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Wet micro-channel wafer chuck and cooling method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/473
출원번호 US-0888040 (1992-05-22)
발명자 / 주소
  • Hamburgen William R. (Menlo Park CA) Fitch John S. (Newark CA)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 75  인용 특허 : 0

초록

A wet micro-channel wafer chuck (10) holds a semiconductor wafer 12 having a plurality of high powered chips (14) held in place with vacuum provided in the chuck (10). The chuck (10) has a plurality of micro-channels (16), which extend along cooling fins (18), on which the semiconductor wafer (12) r

대표청구항

A chuck for cooling a planar electronic substrate which comprises a body having a planar upper surface, a plurality of micro-channels extending into said body from said planar upper surface, said plurality of micro-channels being separated from one another by individual ones of a plurality of coolin

이 특허를 인용한 특허 (75)

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