이 특허를 인용한 특허 (82)

1. Goodwin,Paul; Wehrly, Jr.,James Douglas, Active cooling methods and apparatus for modules.

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2. Bolken,Todd O., Alternative method used to package multimedia card by transfer molding.

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3. Suhir Ephraim, Arrangement for reducing bending stress in an electronics package.

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4. Goodwin,Paul, Buffered thin module system and method.

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5. Szewerenko, Leland; Partridge, Julian; Lieberman, Wayne; Goodwin, Paul, Circuit module turbulence enhancement systems and methods.

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6. Wehrly, Jr.,James Douglas; Wilder,James; Wolfe,Mark; Goodwin,Paul, Circuit module with thermal casing systems.

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7. Cady, James W.; Wehrly, Jr., James Douglas; Goodwin, Paul, Compact module system and method.

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8. Wehrly, Jr.,James Douglas, Composite core circuit module system and method.

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9. Bi, Daoshen; Jones, Robert L., Covert variable information on ID documents and methods of making same.

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10. Beseth Jeffrey ; Langner Dale R., Data card having a retractable handle.

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11. Minelli Jeffrey D. ; Laverick David, Data card having a retractable handle.

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12. Cady, James W.; Goodwin, Paul, Die module system.

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13. Cady,James W.; Goodwin,Paul, Die module system.

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14. Gerard Cachier FR; Jean-Yves Daden FR; Alain Grancher FR; Ludovic Michel FR, Electronic card encapsulating at least one IC chip and the method for producing the same.

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15. Suhir Ephraim (Randolph NJ) Weld John D. (Succasunna NJ), Electronic package with reduced bending stress.

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16. Prince David G. ; Principe Daniel D., Encapsulated printed circuit assembly and method and manufacturing the same.

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17. Wehrly, Jr., James Douglas; Goodwin, Paul; Rapport, Russell, Flex circuit constructions for high capacity circuit module systems and methods.

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18. Cady, James W.; Wilder, James; Roper, David L.; Wehrly, Jr., James Douglas, Flex-based circuit module.

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19. Kyouichi Kohama JP; Yusuke Hirai JP; Kaname Tamada JP; Toshinobu Sueyoshi JP; Ryuzo Fukao JP; Kazuhiko Daido JP, Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module.

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20. Wehrly, Jr., James Douglas; Wilder, James; Goodwin, Paul; Wolfe, Mark, Heat sink for a high capacity thin module system.

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21. Young Paul R. (Cromwell CT) Richard David W. (Southington CT) Bazar Leonard (Middletown CT), Hermetically sealed memory or PC card unit having a frame, header and covers in bonded engagement.

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22. Wehrly, Jr.,James Douglas; Wilder,James; Goodwin,Paul; Wolfe,Mark, High capacity thin module system.

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23. Wehrly, Jr.,James Douglas; Wilder,James; Goodwin,Paul; Wolfe,Mark, High capacity thin module system.

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24. Goodwin, Paul, High capacity thin module system and method.

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25. Goodwin, Paul, High capacity thin module system and method.

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26. Goodwin,Paul, High capacity thin module system and method.

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27. Myers, Scott A.; Pascolini, Mattia; Dinh, Richard Hung Minh; Weber, Trent; Schlub, Robert; Nickel, Josh; Hill, Robert; Jin, Nanbo; Tan, Tang Yew, High tolerance connection between elements.

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28. Myers, Scott; Pascolini, Mattia; Dinh, Richard; Weber, Trent; Schlub, Robert; Nickel, Josh; Hill, Robert; Jin, Nanbo; Tan, Tang, High tolerance connection between elements.

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29. Koh, Wei, High-capacity memory card and method of making the same.

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30. Leighton, Keith R., Hot lamination process for the manufacture of a combination contact/contactless smart card.

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31. Leighton Keith, Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom.

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32. Sakamoto Noriaki,JPX ; Shimizu Hisashi,JPX, IC card module, manufacturing method therefor, hybrid integrated circuit module, and manufacturing method thereof.

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33. Jones, Robert; Bi, Daoshen; Mailloux, Dennis, Identification card printer-assembler for over the counter card issuing.

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34. Jones,Robert L.; Moore,Hannah J., Identification document with integrated circuit and antenna in a layered document structure.

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35. Schneck, Nelson T.; Duggan, Charles F.; Jones, Robert L.; Bi, Daoshen, Image processing techniques for printing identification cards and documents.

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36. Schneck, Nelson; Duggan, Charles F.; Jones, Robert; Bi, Daoshen, Image processing techniques for printing identification cards and documents.

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37. Labrec, Brian, Increasing thermal conductivity of host polymer used with laser engraving methods and compositions.

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38. Labrec, Brian C., Increasing thermal conductivity of host polymer used with laser engraving methods and compositions.

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39. Theodossiou, George; Jones, Robert L., Laser etched security features for identification documents and methods of making same.

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40. Onozawa Tetsuya,JPX, Memory card and its manufacturing method.

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41. Ramey Samuel C. ; Simpson Jeffrey S., Memory card connector and cover apparatus and method.

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42. Goodwin, Paul, Memory module system and method.

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43. Kalis Robert M., Method and apparatus for connecting circuit boards.

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44. Robert M. Kalis, Method and apparatus for connecting circuit boards.

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45. Rietzler, Manfred, Method and semifinished product for producing an inlay.

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46. Koh,Wei H.; Chen,Ben W.; Chen,David H. D., Method for molding a small form factor digital memory card.

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47. Weber Patrick O. (San Jose CA), Method for transfer molding standard electronic packages and apparatus formed thereby.

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48. Lechner,Johannes, Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor.

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49. Koh, Wei, Method of fabricating a chip.

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50. Koh, Wei, Method of fabricating a chip.

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51. Partridge, Julian; Roper, David; Goodwin, Paul, Modified core for circuit module system and method.

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52. Goodwin, Paul; Cady, James W., Module thermal management system and method.

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53. LaBrec, Brian C.; Anderson, Joseph; Jones, Robert L.; Batey, Danielle, Multiple image security features for identification documents and methods of making same.

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54. Labrec, Brian C.; Anderson, Joseph; Jones, Robert L.; Batey, Danielle, Multiple image security features for identification documents and methods of making same.

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55. Jones, Robert; Bi, Daoshen; Duggan, Charles F.; Schneck, Nelson T., Optically variable personalized indicia for identification documents.

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56. Wehrly, Jr., James Douglas; Wolfe, Mark; Goodwin, Paul, Optimized mounting area circuit module system and method.

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57. Roper,David L.; Cady,James W.; Wilder,James; Wehrly, Jr.,James Douglas; Buchle,Jeff; Dowden,Julian, Pitch change and chip scale stacking system and method.

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58. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification ca.

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59. Leighton Keith R., Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards.

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60. Cho, Sung Dae, Reel-deployed printed circuit board.

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61. Takeda Mitsunori,JPX ; Igarashi Eiichi,JPX ; Yoshida Hideyo,JPX, Sheet-framed IC carrier and method for producing the same.

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62. Takeda, Mitsunori; Igarashi, Eiichi; Yoshida, Hideyo, Sheet-framed IC carrier and method for producing the same.

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63. Chen, Ben Wei; Wang, Jin S.; Chen, David Hong-Dien, Small form factor molded memory card and a method thereof.

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64. Roper, David L.; Wehrly, Jr., Douglas; Wolfe, Mark, Split core circuit module.

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65. Partridge, Julian; Wehrly, Jr., James Douglas; Roper, David L.; Villani, Joseph, Stacked module systems.

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66. Partridge,Julian; Wehrly, Jr.,James Douglas; Roper,David, Stacked module systems and method.

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67. Roeters,Glen E; Ross,Andrew C, Stacking system and method.

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68. Howard, James V.; Frazier, Francis; Siamak, Parviz, Systems and methods for managing and detecting fraud in image databases used with identification documents.

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69. Jones, Robert, Systems, compositions, and methods for full color laser engraving of ID documents.

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70. Goodwin, Paul; Cady, James W.; Wehrly, Douglas, Thin module system and method.

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71. Goodwin,Paul, Thin module system and method.

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72. Goodwin,Paul, Thin module system and method.

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73. Clayton James E., Thin multichip module.

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74. Jones, Robert L.; Kenen, Leo M., Three dimensional data storage.

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75. Weber Patrick O. ; Brueggeman Michael A., Transfer molded PCMCIA standard cards.

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76. Rowley, Henry A.; Baluja, Shumeet, Transportation routing.

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77. Rowley, Henry Allan; Baluja, Shumeet, Transportation routing.

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78. Rowley, Henry; Baluja, Shumeet, Transportation routing.

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79. Rowley, Henry; Baluja, Shumeet, Transportation routing.

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80. Rowley, Henry; Baluja, Shumeet, Transportation routing.

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81. Keith R. Leighton, Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.

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82. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.

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