[특허]Heat transfer apparatus

Heat transfer apparatus 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F28D-015/02 H01L-023/427
출원번호	US-0700257 (1991-05-15)
우선권정보	JP-0124084 (1990-05-16)
발명자 / 주소	Koizumi Hisao (Zushi JPX)
출원인 / 주소	Kabushiki Kaisha Toshiba (Kawasaki JPX 03)
인용정보	피인용 횟수 : 80 인용 특허 : 0

초록 ▼

A cooling apparatus as one embodiment of a heat transfer apparatus of the present invention comprises a closing loop pipe line means enclosing a predetermined amount of liquid heating medium inside, a heat receiving section receiving heat from an object to be cooled, and transferring heat to said heating medium in said closing loop pipe means, a radiating section taking heat away from said heating medium in said closing loop pipe means, and one or more check values formed in said closing loop pipe line and allowing only one way flow of said heating medium from said heat receiving section to said radiating section direction. The present invention provides a heat transfer apparatus, which is represented by the above-mentioned cooling apparatus having a simple structure which does not need a circulation apparatus serving as a mechanical power source such as a pump.

대표청구항 ▼

A heat transfer apparatus comprising: closing loop pipe line means enclosing a predetermined amount of liquid heating medium inside; a heat receiving section receiving heat from an object to be cooled wherein said object to be cooled includes an electronic part, and transferring heat to said heating medium in said closing loop pipe means; a radiating section taking heat away from said heating medium in said closing loop pipe means; a first check valve formed to move said heating medium in a first direction toward said radiating section by a volume expansion generated when at least one part of said heating medium evaporates in said heat receiving section; a second check valve formed to move said heating medium in only the same direction as said first direction by a volume contraction generated when said heating medium evaporated in said radiating section is cooled; wherein a diameter of the pipe of said closing loop pipe line means close to said heat receiving section is set to be adjusted to a piston type flow state when said heating medium receives heat and evaporates, and changes to a two phase flow of vapor-liquid; and wherein when the pipe of said closing loop pipe line close to said heat receiving section is horizontally arranged, an inner diameter d (mm) of said pipe is set as follows: d150 [x]√srsr3).

이 특허를 인용한 특허 (80)

Grundl Andreas,DEX ; Hoffmann Bernhard,DEX, Assembly for switching electrical power.
상세보기
Tsai,Ming Kun, CPU cooler.
상세보기
Berchowitz, David M., CPU cooling device using thermo-siphon.
상세보기
Dupont, Vincent, Capillary-pumping heat-transport device.
상세보기
Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
상세보기
Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
상세보기
Luo, Chin Kuang, Computer module.
상세보기
Osakabe,Hiroyuki; Kawaguchi,Kiyoshi; Suzuki,Masahiko, Cooling apparatus boiling and condensing refrigerant.
상세보기
Cheon Kioan, Cooling apparatus for electronic devices.
상세보기
Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion.
상세보기
Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
상세보기
Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
상세보기
Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.
상세보기
Nakano, Masao; Ashitani, Hiromasa; Fukushima, Masafumi, Cooling device for semiconductor elements.
상세보기
Malhammar .ANG.ke,SEX ; Palm Bjorn,SEX, Cooling system for electronics.
상세보기
Jones, Alan R., Cooling systems.
상세보기
Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
상세보기
Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
상세보기
Miyazaki,Ryuuji; Suzuki,Masumi; Hirano,Minoru, Cooling unit.
상세보기
Ishikawa, Kenichi; Hisano, Katsumi, Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit.
상세보기
Laskaris, Evangelos Trifon, Cryogenic cooling system for rotor having a high temperature super-conducting field winding.
상세보기
Chandratilleke Rohana,JPX ; Ohtani Yasumi,JPX ; Takahashi Masahiko,JPX ; Nakagome Hideki,JPX ; Yoshino Tatsuya,JPX, Cryogenic heat pipe.
상세보기
Dupont, Vincent, Device for heat transport with two-phase fluid.
상세보기
Nakamura, Takayoshi; Tamba, Akihiro; Saito, Ryuichi; Nishihara, Atsuo, Electrical apparatus, cooling system therefor, and electric vehicle.
상세보기
Nakamura, Takayoshi; Tamba, Akihiro; Saito, Ryuichi; Nishihara, Atsuo, Electrical apparatus, cooling system therefor, and electric vehicle.
상세보기
Nakamura,Takayoshi; Tamba,Akihiro; Saito,Ryuichi; Nishihara,Atsuo, Electrical apparatus, cooling system therefor, and electric vehicle.
상세보기
Ishikawa, Kenichi; Hisano, Katsumi, Electronic apparatus including a circulation path for circulating cooling medium.
상세보기
Ishikawa, Kenichi; Hisano, Katsumi, Electronic apparatus including a cooling unit for cooling a heat generating component.
상세보기
Ishimine, Junichi; Suzuki, Masahiro, Electronic device.
상세보기
Ranchy Eric,FRX ; Petitbon Alain,FRX ; Broqua Nadia,FRX ; Cazabat Stephane,FRX ; Estop Pascal,FRX ; Crouzy Sophie,FRX, Electronic power module, and electronic power system comprising a plurality of said modules.
상세보기
Bilski, W. John, Electronics cabinet and rack cooling system and method.
상세보기
Agostini, Francesco; Yesin, Berk; Agostini, Bruno, Evaporator and cooling circuit.
상세보기
Kobayashi, Takashi; Ogushi, Tetsuro; Tsujimori, Atsushi; Kamoya, Yoshihiro, Evaporator, a heat absorber, a thermal transport system and a thermal transport method.
상세보기
Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
상세보기
Malone,Christopher G.; Simon,Glenn C., External liquid loop heat exchanger for an electronic system.
상세보기
Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Geometrically reoriented low-profile phase plane heat pipes.
상세보기
Takada, Tomohito; Hiro, Naoki; Yamamoto, Yasushi; Oki, Katsuyoshi; Nasako, Kenji, Heat carrier.
상세보기
Kuo Ching-Sung,TWX, Heat dissipating device.
상세보기
Kennelly, Patrick, Heat dissipation from ACB toes.
상세보기
Batchelder John Samuel, Heat exchange apparatus.
상세보기
Quisenberry,Tony; Havis,Clark R., Heat pipe connection system and method.
상세보기
Ito Akira,JPX, Heat pipe method for making the same and radiating structure.
상세보기
Källmark, Magnus; Hedberg, Klas; Jonsson, Fredrik, Heat transfer arrangement and electronic housing comprising a heat transfer arrangement.
상세보기
Dupont, Vincent, Heat transfer device using capillary pumping.
상세보기
Yin, Xuejun; Song, Jisheng, Heat tube device utilizing cold energy and application thereof.
상세보기
Symons,Robert S., Integrated liquid cooling device for electronic components.
상세보기
Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
상세보기
Lee,Hsieh Kun; Chen,Chun Chi; Zhang,Jianjun, Integrated liquid cooling system for electrical components.
상세보기
L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
상세보기
Matsushita,Shinji; Oikawa,Hironori, Liquid cooling module.
상세보기
Kitano, Makoto; Naganawa, Takashi; Yoshitomi, Yuji; Minamitani, Rintaro; Ohashi, Shigeo; Ashiwake, Noriyuki; Kondo, Yoshihiro; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using thereof.
상세보기
Kitano,Makoto; Naganawa,Takashi; Yoshitomi,Yuji; Minamitani,Rintaro; Ohashi,Shigeo; Ashiwake,Noriyuki; Kondo,Yoshihiro; Nakagawa,Tsuyoshi, Liquid cooling system and personal computer using thereof.
상세보기
Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
상세보기
Sauciuc, Ioan; Scott, Ward; Chrysler, Gregory M., Method and apparatus for dissipating heat from an electronic device.
상세보기
Sauciuc,Ioan; Scott,Ward; Chrysler,Gregory M., Method and apparatus for dissipating heat from an electronic device.
상세보기
Quisenberry, Tony, Method and system for automotive battery cooling.
상세보기
Quisenberry, Tony, Method for automotive battery cooling.
상세보기
Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes.
상세보기
Hardesty, Robert E., Micro-channel pulsating heat pipe.
상세보기
Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
상세보기
Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
상세보기
Huang Bin-Juine,TWX, Network-type heat pipe device.
상세보기
Garner, Scott D., Porous vapor valve for improved loop thermosiphon performance.
상세보기
Baker David, Pump, and earth-testable spacecraft capillary heat transport loop using augmentation pump and check valves.
상세보기
Junge, Brent Alden; Kyriacou, Stephanos; Weirich, Kristin Marie; Katu, Umakant Suresh; Mitchell, Alan Joseph, Refrigerator.
상세보기
Mitchell, Alan Joseph; Junge, Brent Alden, Refrigerator.
상세보기
Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
상세보기
Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.
상세보기
Lehman, Bret W.; Matteson, Jason Aaron; White, Graham Michael, System for cooling a component in a computer system.
상세보기
Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
상세보기
Garner, Scott D., Thermal management system and method for electronics system.
상세보기
Garner, Scott D., Thermal management system and method for electronics system.
상세보기
Garner,Scott D., Thermal management system and method for electronics system.
상세보기
Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.
상세보기
Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.
상세보기
Dupont, Vincent, Two-phase heat transfer device.
상세보기
Ippoushi, Shigetoshi; Uehara, Nobuaki; Yamada, Akira; Ogushi, Tetsuro; Yamakage, Hisaaki, Vapor-lift pump heat transport apparatus.
상세보기
Ippoushi, Shigetoshi; Uehara, Nobuaki; Yamada, Akira; Ogushi, Tetsuro; Yamakage, Hisaaki, Vapor-lift pump heat transport apparatus.
상세보기
Ippoushi,Shigetoshi; Uehara,Nobuaki; Yamada,Akira; Ogushi,Tetsuro; Yamakage,Hisaaki, Vapor-lift pump heat transport apparatus.
상세보기
Higuchi, Masato; Kawanami, Yasuhiko; Terazono, Katsushi; Higashikawa, Koji; Sasaki, Akira; Morihara, Takayuki; Aoki, Takashi; Ito, Tetsuya; Nakabayashi, Yukihisa; Isobe, Tasuku; Koguma, Kiyonori, Wiring board and power conversion device.
상세보기

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Heat transfer apparatus 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (80)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

Heat transfer apparatus 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허를 인용한 특허 (80)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트