[특허]Heat exchanger for solid-state electronic devices

Heat exchanger for solid-state electronic devices 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F28F-007/02
출원번호	US-0820365 (1992-01-14)
발명자 / 주소	Matthews James A. (Milpitas CA)
출원인 / 주소	Microunity Systems Engineering, Inc. (Sunnyvale CA 02)
인용정보	피인용 횟수 : 54 인용 특허 : 0

초록 ▼

A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.

대표청구항 ▼

A heat exchanger for cooling a heat generating device comprising: an elongated ribbon having first and second sides, at least said first side including a microscopic recessed area, said ribbon being spirally wrapped into a core element such that said first and second sides abut each other to create enclosed microscopic channels throughout said core; coolant manifold means for flowing a coolant fluid through said enclosed microscopic channels in parallel fashion said device being cooled when placed in contact with said core element.

이 특허를 인용한 특허 (54)

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Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
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Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
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Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
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Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
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Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
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Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
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Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
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A	생활필수품
A62	인명구조; 소방(사다리 E06C)
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A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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Heat exchanger for solid-state electronic devices 원문보기

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Heat exchanger for solid-state electronic devices 원문보기

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