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Polishing pad 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-007/22
출원번호 US-0468348 (1990-01-22)
발명자 / 주소
  • Tuttle Mark E. (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 188  인용 특허 : 0

초록 ▼

A polishing pad for semiconductor wafers, having a face shaped to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece. The favored face shape is a sunburst pattern having nontapered rays, co

대표청구항 ▼

Apparatus to polish a workpiece, comprising: a polishing pad, rotatable about an axis and having a face perpendicular to and coaxial with said axis; said face, in use, to be urged against the workpiece to facilitate polishing of same; wherein said face is configured to be able to provide to the work

이 특허를 인용한 특허 (188)

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