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Cleaning system using a solvent 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/10
  • B08B-003/12
출원번호 US-0719776 (1991-06-24)
우선권정보 JP-0008302 (1989-01-30); JP-0017516 (1989-01-30); JP-0098910 (1989-04-20); JP-0098911 (1989-04-20); JP-0132817 (1989-05-29)
발명자 / 주소
  • Tanaka Masato (Nagano) Ichikawa Tadayoshi (Nagano JPX)
출원인 / 주소
  • Kabushiki Kaisha Tiyoda Sisakusho (Koushoku JPX 03)
인용정보 피인용 횟수 : 51  인용 특허 : 0

초록

A cleaning method and cleaning system using an organic solvent such as Freon. A cleaning tank is closed after an article to be cleaned is placed within the cleaning tank. The solvent is supplied to the cleaning tank from a solvent storage tank. The article is cleaned with the supplied solvent. After

대표청구항

A cleaning system using solvent, comprising: a cleaning tank including a cleaning tank body having an upper open end and a closed bottom, the cleaning tank body being adapted to receive an article to be cleaned, and a closure for sealingly closing the upper open end; a storage tank for storing a sol

이 특허를 인용한 특허 (51)

  1. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  3. Mahood Michael A. (Ontario CAX), Circuit and method for controlling electrical heater in a distiller.
  4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  5. Kerpels, Fred; Luckman, Joel A.; Overdevest, Pieter E.; Wright, Tremitchell, Dry cleaning method.
  6. Luckman, Joel A.; Leitert, Andrew; Sunshine, Richard A.; Wright, Tremitchell L., Fabric laundering apparatus adapted for using a select rinse fluid.
  7. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  8. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  9. Jones, William D., High pressure fourier transform infrared cell.
  10. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  11. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  12. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Jacobson, Peter M., Leadless cardiac pacemaker system for usage in combination with an implantable cardioverter-defibrillator.
  15. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  16. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  17. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  18. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  19. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  20. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  21. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  22. Luckman, Joel A.; Wright, Tremitchell L., Method for fluid recovery in a semi-aqueous wash process.
  23. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  24. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  25. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  26. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  27. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  28. Wright, Tremitchell L.; Luckman, Joel A., Methods and apparatus to accelerate the drying of aqueous working fluids.
  29. Wright,Tremitchell L.; Luckman,Joel A., Multifunctioning method utilizing a two phase non-aqueous extraction process.
  30. Estes, Kurt A.; Conrad, Daniel C.; Kovich, Mark Bradley; Wright, Tremitchell L., Non-aqueous washing apparatus and method.
  31. Conrad, Daniel C.; Wright, Tremitchell; Dalton, Michael T.; Estes, Kurt; Kovich, Mark B.; Leitert, Andrew J.; Lau, Brooke Lindsay Steel; Brown Green, Cinnamon S.; Krumbein, Holli; Maki, Kenyata Joi; Luckman, Joel A.; McAllister, Karl David; Wyatt Smith, Vicki Lyn, Non-aqueous washing machine and methods.
  32. Wright, Tremitchell; Conrad, Daniel C.; Deboer, Christopher C.; Dalton, Michael Thomas; Luckman, Joel A.; Leitert, Andrew J.; Lau, Brooke Lindsay-Steel; McAllister, Karl David, Non-aqueous washing machine and methods.
  33. Wright, Tremitchell L.; Conrad, Daniel C.; Krefman, Stephen David; Luckman, Joel A.; Sunshine, Richard A.; Leitert, Andrew, Non-aqueous washing machine with modular construction.
  34. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  35. Fong,Jon Jody; Soliz,Raymond M., Post processor for three-dimensional objects.
  36. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  37. Wuester,Christopher D., Process flow thermocouple.
  38. Cash Alan B., Process for regenerating spent solvent.
  39. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  40. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  41. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  42. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  43. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  44. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  45. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  46. DePalma, Philip W.; Sherman, Robert, System and method for controlling humidity in a cryogenic aerosol spray cleaning system.
  47. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  48. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  49. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  50. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  51. Ohba Takayuki,JPX ; Suzuki Toshiya,JPX ; Murakami Seishi,JPX, Vacuum treatment apparatus and a method for manufacturing semiconductor device therein.
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