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Apparatus for packaging and cooling integrated circuit chips 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
  • H01L-023/24
  • H01L-023/34
출원번호 US-0485850 (1990-02-22)
발명자 / 주소
  • Fox Leslie R. (Boxborough MA)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 76  인용 특허 : 0

초록 ▼

A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The circuit chips are mounted circuit side down on the base, and include flexible lead frames for attachment to

대표청구항 ▼

As assembly for packaging and cooling circuit chips comprising: a base; compliant mean disposed on said base; a heat sink for engagement with said base having an inner top surface; and a clamshell housing completely surrounding at least a first circuit chip, said clamshell housing being held in posi

이 특허를 인용한 특허 (76)

  1. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
    상세보기
  2. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  4. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
    상세보기
  5. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
    상세보기
  6. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Apparatus including processor.
    상세보기
  7. Zschieschang, Olaf; Laschek-Enders, Andreas, Arrangement of at least one power semiconductor module and a printed circuit board.
    상세보기
  8. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
    상세보기
  9. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
    상세보기
  10. Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P., Chamber sealing valve.
    상세보기
  11. Aoki,Russell S.; Crocker,Michael T.; Carter,Daniel P., Chamber sealing valve.
    상세보기
  12. Leobandung, Effendi, Chip with shelf life.
    상세보기
  13. Hoffman Paul R. (Modesto CA) Mahulikar Deepak (Madison CT) Brathwaite George A. (Hayward CA) Solomon Dawit (Manteca CA) Parthasarathi Arvind (North Branford CT), Components for housing an integrated circuit device.
    상세보기
  14. Weixel Mark, Composite thermal interface pad.
    상세보기
  15. O'Neal Sean P. ; Liao Reynold L. ; Gilchrist Phillip C., Cooling apparatus for an electronic package.
    상세보기
  16. Ghoshal, Uttam; Miner, Andrew Carl, Cooling of electronics by electrically conducting fluids.
    상세보기
  17. Ghoshal,Uttam; Miner,Andrew Carl, Cooling of electronics by electrically conducting fluids.
    상세보기
  18. Ghoshal,Uttam, Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle.
    상세보기
  19. Chen Yang-Shiau,TWX, Die set for welding fins and a base plate of a heat sink.
    상세보기
  20. Michael Z. Eckblad ; Russell S. Aoki ; Chia-Pin Chiu ; Correy D. Cooks ; Richard Zhao, Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die.
    상세보기
  21. Kataria, Vijay; Bednarz, Jacob A., Electronic module having compliant spacer.
    상세보기
  22. Behun, John Richard; Hall, Douglas J., Electronic package.
    상세보기
  23. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
    상세보기
  24. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
    상세보기
  25. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
    상세보기
  26. Wu, Wow, Heat sink assembly incorporating mounting frame.
    상세보기
  27. Paquette, Jeffrey; Cheyne, Scott R.; Ellsworth, Joseph R.; Martinez, Michael P.; Trahan, Michael R., Heat sink interface having three-dimensional tolerance compensation.
    상세보기
  28. Chillara Satya N., High density integrated circuit package including interposer.
    상세보기
  29. Bartlow Howard D., High power semiconductor device having bolt-down ceramic platform.
    상세보기
  30. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Information processing device.
    상세보기
  31. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  32. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  33. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
    상세보기
  34. Lofland, Steve; Noble, Scott; Tirumala, Murli; Pollard, II, Lloyd L., Integrated heat sink for different size components with EMI suppression features.
    상세보기
  35. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
    상세보기
  36. Smith, C. W. Sinjin; Newton, Charles M.; Jaynes, Paul B., Method and apparatus for sealing flex circuits made with an LCP substrate.
    상세보기
  37. McNeil Greg D. ; Buuck David C. ; Foster Alan D., Method and apparatus for supporting a component on a substrate.
    상세보기
  38. Davidson, Howard, Method for bonding substrates.
    상세보기
  39. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  40. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  41. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
    상세보기
  42. Lutkiewicz, Eric; Van Leeuwen, Bob; KleinBeernink, Peter J., Method of mounting a butterfly package on a PCB.
    상세보기
  43. Hawthorne Emily, Method of mounting microelectronic circuit package.
    상세보기
  44. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
    상세보기
  45. Kulkarni, Deepak V.; Deppisch, Carl L.; Arana, Leonel R.; Constable, Gregory S.; Srinivasan, Sriram, Methods of fabricating low melting point solder reinforced sealant and structures formed thereby.
    상세보기
  46. Kulkarni, Deepak V.; Deppisch, Carl L.; Arana, Leonel R.; Constable, Gregory S.; Srinivasan, Sriram, Methods of fabricating low melting point solder reinforced sealant and structures formed thereby.
    상세보기
  47. Chan, Seng-Kum; Arekar, Chaitanya; Xu, Hui, Methods, apparatuses and systems for mid-plane mounting parallel optical communications modules on circuit boards.
    상세보기
  48. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Moisture barrier seals for cooled IC chip module assemblies.
    상세보기
  49. Mach Terry P. ; Jackson Kurt R. ; Glover Alfred H. ; Dave Chandrakant ; Hodges Frank ; Morris Stephen L., Mounting assembly for electrical components and heat sinks.
    상세보기
  50. Ohki Ken'ichi,JPX ; Muratake Kiyoshi,JPX ; Inoue Hidetoshi,JPX ; Tsujimura Takehisa,JPX, Multi-chip semiconductor device.
    상세보기
  51. Ohki Ken'ichi,JPX ; Muratake Kiyoshi,JPX ; Inoue Hidetoshi,JPX ; Tsujimura Takehisa,JPX, Multi-chip semiconductor device and method of producing the same.
    상세보기
  52. Goebl, Christian, Power semiconductor module.
    상세보기
  53. Kanelis, Konstantinos, Power semiconductor module and cooling element for holding the power semiconductor module.
    상세보기
  54. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Printer apparatus.
    상세보기
  55. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Processing device.
    상세보기
  56. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Processor apparatus.
    상세보기
  57. Akio Nakamura JP, Semiconductor device in a recess of a semiconductor plate.
    상세보기
  58. Nakamura, Akio, Semiconductor device in a recess of a semiconductor plate.
    상세보기
  59. Nakamura,Akio, Semiconductor device in a recess of a semiconductor plate.
    상세보기
  60. Cardwell, Charles S., Semiconductor device package with improved cooling.
    상세보기
  61. Cardwell, Charles S., Semiconductor device package with improved cooling.
    상세보기
  62. Kim,Sang uk; Im,Yun hyeok, Semiconductor package having enhanced heat dissipation and method of fabricating the same.
    상세보기
  63. Hawthorne Emily, Support member for mounting a microelectronic circuit package.
    상세보기
  64. Christopher J. Scafidi, Surface mounted conduction heat sink.
    상세보기
  65. Scafidi Christopher J., Surface mounted conduction heat sink.
    상세보기
  66. Scafidi, Christopher J., Surface mounted conduction heat sink.
    상세보기
  67. Sunada Shigemasa (Ukyo-ku JPX), Surface mounting type diode.
    상세보기
  68. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
    상세보기
  69. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
    상세보기
  70. Ghoshal,Uttam, System employing temporal integration of thermoelectric action.
    상세보기
  71. Kolman Frank ; Brownell Michael, Thermal grease insertion and retention.
    상세보기
  72. Ettehadieh Ehsan ; Kaul Sunil ; Malladi Dev, Thermal management enhancements for cavity packages.
    상세보기
  73. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
    상세보기
  74. Hasnain Shabbir ; Rakesh Bhatia, Thermally conductive interface member.
    상세보기
  75. Ghoshal,Uttam, Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator.
    상세보기
  76. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
    상세보기

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