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Mixture thin film forming apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0801627 (1991-12-04)
우선권정보 JP-0071293 (1989-03-22)
발명자 / 주소
  • Ohnishi Hiroshi (Amagasaki JPX) Hoshinouchi Susumu (Amagasaki JPX)
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha (Tokyo JPX 03)
인용정보 피인용 횟수 : 42  인용 특허 : 0

초록

The present invention is directed to a mixture thin film forming apparatus for accumulating gasified components on a substrate which is arranged in a reaction chamber. According to the present invention, respective components of a gas supply system, which are different in heat capacity from each oth

대표청구항

A mixture thin film forming apparatus for accumulating gasified components on a substrate which is arranged in a reaction chamber, said apparatus comprising: a plurality of sublimation chambers respectively containing a plurality of solid raw materials being different in gasification temperature fro

이 특허를 인용한 특허 (42)

  1. Barbee Steven George ; Conti Richard Anthony ; Kostenko Alexander ; Sarma Narayana V. ; Wilson Donald Leslie ; Wong Justin Wai-Chow ; Zuhoski Steven Paul, Apparatus for chemical vapor deposition of aluminum oxide.
  2. Visweswaren Sivaramakrishnam ; Hiroshi Nishizato JP; Jun Zhao ; Ichiro Yokoyama JP, Apparatus for vaporization sequence for multiple liquid precursors used in semiconductor thin film applications.
  3. Bang Won ; Chen Chen-An, Clog resistant gas delivery system.
  4. Bang,Won; Wang,Yen Kun; Ghanayem,Steve, Clog-resistant gas delivery system.
  5. Olson Roger Allen ; Kopitzke ; III Frederick William ; O'Connor Joseph Patrick, Continuous vapor deposition apparatus.
  6. Horsky, Thomas N.; Milgate, III, Robert W., Controlling the flow of vapors sublimated from solids.
  7. Derderian,Garo J.; Morrison,Gordon, Deposition system to provide preheating of chemical vapor deposition precursors.
  8. Kim,Jun young; Choi,Byoung lyong; Lee,Eun kyung, Diffusion system.
  9. Toda Akihito,JPX, Etching equipment including a post processing apparatus for removing a resist film, polymer, and impurity layer from an object.
  10. Hara, Masamichi, Film forming apparatus and film forming method.
  11. Watabe Masahiro (Kawasaki JPX), Flow control valve for use in fabrication of semiconductor devices.
  12. Bauch,Hartmut; Bewig,Lars; Klippe,Lutz; K��pper,Thomas, Gas supply method in a CVD coating system for precursors with a low vapor pressure.
  13. Long, Maolin, Gas temperature control for a plasma process.
  14. Long, Maolin, Gas temperature control for a plasma process.
  15. Okase Wataru (Sagamihara JPX) Hasei Masaaki (Sagamihara JPX), Heat treatment processing apparatus and cleaning method thereof.
  16. Wary John ; Beach William F. ; Olson Roger A., Internally heated pyrolysis zone.
  17. Van Buskirk Peter C. ; Bilodeau Steven M. ; Carl ; Jr. Ralph J., Liquid delivery system, heater apparatus for liquid delivery system, and vaporizer.
  18. Allen Michael B. ; Swartz Dennis C. ; Lee Patrick B., Low pressure chemical vapor deposition apparatus including a process gas heating subsystem.
  19. Hong, Sukwon; Tran, Toan; Mallick, Abhijit; Liang, Jingmei; Ingle, Nitin K., Low shrinkage dielectric films.
  20. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale C.; Krull, Wade A., Method and apparatus for extending equipment uptime in ion implantation.
  21. Horsky, Thomas N.; Milgate, III, Robert W.; Sacco, Jr., George P.; Jacobson, Dale C.; Krull, Wade A., Method and apparatus for extending equipment uptime in ion implantation.
  22. Ye, Zhiyuan; Kim, Yihwan, Method and apparatus for gas delivery.
  23. Ku, Vincent W.; Chen, Ling; Wu, Dien-Yeh; Ouye, Alan H.; Wysok, Irena, Method and apparatus for gas temperature control in a semiconductor processing system.
  24. John Schmitt ; Frank P. Chang ; Xin Shen Guo ; Ling Chen ; Christophe Marcadal, Method and apparatus for improved control of process and purge material in a substrate processing system.
  25. J?rgensen, Holger; Strauch, Gerhard Karl; Schwambera, Markus, Method and device for depositing in particular organic layers using organic vapor phase deposition.
  26. Iwata, Kenichi; Okada, Yoshikatsu, Method employing plurality of particles and pressure differentials to deposit film.
  27. Shinagawa Keisuke,JPX ; Fujimura Shuzo,JPX ; Matoba Yuuji,JPX ; Nakano Yoshimasa,JPX ; Takeuchi Tatsuya,JPX ; Miyanaga Takeshi,JPX, Method for controlling apparatus for supplying steam for ashing process.
  28. Cook, Kevin S.; Manning, Dennis; McIntyre, Edward K.; Goldberg, Richard, Method for extending equipment uptime in ion implantation.
  29. Watabe Masahiro,JPX, Method for growing a semiconductor layer.
  30. Naoki Nagashima JP; Natsuki Takahashi JP; Toshio Negishi JP, Method of manufacturing thin organic film.
  31. Hotti,Esko, Method, equipment, and material for creating a surface on a metal.
  32. Bencher, Christopher Dennis; Luo, Lee, Methods and devices to reduce defects in dielectric stack structures.
  33. Olson Roger A. ; Beach William F. ; Wary John, Parylene deposition apparatus including a heated and cooled dimer crucible.
  34. Wary John ; Beach William F. ; Olson Roger A., Parylene polymer layers.
  35. Derderian,Garo J.; Morrison,Gordon, Preheating of chemical vapor deposition precursors.
  36. Kent, Martin; Laflamme, Jr., Arthur H; Wallace, Jay; Hamelin, Thomas, Processing system and method for treating a substrate.
  37. Yuuki Tomohiro,JPX, Pyrogenic wet thermal oxidation of semiconductor wafers.
  38. Hyodo,Hiroyuki; Yamawaki,Hideki; Maruyama,Kenji; Hida,Masaharu, Solid material gasification method, thin film formation process and apparatus.
  39. Hong, Jong-Won; Jeong, Min-Jae; Na, Heung-Yeol; Kang, Eu-Gene; Chang, Seok-Rak, Source gas supply unit, and deposition apparatus and method using the same.
  40. Yao,Isoji, Steam-supplying apparatus for hairdressing and beauty care.
  41. Fuchita Eiji,JPX, Ultra fine particle gas deposition apparatus.
  42. Inokuchi Yasuhiro,JPX ; Ikeda Fumihide,JPX, Wet-oxidation apparatus and wet-oxidation method.
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