down ball grid array package with die-attached heat spreader and method for making the same.
    상세보기
  29. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same.
    상세보기
  30. Zhang,Tonglong; Khan,Reza ur Rahman, Die-up ball grid array package with a heat spreader and method for making the same.
    상세보기
  31. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with attached stiffener ring.
    상세보기
  32. Zhao, Sam Z; Khan, Reza-ur R, Die-up ball grid array package with die-attached heat spreader.
    상세보기
  33. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Die-up ball grid array package with enhanced stiffener.
    상세보기
  34. Khan,Reza ur Rahman; Zhao,Sam Ziqun; Bacher,Brent, Die-up ball grid array package with patterned stiffener opening.
    상세보기
  35. Khan,Reza ur R; Zhao,Sam Z; Bacher,Brent, Die-up ball grid array package with printed circuit board attachable heat spreader.
    상세보기
  36. Zhao,Sam Z; Khan,Reza ur R, Die-up ball grid array package with printed circuit board attachable heat spreader.
    상세보기
  37. Wessling, Bernhard, Dispersions of intrinsically conductive polymers.
    상세보기
  38. Kuzmenka,Maksim, ESD protection apparatus for an electrical device.
    상세보기
  39. Moncayo, Alfredo; Hostetter, Brian; Armenta, Luis F., Edge mount connector arrangement with improved characteristic impedance.
    상세보기
  40. Yamada, Shoji, Electronic connector terminal.
    상세보기
  41. Yamada,Shoji, Electronic connector terminal, a method for plating, and a terminal stack.
    상세보기
  42. Neuman, David; Lindblad, Scott, Electronic devices wire bonded to substrate through an adhesive layer and method of making the same.
    상세보기
  43. Moden Walter L. ; Jacobson John O., Encapsulant dam standoff for shell-enclosed die assemblies.
    상세보기
  44. Froebel Francis E. (Essex Junction VT) Gardell David L. (Fairfax VT) Irish Gary H. (Jericho VT) Shaikh Mohammed S. (Essex Junction VT), Encapsulated semiconductor chip module and method of forming the same.
    상세보기
  45. Rumsey, Brad D., Encapsulation process using a partial slot cover and a package formed by the process.
    상세보기
  46. Rahman Khan,Reza ur; Zhao,Sam Ziqun, Enhanced die-down ball grid array and method for making the same.
    상세보기
  47. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Enhanced die-up ball grid array packages and method for making the same.
    상세보기
  48. Fukutomi, Naoki; Tsubomatsu, Yoshiaki; Inoue, Fumio; Yamazaki, Toshio; Ohhata, Hirohito; Hagiwara, Shinsuke; Taguchi, Noriyuki; Nomura, Hiroshi, Fabrication process of semiconductor package and semiconductor package.
    상세보기
  49. Fukutomi,Naoki; Tsubomatsu,Yoshiaki; Inoue,Fumio; Yamazaki,Toshio; Ohhata,Hirohito; Hagiwara,Shinsuke; Taguchi,Noriyuki; Nomura,Hiroshi, Fabrication process of semiconductor package and semiconductor package.
    상세보기
  50. Naoki Fukutomi JP; Yoshiaki Tsubomatsu JP; Fumio Inoue JP; Toshio Yamazaki JP; Hirohito Ohhata JP; Shinsuke Hagiwara JP; Noriyuki Taguchi JP; Hiroshi Nomura JP, Fabrication process of semiconductor package and semiconductor package.
    상세보기
  51. Igor Y. Khandros ; Thomas H. Distefano, Face-up semiconductor chip assemblies.
    상세보기
  52. Lombardi, Thomas E.; Merte, Donald; Monjeau, Gregg B.; Questad, David L.; Tran, Son K., Fixture to constrain laminate and method of assembly.
    상세보기
  53. Lombardi, Thomas E.; Merte, Donald; Monjeau, Gregg B.; Questad, David L.; Tran, Son K., Fixture to constrain laminate and method of assembly.
    상세보기
  54. Lower, Nathan P.; Wilcoxon, Ross K.; Wyckoff, Nathaniel P., High performance deposited die attach.
    상세보기
  55. Gupta, Atul K.; Latchman, Ryan S.; Tlalka, Marek S., High speed signal conditioning package.
    상세보기
  56. Dershem Stephen M. ; Osuna ; Jr. Jose A., Hydrophobic vinyl monomers, formulations containing same, and uses therefor.
    상세보기
  57. Khan,Reza ur Rahman; Zhao,Sam Ziqun, IC die support structures for ball grid array package fabrication.
    상세보기
  58. Chang, Bo Soon, Integrated back-end integrated circuit manufacturing assembly.
    상세보기
  59. Zhang, Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
    상세보기
  60. Zhang,Tonglong, Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same.
    상세보기
  61. Suresh Ramalingam ; Nagesh Vodrahalli ; Michael J. Costello ; Mun Leong Loke ; Ravi V. Mahajan, Integrated circuit package having a substrate vent hole.
    상세보기
  62. Tripard,Jason E., Integrated circuit package separator methods.
    상세보기
  63. Tripard, Jason E., Integrated circuit package separators.
    상세보기
  64. Tripard, Jason E., Integrated circuit package separators.
    상세보기
  65. Tripard, Jason E., Integrated circuit package separators.
    상세보기
  66. Tripard, Jason E., Integrated circuit package separators.
    상세보기
  67. Tripard, Jason E., Integrated circuit package separators.
    상세보기
  68. Tripard,Jason E., Integrated circuit package separators.
    상세보기
  69. Camacho, Zigmund Ramirez; Bathan, Henry Descalzo; Caparas, Jose Alvin; Trasporto, Arnel, Integrated circuit package system with lead support.
    상세보기
  70. Pendse, Rajendra D., Integrated circuit packaging system with warpage control system and method of manufacture thereof.
    상세보기
  71. Chang, Chih-Horng; Kuo, Tin-Hao; Tsai, Tsung-Fu; Ku, Min-Feng, Isolation rings for blocking the interface between package components and the respective molding compound.
    상세보기
  72. Chang, Chih-Horng; Kuo, Tin-Hao; Tsai, Tsung-Fu; Ku, Min-Feng, Isolation rings for packages and the method of forming the same.
    상세보기
  73. Chang, Chih-Horng; Kuo, Tin-Hao; Tsai, Tsung-Fu; Ku, Min-Feng, Isolation rings for packages and the method of forming the same.
    상세보기
  74. Chang, Chih-Horng; Kuo, Tin-Hao; Tsai, Tsung-Fu; Ku, Min-Feng, Isolation rings for packages and the method of forming the same.
    상세보기
  75. Satoru Fukunaga JP; Hiroyuki Nakanishi JP, Jig used for assembling semiconductor devices.
    상세보기
  76. Song, Kong Lam; Choe, Peng Cheong, Lead formation, assembly strip test and singulation method.
    상세보기
  77. Song, Kong Lam; Choe, Peng Cheong, Lead formation, assembly strip test, and singulation system.
    상세보기
  78. Matsutomo Mitsuhiro,JPX, Lead structure for a semiconductor device with an isolating protective layer and method of fabricating the same.
    상세보기
  79. Zhong, Chong Hua; Khan, Rezaur Rahman, Low voltage drop and high thermal performance ball grid array package.
    상세보기
  80. Zhong, Chonghua; Khan, Reza-ur Rahman, Low voltage drop and high thermal performance ball grid array package.
    상세보기
  81. Zhong,Chong Hua; Rahman Khan,Reza ur, Low voltage drop and high thermal performance ball grid array package.
    상세보기
  82. Miyaki,Yoshinori; Shimanuki,Yoshihiko; Suzuki,Hiromichi; Ito,Fujio, Manufacturing method of a semiconductor device utilizing a flexible adhesive tape.
    상세보기
  83. Ulrich, René Josef, Method and apparatus for mounting semiconductor chips onto a flexible substrate.
    상세보기
  84. Chang, Bo Soon; Verma, Vani, Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process.
    상세보기
  85. Wensel Richard W., Method for application of de-wetting material for glob top applications.
    상세보기
  86. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Method for assembling a ball grid array package with multiple interposers.
    상세보기
  87. Zhao,Sam Zinqun; Khan,Reza ur Rahman; Chaudhry,Imtiaz, Method for assembling a ball grid array package with two substrates.
    상세보기
  88. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Chaudhry, Imtiaz, Method for making an enhanced die-up ball grid array package with two substrates.
    상세보기
  89. Okutomo Takayuki (Kawasaki JPX) Ikemizu Morihiko (Kawasaki JPX), Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame.
    상세보기
  90. Garrison, Mark, Method for producing a circuit board comprising a lead frame.
    상세보기
  91. Tay Swee-Teck,SGX, Method for the preparation of lead-on-chip assemblies.
    상세보기
  92. Zhao,Sam Ziqun; Khan,Rezaur Rahman, Method of assembling a ball grid array package with patterned stiffener layer.
    상세보기
  93. Knecht Thomas A. (Algonquin IL), Method of encapsulating a crystal oscillator.
    상세보기
  94. Weyerman,Morley J., Method of handling an electrical component.
    상세보기
  95. Glenn, Thomas P.; Hollaway, Roy D.; Panczak, Anthony E., Method of making near chip size integrated circuit package.
    상세보기
  96. Nakamura,Junichi; Sakaguchi,Tetsuo; Mukoyama,Kazuya; Oda,Sachiko; Yumoto,Masahiro, Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure.
    상세보기
  97. Sheppard Robert P. ; Combs Edward G., Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener.
    상세보기
  98. Tsai Ming-Cheng,TWX ; Ho Heng-Chen,TWX, Method of performing rework test on integrated circuit packages.
    상세보기
  99. Matsuda Tetsuo (Poughkeepsie NY) Okumura Katsuya (Poughkeepsie NY), Method of planarizing a semiconductor workpiece surface.
    상세보기
  100. Weyerman,Morley J., Method of processing a strip of lead frames.
    상세보기
  101. Ostendorf Dennis R. ; Geralds Donald J., Method of removing a component from a substrate.
    상세보기
  102. Dickey, Brenton L., Method of supporting a substrate film.
    상세보기
  103. Hall,Frank L.; Baerlocher,Cary J., Methods of fabricating underfilled, encapsulated semiconductor die assemblies.
    상세보기
  104. Tripard Jason E., Methods of forming integrated circuit packages.
    상세보기
  105. Zhao, Sam Ziqun; Khan, Rezaur Rahman, Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader.
    상세보기
  106. Khandros,Igor Y.; DiStefano,Thomas H., Microelectronic component and assembly having leads with offset portions.
    상세보기
  107. Khandros,Igor Y.; DiStefano,Thomas H., Microelectronic component and assembly having leads with offset portions.
    상세보기
  108. Kasai, Wataru; Suzuki, Masami, Mold release film and process for producing semiconductor package.
    상세보기
  109. Glenn, Darin; Blackburn, Scott, Molded body and electrical device having a molded body for high voltage applications.
    상세보기
  110. Masuda,Mitsuhiro, Multi-chip module packaging with thermal expansion coefficiencies.
    상세보기
  111. Zhao, Sam Ziqun; Khan, Reza-ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
    상세보기
  112. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same.
    상세보기
  113. Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Near chip size integrated circuit package.
    상세보기
  114. Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Near chip size integrated circuit package.
    상세보기
  115. Zhao, Sam Ziqun; Khan, Rezaur Rahman, No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement.
    상세보기
  116. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  117. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  118. Evers Sven ; Clyne Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  119. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  120. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  121. Evers, Sven; Clyne, Craig T., Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  122. Sven Evers ; Craig T. Clyne, Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  123. Sven Evers ; Craig T. Clyne, Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits.
    상세보기
  124. Arndt, Karlheinz, Optoelectronic semiconductor component and housing base for such a component.
    상세보기
  125. Chen Shiaw-Jong Steve, Overcast semiconductor package.
    상세보기
  126. Vongfuangfoo Sutee ; Bacher Brent ; Sumagaysay Felipe, PBGA stiffener package.
    상세보기
  127. Fontana, Fulvio Vittorio; Talledo, Jefferson, Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors.
    상세보기
  128. Otremba, Ralf; Hoeglauer, Josef; Schredl, Juergen; Schloegel, Xaver; Schiess, Klaus, Package-in-packages and methods of formation thereof.
    상세보기
  129. Bauer, Michael; Bemmerl, Thomas; Fuergut, Edward; Jerebic, Simon; Vilsmeier, Hermann, Panel and semiconductor device having a composite plate with semiconductor chips.
    상세보기
  130. Krahn John Raymond, Partial discharge coupler.
    상세보기
  131. Krahn John Raymond ; Reed Clive William, Partial discharge coupler.
    상세보기
  132. Rumsey, Brad D., Partial slot cover for encapsulation process.
    상세보기
  133. Terai, Mamoru; Ota, Tatsuo; Ikuta, Hiroya; Hayashi, Kenichi; Nishimura, Takashi; Shinohara, Toshiaki, Power semiconductor device.
    상세보기
  134. Willner, Andrew F.; Snedeker, Lauren; Wilkie, Brian; Plume, Gifford; Ambady, Prasanth, Pressure sensor.
    상세보기
  135. Munoz,Jesus L.; Placido,Glenn; Ambata,Leonard U., Print stripper for ESD control.
    상세보기
  136. Yamaguchi, Atsushi; Kumazawa, Hidehiko, Printed circuit board having through-hole protected by barrier and method of manufacturing the same.
    상세보기
  137. Ramalingam, Suresh; Vodrahalli, Nagesh; Costello, Michael J.; Loke, Mun Leong; Mahajan, Ravi V., Process for assembling an integrated circuit package having a substrate vent hole.
    상세보기
  138. Weyerman, Morley J., Processing device for an elongated workpiece.
    상세보기
  139. Glenn Thomas P., RF shielded device.
    상세보기
  140. Liang Louis H., Reinforced leadframe to substrate attachment.
    상세보기
  141. Crotzer David R. (Windham NH), Resilient electrical interconnect.
    상세보기
  142. Jiang, Tongbi; Lee, Whonchee, Resistance-reducing conductive adhesives for attachment of electronic components.
    상세보기
  143. Silvestri, Paul, Self-identifying stacked die semiconductor components.
    상세보기
  144. Silvestri, Paul, Self-identifying stacked die semiconductor components.
    상세보기
  145. Silvestri, Paul, Self-identifying stacked die semiconductor components.
    상세보기
  146. Silvestri,Paul, Self-identifying stacked die semiconductor components.
    상세보기
  147. Soyano Shin (Nagano JPX) Toba Susumu (Nagano JPX), Semiconductor device.
    상세보기
  148. Yamaguchi,Tadashi, Semiconductor device.
    상세보기
  149. Kousaka, Takashi; Suzuki, Naoya; Tanaka, Toshiaki; Yasuda, Masaaki; Kaneda, Aizou, Semiconductor device and method for manufacturing the same.
    상세보기
  150. Toshiharu Seko JP; Kenji Toyosawa JP, Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same.
    상세보기
  151. Bauer, Michael; Haimerl, Alfred; Kessler, Angela; Mahler, Joachim; Schober, Wolfgang, Semiconductor device having a sensor chip, and method for producing the same.
    상세보기
  152. Hwang, Tae-Joo; Chung, Tae-Gyeong; Ahn, Eun-Chul, Semiconductor package and method of forming the same.
    상세보기
  153. Hwang, Tae-Joo; Chung, Tae-Gyeong; Ahn, Eun-Chul, Semiconductor package and method of forming the same.
    상세보기
  154. Hwang, Tae-Joo; Chung, Tae-Gyeong; Ahn, Eun-Chul, Semiconductor package and method of forming the same.
    상세보기
  155. Hwang, Tae-Joo; Chung, Tae-Gyeong; Ahn, Eun-Chul, Semiconductor package and method of forming the same.
    상세보기
  156. Hwang, Tae-Joo; Chung, Tae-Gyeong; Ahn, Eun-Chul, Semiconductor package and method of forming the same.
    상세보기
  157. Hwang, Tae-Joo; Chung, Tae-gyeong; Ahn, Eun-chul, Semiconductor package and method of forming the same.
    상세보기
  158. Kim, Jin-Ho; Oh, Se-Yong, Semiconductor package and package stack made thereof.
    상세보기
  159. Rumsey,Brad D., Semiconductor package having a partial slot cover for encapsulation process.
    상세보기
  160. Mok Seung-Kon (Seoul KRX) Ahn Seung-Ho (Suwon KRX) Kim Gu-Sung (Suwon KRX), Semiconductor package having support film formed on inner leads.
    상세보기
  161. Jeong, Jung Tae, Semiconductor packages including interconnection members.
    상세보기
  162. Chen, Tsung-Lung; Li, Ming-Hsun, Semiconductor packaging substrate improving capability of electrostatic dissipation.
    상세보기
  163. Minamio, Masanori; Takeuchi, Noboru; Itou, Kenichi; Fukuda, Toshiyuki; Sakota, Hideki, Semiconductor-element mounting substrate, semiconductor device, and electronic equipment.
    상세보기
  164. Raitter, James S., Sequential unique marking.
    상세보기
  165. Raitter,James S., Sequential unique marking.
    상세보기
  166. Raitter,James S., Sequential unique marking.
    상세보기
  167. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Structure for backside saw cavity protection.
    상세보기
  168. Chang, Bo Soon, System for controlling the processing of an integrated circuit chip assembly line.
    상세보기
  169. Carl Edmond Sullivan ; Frank Edward Anderson ; Paul Timothy Spivey ; Kris Ann Reeves ; Gary Raymond Williams ; Jeanne Marie Saldanha Singh, Tab circuit design for simplified use with hot bar soldering technique.
    상세보기
  170. Chin, Lai Nguk; Phaoharuhan, Paphat; Foong, Sally, Tape chip on lead using paste die attach material.
    상세보기
  171. Vandal, Robert A.; Recker, Duane O.; Aldrich, Keith, Techniques for mounting brackets to glass substrates for automotive applications.
    상세보기
  172. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array package.
    상세보기
  173. Zhao, Sam Ziqun; Khan, Reaz-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array packaging.
    상세보기
  174. Warren Robert W., Top of die chip-on-board encapsulation.
    상세보기
  175. Hall, Frank L.; Baerlocher, Cary J., Underfilled semiconductor die assemblies and methods of forming the same.
    상세보기
  176. Baker, Jay DeAvis; Kneisel, Lawrence Leroy; Paruchuri, Mohan R.; Reddy, Prathap Amervai; Jairazbhoy, Vivek Amir, Void-free die attachment method with low melting metal.
    상세보기
  177. Oh, Cheow Khoon; Lu, Ming-Chen; Sui, Xiaoming; Chen, Bo; Xue, Vincent, Wafer level chip scale package structure and manufacturing method thereof.
    상세보기
  178. Cleeves, James Montague, Wafer temperature control apparatus and method.
    상세보기
  179. Morley J. Weyerman, Workpiece moving methods.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로