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Method of bonding a sputter target-backing plate assembly assemblies produced thereby

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
  • B23K-031/00
출원번호 US-0853095 (1992-03-18)
발명자 / 주소
  • Mueller John J. (Hilliard OH) Stellrecht David E. (Columbus OH)
출원인 / 주소
  • Tosoh SMD, Inc. (Grove City OH 02)
인용정보 피인용 횟수 : 51  인용 특허 : 0

초록

Methods of preparing a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a plurality of grooves in one of the metal surfaces to be joined in the bonding process. The grooves are each provided in a closed, loop configuration or pattern. The t

대표청구항

In a method of preparing a bonded sputter target/backing plate assembly comprising a target composed of a first metal or alloy to be sputtered and an underlying backing plate member composed of a second metal or alloy, an improved method for joining said target and backing plate along mating surface

이 특허를 인용한 특허 (51)

  1. Kim, Jaeyeon, Aluminum-comprising target/backing plate structures.
  2. Forster, John C.; Tang, Xianmin, Apparatus and method for improved darkspace gap design in RF sputtering chamber.
  3. Zhang Hao, Diffusion bonded sputter target assembly and method of making.
  4. Zhang, Hao, Diffusion bonded sputter target assembly and method of making same.
  5. Anthony F. Beier ; Janine K. Kardokus ; Susan D. Strothers, Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same.
  6. Beier Anthony F. ; Kardokus Janine K. ; Strothers Susan D., Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same.
  7. Zhang, Hao; Hart, Jeff; Bolcavage, Ann, Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers.
  8. Bolcavage, Ann; Hart, Jeff, Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers.
  9. Burdis, Mark Samuel; Weir, Douglas Glenn John, Electrochromic devices and methods.
  10. Burdis, Mark Samuel; Weir, Douglas Glenn John, Electrochromic devices and methods.
  11. Mauck, Justin; Dillon, Steve, Explosion welded design for cooling components.
  12. Giri,Manish; Harding,Philip H.; Taylor,Mark Sanders; Hess,Jeffery S., Fluid ejection device having a layer with a discontinuity.
  13. Houle, Sabina J.; Deppisch, Carl, Heat sink with preattached thermal interface material and method of making same.
  14. Smathers, David B.; Heimanson, Dorian; Gutkin, Michael, Hermetic sealing of target/backing plate assemblies using electron beam melted indium or tin.
  15. Ivanov,Eugene Y.; Smathers,David B.; Wickersham, Jr.,Charles E.; Poole,John E., High purity sputter targets with target end-of-life indication and method of manufacture.
  16. Katsumi Watanabe JP, Highly gas tight chamber and method of manufacturing same.
  17. Watanabe, Katsumi, Highly gas tight chamber and method of manufacturing same.
  18. Kardokus Janine K. ; Morales Diana, Hot pressed and sintered sputtering target assemblies and method for making same.
  19. Melvin K. Holcomb ; William E. Barnes ; Steven L. Bardus, Insert target assembly and method of making same.
  20. Giri, Manish; Harding, Philip H.; Taylor, Mark Sanders; Hess, Jeffrey S., Layer with discontinuity over fluid slot.
  21. Ivanov, Eugene Y.; Conard, Harry W., Low temperature sputter target bonding method and target assemblies produced thereby.
  22. Ivanov,Eugene Y., Low temperature sputter target/backing plate method and assembly.
  23. Facey,Joseph C.; Ward,Ivan, Method for centering a sputter target onto a backing plate and the assembly thereof.
  24. Lo, Chi-Fung; Draper, Darryl, Method for consolidating and diffusion-bonding powder metallurgy sputtering target.
  25. Stellrecht David E., Method for producing near net shape planar sputtering targets and an intermediate therefor.
  26. Gilman Paul S. ; Kulkarni Shailesh ; Blanchet Jean Pierre,FRX, Method of bonding a sputtering target to a backing plate.
  27. Wickersham, Jr., Charles E., Method of bonding sputtering target materials.
  28. Wickersham, Jr.,Charles E.; Workman,David P., Method of forming a sputtering target assembly and assembly made therefrom.
  29. Kobayashi, Kiyokazu, Method of joining steel products, method of processing junction surfaces of steel products, and reinforcing member.
  30. Kardokus Janine K., Method of making high purity copper sputtering targets.
  31. Todd A. Cleland ; Garrard Hume, Method of manufacturing an orifice plate having a plurality of closed slits.
  32. Ivanov, Eugene Y., Method of manufacturing sputter targets with internal cooling channels.
  33. Ivanov, Eugene Y., Method of manufacturing sputter targets with internal cooling channels.
  34. Parfeniuk, Chris; Beier, Tony, Methods of bonding physical vapor deposition target materials to backing plate materials.
  35. Kim, Jaeyeon, Methods of bonding two aluminum-comprising masses to one another.
  36. Shah, Ritesh P.; Steele, David E.; Turner, William R.; Beier, Anthony F.; Kardokus, Janine K.; Strothers, Susan D., Ni-plated target diffusion bonded to a backing plate and method of making same.
  37. Parfeniuk, Chris; Beier, Tony, Physical vapor deposition target constructions.
  38. Demaray Richard Ernest ; Hosokawa Akihiro ; Herrera Manuel J., Preparation and bonding of workpieces to form sputtering targets and other assemblies.
  39. Jaffe, Jonathan; Powers, Scott, Railroad tie of non-homogeneous cross section useful in environments deleterious to timber.
  40. Yuan, Yongwen; Ivanov, Eugene Y.; Liu, Yang; Frausto, Phil; Miao, Weifang, Silicon sputtering target with special surface treatment and good particle performance and methods of making the same.
  41. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
  42. Facey, Joseph C.; Ward, Ivan, Sputter target and backing plate assembly.
  43. Bardus Steven L. ; Qamar Sohail S. ; Bansal Anurag, Sputter target assembly having a metal-matrix-composite backing plate and methods of making same.
  44. Gilman Paul S. ; Hunt Thomas J. ; Annavarapu Suresh, Sputter target/backing plate assembly and method of making same.
  45. Gilman Paul S. ; Hunt Thomas J. ; Annavarapu Suresh, Sputter target/backing plate assembly and method of making same.
  46. Hunt Thomas J. ; Gilman Paul S., Sputter target/backing plate assembly and method of making same.
  47. Hunt Thomas J. ; Gilman Paul S., Sputter target/backing plate assembly and method of making same.
  48. Plaisted, Dean T.; Asbas, Michael; Ferrin, Lawrence C.; Carter, Paul G.; Laverriere, Guy P., Sputtering target.
  49. Ohhashi Tateo (Kitaibaraka JPX) Fukuyo Hideaki (Kitaibaraka JPX) Sawamura Ichiroh (Kitaibaraka JPX) Nakamura Kenichirou (Kitaibaraka JPX) Fukushima Atsushi (Kitaibaraka JPX) Nagasawa Masaru (Kitaibar, Sputtering target assembly having solid-phase bonded interface.
  50. Ye, Yan; White, John M., Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers.
  51. Zhu, Zhen-Dong; Li, Qun-Qing; Zhang, Li-Hui; Chen, Mo; Jin, Yuan-Hao; Fan, Shou-Shan, Three-dimensional nano-structure array.
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