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Complexing agent for displacement tin plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-018/31
  • B05D-005/12
출원번호 US-0799136 (1991-11-27)
발명자 / 주소
  • Dodd John R. (Wilmington) Arduengo
  • III Anthony J. (Wilmington) King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA)
출원인 / 주소
  • McGean-Rohco, Inc. (Cleveland OH 02)
인용정보 피인용 횟수 : 28  인용 특허 : 0

초록

An environmentally innocuous effective replacement for thiourea is disclosed for use as a complexing agent in displacement plating processes in which the plating solution is applied to the substrate surface to be plated by immersion or by spraying, cascading, pouring and the like. The replacement co

대표청구항

An aqueous plating solution for the displacement plating of a substrate metal surface with an other metal comprising: (i) a metal ion of a free metal, wherein the free metal is different from the metal of the substrate surface; (ii) a complexing agent which is a an imidazole-2-thione compound of the

이 특허를 인용한 특허 (28)

  1. Levey,Peter R.; Brown,Neil D., Acid electrolytes.
  2. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  3. Bokisa George S. ; Willis William J., Aqueous immersion plating bath and method for plating.
  4. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen, Composite coatings for whisker reduction.
  5. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen, Composite coatings for whisker reduction.
  6. Wessling, Bernhard, Dispersions of intrinsically conductive polymers.
  7. Cooper,Emanuel I.; Goldsmith,Charles C.; Kilpatrick,Stephen; Mojica,Carmen M.; Nye, III,Henry A., Immersion plating and plated structures.
  8. Cooper,Emanuel I.; Goldsmith,Charles C.; Kilpatrick,Stephen; Mojica,Carmen M.; Nye, III,Henry A., Immersion plating and plated structures.
  9. Barz, Iris; Kilian, Arnd; Muskulus, Markus; Schafsteller, Britta, Immersion tin or tin alloy plating bath with improved removal of cuprous ions.
  10. Redline, Ronald; Sawoska, David; Kukanskis, Peter; Ferrier, Donald; Yakobson, Eric, Method for enhancing the solderability of a surface.
  11. Redline, Ronald; Sawoska, David; Kukanskis, Peter; Ferrier, Donald; Yakobson, Eric, Method for enhancing the solderability of a surface.
  12. Redline, Ronald; Sawoska, David; Kukanskis, Peter; Ferrier, Donald; Yakobson, Eric, Method for enhancing the solderability of a surface.
  13. Bierings, Gust; Bjarnason, Bjarni; Frennesson, Göran; Sjöberg, Jenny, Method of etching copper on cards.
  14. Bishop Craig V. ; Bokisa George S. ; Durante Robert J. ; Kochilla John R., Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom.
  15. Bishop, Craig V.; Bokisa, George S.; Durante, Robert J.; Kochilla, John R., Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom.
  16. Bishop, Craig V.; Bokisa, George S.; Durante, Robert J.; Kochilla, John R., Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom.
  17. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.
  18. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.
  19. Edelstein,Daniel C.; Kang,Sung Kwon; McGlashan Powell,Maurice; O'Sullivan,Eugene J.; Walker,George F., Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped.
  20. Mathew, Varughese; Acosta, Eddie; Chatterjee, Ritwik; Garcia, Sam S., Micropad formation for a semiconductor.
  21. Bokisa George S., Multilayer circuit boards and processes of making the same.
  22. McKenney, Darryl J.; Demaso, Arthur J.; Gosselin, Kathy A.; Wilson, Craig S., Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards.
  23. Soutar, Andrew McIntosh; McGrath, Peter Thomas, Process for silver plating in printed circuit board manufacture.
  24. Soutar, Andrew McIntosh; McGrath, Peter Thomas, Process for silver plating in printed circuit board manufacture.
  25. George S. Bokisa ; Craig V. Bishop ; John R. Kochilla, Process for whisker-free aqueous electroless tin plating.
  26. Soutar, Andrew McIntosh; McGrath, Peter Thomas, Solderability enhancement by silver immersion printed circuit board manufacture.
  27. Robinson, Gregory H.; Wang, Yuzhong, Synthesis and stabilization of neutral compounds with homonuclear bonds.
  28. Bokisa, George S.; Bishop, Craig V.; Kochilla, John R., Tin whisker-free printed circuit board.
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