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Piezoresistive pressure transducer with a conductive elastomeric seal 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01C-010/10
출원번호 US-0826206 (1992-01-24)
발명자 / 주소
  • Maurer Dean J. (Freeport IL)
출원인 / 주소
  • Honeywell, Inc. (Minneapolis MN 02)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록

A low cost piezoresistive pressure transducer utilizing premolded elastomeric seals in which at least one seal is electrically conductive. A piezoresistive stress sensitive element in the form of a diaphragm of semiconductor material having a thickened rim is held at its rim between a pair of premol

대표청구항

A pressure transducer assembly comprising: a diaphragm of semiconductor material having a central portion with a stress sensitive device formed thereon electrically conductive regions extending from the stress sensitive device to a peripheral portion of said diaphragm; a housing containing said diap

이 특허를 인용한 특허 (72)

  1. Selvan,Thirumani A.; Sadasivan,Saravanan, Amplified flow through pressure sensor.
  2. D. Joseph Maurer, Bridge pressure sensor.
  3. Gravel James L. ; Johnson Bruce L. ; Romo Mark, Carrier assembly for fluid sensor.
  4. Janusz Bryzek ; David W. Burns ; Sean S. Cahill ; Steven S. Nasiri, Chip-scale packaged pressure sensor.
  5. Bryzek Janusz ; Burns David W. ; Nasiri Steven S. ; Cahill Sean S., Compensated semiconductor pressure sensor.
  6. Krüger, Hans; Stelzl, Alois, Component arrangement provided with a carrier substrate.
  7. Sun, Mei; Champagne, Pascal, Component package for maintaining safe operating temperature of components.
  8. Speldrich, Brian; Wade, Richard, Conductive elastomeric seal and method of fabricating the same.
  9. Delmaere, Christophe, Current transducer.
  10. Sid, Salim, Current transducer.
  11. Selvan,Thirumani A.; Shenoy,Gururaj U.; Sadasivan,Saravanan; Muniraju,Raghavendra, Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology.
  12. Bonne Ulrich (Hopkins MN) Maurer D. Joseph (Pearl City IL), Differential pressure sensor with stress reducing pressure balancing means.
  13. Sid, Salim, Electrical current transducer.
  14. Sid, Salim, Electrical current transducer.
  15. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, Electrical module comprising a MEMS microphone.
  16. Bauer, Christian; Krueger, Hans; Stelzl, Alois, Encapsulated electrical component and production method.
  17. Krueger,Hans; Portmann,J��rgen; Nicolaus,Karl; Feiertag,Gregor; Stelzl,Alois, Encapsulated electronic component and production method.
  18. Halteren Aart van,NLX ; Kristensen Poul Rosenkilde,DKX, Flexible substrate transducer assembly.
  19. Karbassi, Said; Maurer, D. Joseph, Flow sensor package.
  20. Dmytriw, Anthony M.; Ricks, Lamar F., Flow sensor with conditioning-coefficient memory.
  21. Thanigachalam, Palani; Eckhardt, Todd; Wade, Richard, Force sensor.
  22. Wade, Richard, Force sensor.
  23. Wade, Richard, Force sensor.
  24. Bradley, Alistair David; Eckhardt, Todd; Jones, Ryan; Wade, Richard, Force sensor apparatus.
  25. Matthew Gerald Morris ; Donald Frederic Schwartz, Force sensor assembly for an infusion pump.
  26. Selvan, Thirumani A.; Sanjee, Raghu, Force sensor package and method of forming same.
  27. Guentner Ronald E. ; Maurer D. Joseph ; Sheriff Alan V., Force sensor with multiple piece actuation system.
  28. Vishal, Vaibhaw; Sun, Mei, Heat shield module for substrate-like metrology device.
  29. Steven S. Nasiri ; David W. Burns ; Janusz Bryzek ; Sean S. Cahill, Hermetic packaging for semiconductor pressure sensors.
  30. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, MEMS microphone.
  31. Pahl, Wolfgang, MEMS microphone, production method and method for installing.
  32. Leidl, Anton; Krueger, Hans; Stelzl, Alois; Pahl, Wolfgang; Seitz, Stefan, MEMS package and method for the production thereof.
  33. Pahl, Wolfgang; Leidl, Anton; Seitz, Stefan; Krueger, Hans; Stelzl, Alois, MEMS package and method for the production thereof.
  34. Bang Christopher, Media compatible packages for pressure sensing devices.
  35. Bang Christopher A. ; Just Marcus S. ; Yang Xiaofeng ; Nagy Michael L., Media compatible pressure sensor.
  36. Stewart, Carl; Davis, Richard Alan; Morales, Gilberto, Media isolated differential pressure sensor with cap.
  37. Pahl, Wolfgang, Method for applying a structured coating to a component.
  38. Stewart,Carl E.; Davis,Richard A., Method to reduce die edge shorting on pressure sensors using conductive elastomeric seals.
  39. Bey, Paul Prehn; Hoover, William; Speldrich, Jamie; Jones, Ryan, Modular sensor assembly including removable sensing module.
  40. Bey, Jr., Paul P.; Becke, Craig S.; Speldrich, Jamie W.; Blumhoff, Christopher M., Packaging multiple measurands into a combinational sensor system using elastomeric seals.
  41. Takizawa Takashi,JPX ; Itoh Tatsuya,JPX ; Itoh Kazuyuki,JPX, Piezoelectric conversion type semiconductor device.
  42. Takizawa Takashi,JPX ; Ito Tatsuya,JPX ; Nishida Hiroshi,JPX, Piezolectric conversion type semiconductor device.
  43. Bryzek Janusz ; Burns David W. ; Cahill Sean S. ; Nasiri Steven S. ; Starr James B., Piezoresistive pressure sensor with sculpted diaphragm.
  44. Taniguchi Naohiro,JPX ; Katayama Shuichi,JPX ; Hori Masami,JPX, Pressure sensor.
  45. Winterer Jurgen,DEX ; Bootz Eric,DEX ; Stadler Bernd,DEX ; Neu Achim,DEX ; Janczek Thies,DEX, Pressure sensor component and production method.
  46. Wohlgemuth, Christian, Pressure sensor having a compressible element.
  47. Wohlgemuth, Christian, Pressure sensor having a compressible element.
  48. McCurdy, Jr., William B.; Newton, Gary S.; Newton, Ronald O.; Newton, Steven R.; Miller, Gary Lynn, Pressure sensor module.
  49. Sokn Erick Lee, Pressure sensor package.
  50. Sokn Erick L., Pressure sensor package and method of making the same.
  51. Sokn Erick L., Pressure sensor package and method of making the same.
  52. Sokn Erick Lee, Pressure sensor package and method of making the same.
  53. Speldrich Jamie W., Pressure sensor with a compressible insert to prevent damage from freezing.
  54. Maurer D. Joseph, Pressure sensor with reduced dead space achieved through an insert member with a surface groove.
  55. Lavado, Michael J.; Younes, Amin; Altrui, Stephanie; Pellon, Christian; Janek, Timothy, Pressure transducer.
  56. Maurer, D. Joseph, Pressure transducer.
  57. Renken, Wayne G., Process condition sensing wafer and data analysis system.
  58. Renken, Wayne G., Process condition sensing wafer and data analysis system.
  59. Renken, Wayne G.; Sun, Mei H., Process condition sensing wafer and data analysis system.
  60. Renken, Wayne G.; Sun, Mei H., Process condition sensing wafer and data analysis system.
  61. Ricks, Lamar F.; Bey, Paul P., Self diagnostic measurement method to detect microbridge null drift and performance.
  62. Winterer Jurgen,DEX ; Beer Gottfried,DEX, Semiconductor device.
  63. Motohashi, Satoru; Takahashi, Hideaki; Karasawa, Tatsuya; Terashima, Kenshi, Semiconductor module.
  64. Masahiro Aratani JP; Yasuaki Makino JP, Semiconductor sensor.
  65. Karbassi, Said; Maurer, D. Joseph, Sensor package for flush mounting of a sensor.
  66. Cook ; Sr. James T. (Antioch CA) Arnold David D. (Saratoga CA) Cartsonas Christos (Menlo Park CA), Sensor package with exterior compensation circuit.
  67. Ahmad Farid, Sensor packaging having an integral electrode plug member.
  68. Maurer D. Joseph ; Karbassi Said ; Gehman Richard W., Sensor packaging using heat staking technique.
  69. Cook ; Sr. James T. (Antioch CA) Arnold David D. (Saratoga CA) Cartsonas Christos (Menlo Park CA), Side port package for micromachined fluid sensor.
  70. Cook ; Sr. James T. ; Arnold David D. ; Cartsonas Christos, Side port package for micromachined fluid sensor.
  71. Wade, Richard; Ricks, Lamar Floyd, Temperature compensated force sensor.
  72. Rozgo, Paul; Bradley, Alistair; Jones, Ryan S.; Ricks, Lamar F., Wet/wet differential pressure sensor based on microelectronic packaging process.
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