$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for improving planarity of chemical-mechanical planarization operations

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/302
  • H01L-021/463
출원번호 US-0961565 (1992-10-15)
발명자 / 주소
  • Tuttle Mark E. (Boise ID) Doan Trung T. (Boise ID) Fox Angus C. (Boise ID) Sandhu Gurtej S. (Boise ID) Stroupe Hugh E. (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 274  인용 특허 : 0

초록

A method and apparatus for improving planarity of chemical mechanical planarization of semiconductor wafers. The wafer is affixed to the planar surface of a wafer carrier. A planar platen, on which is mounted a polishing pad, is moved about in a plane parallel to the pad surface with either an orbit

대표청구항

A chemical mechanical planarization apparatus comprising a platen having a horizontal, planar upper surface; a slurry-wetted, uniformly-thick polishing pad affixed to said upper surface; a wafer carrier having a lower planar surface to which one side of a semiconductor wafer is removably attachable,

이 특허를 인용한 특허 (274)

  1. Sakatani Yoshiaki,JPX ; Ueda Kazumasa,JPX ; Takeuchi Yoshiaki,JPX, Abrasive composition and use of the same.
  2. Molnar,Charles J., Advanced finishing control.
  3. Taylor, Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.
  4. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.
  5. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.
  6. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.
  7. Taylor,Theodore M., Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces.
  8. Taylor,Theodore M., Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization.
  9. Taylor, Theodore M., Apparatus and method for enhanced processing of microelectronic workpieces.
  10. Chandrasekaran,Nagasubramaniyan, Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces.
  11. Chandrasekaran,Nagasubramaniyan, Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces.
  12. Doan Trung Tri ; Sandhu Gurtej Singh ; Grief Malcolm K., Apparatus and method for planar end-point detection during chemical-mechanical polishing.
  13. Jackson Paul D. ; Lisi E. Terry ; Reeves Lee A., Apparatus and method for polishing a substrate.
  14. Trent T. Ward, Apparatus and method for reducing removal forces for CMP pads.
  15. Ward Trent T., Apparatus and method for reducing removal forces for CMP pads.
  16. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
  17. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
  18. Ward, Trent T., Apparatus and method for reducing removal forces for CMP pads.
  19. Blalock,Guy T., Apparatus and method for removing material from microfeature workpieces.
  20. Homayoun Talieh, Apparatus and method of polishing with slurry delivery through a polishing pad.
  21. John M. White ; Phillip R. Sommer, Apparatus for chemical mechanical planarization having nested load cups.
  22. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; De Geus Richard ; Lee Lawrence L., Apparatus for chemical mechanical polishing.
  23. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; de Geus Richard ; Lee Lawrence L., Apparatus for chemical mechanical polishing.
  24. Lee Lawrence L., Apparatus for chemical mechanical polishing.
  25. Herb, John D.; Schultz, Stephen C., Apparatus for distributing a fluid through a polishing pad.
  26. Eran Dvir IL; Moshe Finarov IL; Eli Haimovich IL; Beniamin Shulman IL, Apparatus for optical inspection of wafers during polishing.
  27. Finarov,Moshe, Apparatus for optical inspection of wafers during processing.
  28. Taylor, Theodore M., Apparatus for planarizing microelectronic workpieces.
  29. Lee Michael G. ; Beilin Solomon I., Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation.
  30. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
  31. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
  32. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.
  33. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
  34. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.
  35. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.
  36. Agarwal,Vishnu K.; Chopra,Dinesh, Apparatuses for forming a planarizing pad for planarization of microlectronic substrates.
  37. Agarwal,Vishnu K., Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.
  38. Taylor,Travis R.; Mehring,Carsten, Assembly and method for generating a hydrodynamic air bearing.
  39. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Block for polishing a wafer during manufacture of integrated circuits.
  40. Desorcie Daniel D. ; Lebel Richard J. ; McKinney Charles A. ; Nadeau Rock ; Rickard ; Jr. Timothy J. ; Smith ; Jr. Paul H. ; Sturtevant Douglas K. ; Tiersch Matthew T., CMP wafer carrier for preferential polishing of a wafer.
  41. Chopra, Dinesh, COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH.
  42. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
  43. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
  44. Chandrasekaran, Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
  45. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
  46. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.
  47. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.
  48. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.
  49. Zuniga Steven M. ; Blumenkranz Stephen J., Carrier head design for a chemical mechanical polishing apparatus.
  50. Shendon, Norm, Carrier head for a chemical mechanical polishing apparatus.
  51. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical mechanical polish machines and fabrication process using the same.
  52. Wang,Dapeng, Chemical mechanical polishing apparatus and methods for chemical mechanical polishing.
  53. Talieh Homayoun, Chemical mechanical polishing apparatus using multiple polishing pads.
  54. Talieh Homayoun (San Jose CA), Chemical mechanical polishing apparatus with improved slurry distribution.
  55. Shendon Norm, Chemical mechanical polishing apparatus with orbital polishing.
  56. Shendon, Norman; Sherwood, Michael; Lee, Harry, Chemical mechanical polishing carrier head.
  57. Wang, Dapeng, Chemical mechanical polishing pads.
  58. Tolles, Robert D.; Shendon, Norman; Somekh, Sasson; Perlov, Ilya; Gantvarg, Eugene; Lee, Harry Q., Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion.
  59. Tolles,Robert D.; Shendon,Norm; Somekh,Sasson; Perlov,Ilya; Gantvarg,Eugene; Lee,Harry Q., Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion.
  60. Tolles,Robert D.; Shendon,Norm; Somekh,Sasson; Perlov,Ilya; Gantvarg,Eugene; Lee,Harry Q., Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion.
  61. Talieh Homayoun, Chemical mechanical polishing with a small polishing pad.
  62. Talieh Homayoun, Chemical mechanical polishing with a small polishing pad.
  63. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
  64. Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
  65. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical-mechanical polish machines and fabrication process using the same.
  66. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Wu Kun-Lin,TWX ; Chiu Daniel,TWX ; Yang Chih-Chiang,TWX ; Wu Juan-Yuan,TWX ; Chiu Hao-Kuang,TWX, Chemical-mechanical polish machines and fabrication process using the same.
  67. Peter Mok, Chemical-mechanical polishing apparatus with circular motion pads.
  68. Morgan ; III Clifford Owen (Burlington VT) Schmidt Dennis Arthur (South Burlington VT) Theodoseau Philip Nicholas (Richmond VT), Chemical-mechanical polishing apparatus with slurry removal system and method.
  69. Sato Junichi (Tokyo JPX), Chemical-mechanical polishing method and apparatus using ultrasound applied to the carrier and platen.
  70. Hardy, L. Charles; Kranz, Heather K.; Wood, Thomas E.; Kaisaki, David A.; Gagliardi, John J.; Clark, John C.; Savu, Patricia M.; Clark, Philip G., Compositions and methods for modifying a surface suited for semiconductor fabrication.
  71. Williams Roger O. ; Buhler James D., Containment ring for substrate carrier apparatus.
  72. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
  73. Pant Anil K. ; Young Douglas W. ; Meyer Anthony S. ; Volodarsky Konstantin ; Weldon David E., Control of chemical-mechanical polishing rate across a substrate surface.
  74. Pant Anil K. ; Breivogel Joseph R. ; Young Douglas W. ; Rivera Robert M., Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher.
  75. Lee Michael G. ; Beilin Solomon I., Controlled retention of slurry in chemical mechanical polishing.
  76. Chopra Dinesh, Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with.
  77. Blalock Guy T. ; Stroupe Hugh E. ; Gordon Brian F., Deadhesion method and mechanism for wafer processing.
  78. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Deadhesion method and mechanism for wafer processing.
  79. Blalock, Guy T.; Stroupe, Hugh E.; Gordon, Brian F., Deadhesion method and mechanism for wafer processing.
  80. Wang, Dapeng, Deformable pad for chemical mechanical polishing.
  81. Doan, Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.
  82. Charles J Molnar, Finishing element with finishing aids.
  83. Dinesh Chopra ; Gundu Sabde, Fixed abrasive chemical-mechanical planarization of titanium nitride.
  84. Molnar Charles J, Fixed abrasive finishing element having aids finishing method.
  85. Chopra, Dinesh; Sabde, Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
  86. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
  87. Chopra,Dinesh; Sabde,Gundu, Fixed-abrasive chemical-mechanical planarization of titanium nitride.
  88. Shendon Norman ; Sherwood Michael ; Lee Harry, Fluid pressure regulated wafer polishing head.
  89. Norman Shendon ; Michael Sherwood ; Harry Lee, Fluid-pressure regulated wafer polishing head.
  90. Shendon Norman ; Sherwood Michael ; Lee Harry, Fluid-pressure regulated wafer polishing head.
  91. Shendon,Norman; Sherwood,Michael; Lee,Harry, Fluid-pressure regulated wafer polishing head.
  92. Runnels Scott ; Toprac Anthony J., Forced-flow wafer polisher.
  93. Blalock Guy, Global planarization method and apparatus.
  94. Blalock Guy, Global planarization method and apparatus.
  95. Blalock, Guy, Global planarization method and apparatus.
  96. Kassir Salman M ; Walsh Thomas A, Grinding process and apparatus for planarizing sawed wafers.
  97. Robinson Karl M. ; Stroupe Hugh, High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers.
  98. Karl M. Robinson ; Hugh Stroupe, High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers.
  99. Molnar,Charles J, In situ finishing control.
  100. Molnar, Charles J, In situ friction detector method and apparatus.
  101. Franklin, Timothy J.; Marohl, Dan A., Integrated platen assembly for a chemical mechanical planarization system.
  102. Franklin, Timothy J.; Marohl, Dan A., Integrated platen assembly for a chemical mechanical planarization system.
  103. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
  104. Talieh Homayoun ; Weldon David Edwin, Linear polisher and method for semiconductor wafer planarization.
  105. Marcyk, Gerald; Cadien, Ken, Low temperature chemical mechanical polishing of dielectric materials.
  106. Woolston, Thomas G., Marketing goods with bar codes.
  107. Woolston, Thomas G., Marketplace payments.
  108. Hayden Daniel B., Membrane-like filter element for chemical mechanical polishing slurries.
  109. Daniel F. Kennedy ; Victor Belitsky ; Arul Shanmugasundram, Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system.
  110. Browning Jim ; Xia Zhongyi, Method and apparatus for burn-in and test of field emission displays.
  111. Lee Kyu Hong,KRX ; Lee Yong Byouk,KRX ; Kang Sang Won,KRX, Method and apparatus for chemical mechanical polishing.
  112. Sabde, Gundu M.; Hofmann, James J.; Joslyn, Michael J.; Lee, Whonchee, Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids.
  113. Norm Gitis ; Michael Vinogradov, Method and apparatus for controlled polishing.
  114. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
  115. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
  116. Eaton, Robert A., Method and apparatus for distributing fluid to a polishing surface during chemical mechanical polishing.
  117. Meikle, Scott G., Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates.
  118. Meikle,Scott G., Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates.
  119. Meikle,Scott G., Method and apparatus for forming a planarizing pad having a film and texture elements for planarization of microelectronic substrates.
  120. Kramer, Stephen J.; Joslyn, Michael J., Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  121. Kramer,Stephen J.; Joslyn,Michael J., Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  122. Hempel ; Jr. Eugene O. (Garland TX), Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process.
  123. Robinson Karl M., Method and apparatus for increasing chemical-mechanical-polishing selectivity.
  124. Robinson, Karl M., Method and apparatus for increasing chemical-mechanical-polishing selectivity.
  125. Robinson Karl M., Method and apparatus for increasing-chemical-polishing selectivity.
  126. Meikle Scott G., Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization.
  127. Meikle Scott G. (Boise ID), Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization.
  128. Gitis, Norm; Meyman, Aleksandr; Vinogradov, Michael; Faynberg, Mikhail; Dorfman, Vlad, Method and apparatus for monitoring polishing plate condition.
  129. Noburu Shimizu JP; Norio Kimura JP, Method and apparatus for polishing workpiece.
  130. Noburu Shimizu JP; Norio Kimura JP, Method and apparatus for polishing workpiece.
  131. Jayakumar Gurusamy ; Gee Sun Hoey ; Lawrence M. Rosenberg, Method and apparatus for providing and controlling delivery of a web of polishing material.
  132. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
  133. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
  134. Kistler,Rodney C.; Carswell,Andrew, Method and apparatus for removing material from microfeature workpieces.
  135. Wadensweiler, Ralph; Duboust, Alain; Chen, Liang-Yuh; Birang, Manoocher; Morad, Ratson; Butterfield, Paul D., Method and apparatus for substrate polishing.
  136. Wadensweiler, Ralph; Duboust, Alain; Chen, Liang-Yuh; Birang, Manoocher; Morad, Ratson; Butterfield, Paul D., Method and apparatus for substrate polishing.
  137. Moore, Scott E., Method and apparatus for supporting a microelectronic substrate relative to a planarization pad.
  138. Moore,Scott E., Method and apparatus for supporting a microelectronic substrate relative to a planarization pad.
  139. Leach Michael A., Method and structure for polishing a wafer during manufacture of integrated circuits.
  140. Leach Michael A. (345 Sheridan #204 Palo Alto CA 94306), Method and structure for polishing a wafer during manufacture of integrated circuits.
  141. Golden, Josh H.; Porshnev, Peter I.; Myers, Donald, Method and system for point of use recycling of ECMP fluids.
  142. Woolston, Thomas G., Method and system for retrieving information regarding an item posted for sale.
  143. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
  144. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
  145. Blalock, Guy T.; Stroupe, Hugh E.; Carroll, Lynn J., Method for applying uniform pressurized film across wafer.
  146. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; de Geus Richard ; Lee Lawrence L., Method for chemical mechanical polishing.
  147. Robinson Karl M. ; Walker Michael A., Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers.
  148. Robinson Karl M. ; Walker Michael A., Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers.
  149. Agarwal, Vishnu K.; Chopra, Dinesh, Method for forming a planarizing pad for planarization of microelectronic substrates.
  150. Kramer,Stephen J.; Joslyn,Michael J., Method for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  151. Fruitman Clinton O. ; Crosby Thomas K. ; Schlueter James, Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers.
  152. Taylor,Theodore M., Method for planarizing microelectronic workpieces.
  153. Shimizu Noburu,JPX ; Kimura Norio,JPX, Method for polishing workpieces and apparatus therefor.
  154. Ward,Trent T., Method for reducing removal forces for CMP pads.
  155. Iwamoto Jun,JPX ; Jinbu Yasuhiko,JPX, Method of and apparatus for tribochemically finishing ceramic workpiece.
  156. Bruxvoort Wesley J. ; Culler Scott R. ; Ho Kwok-Lun ; Kaisaki David A. ; Kessel Carl R. ; Klun Thomas P. ; Kranz Heather K. ; Messner Robert P. ; Webb Richard J. ; Williams Julia P., Method of modifying an exposed surface of a semiconductor wafer.
  157. Hudson, Guy F.; Walker, Michael A., Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate.
  158. Kaisaki David A. ; Kranz Heather K. ; Wood Thomas E. ; Hardy L. Charles, Method of planarizing the upper surface of a semiconductor wafer.
  159. Nakayoshi Yuichi,JPX, Method of polishing a semiconductor wafer.
  160. Hudson, Guy F.; Walker, Michael A., Method of removing material from a semiconductor substrate.
  161. Marshall, Brian, Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates.
  162. Marshall, Brian, Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates.
  163. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates.
  164. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  165. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  166. Blalock,Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.
  167. Lu, Jin, Methods and apparatuses for removing polysilicon from semiconductor workpieces.
  168. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
  169. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
  170. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
  171. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
  172. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.
  173. Elledge, Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
  174. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
  175. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
  176. Moore,Carter; Folkes,Elon; Castor,Terry, Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.
  177. Woolston, Thomas G., Methods and systems for searching for goods.
  178. Woolston, Thomas G., Methods and systems for searching for goods and services.
  179. Woolston, Thomas G., Methods and systems for searching for goods in a virtual marketplace.
  180. Marshall,Brian, Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates.
  181. Marsh, Eugene P., Methods for planarization of non-planar surfaces in device fabrication.
  182. Taylor,Theodore M., Methods for planarizing microelectronic workpieces.
  183. Moore,Carter; Folkes,Elon; Castor,Terry, Methods for planarizing workpieces, e.g., microelectronic workpieces.
  184. Taylor,Theodore M.; Kramer,Stephen J., Methods for removing doped silicon material from microfeature workpieces.
  185. Elledge,Jason B., Methods of manufacturing carrier heads for polishing micro-device workpieces.
  186. Breivogel Joseph R. (Aloha OR) Louke Samuel F. (Beaverton OR) Oliver Michael R. (Tigard OR) Yau Leopoldo D. (Portland OR) Barns Christopher E. (Portland OR), Orbital motion chemical-mechanical polishing apparatus and method of fabrication.
  187. Breivogel Joseph R. ; Louke Samuel F. ; Oliver Michael R. ; Yau Leopoldo D. ; Barns Christopher E., Orbital motion chemical-mechanical polishing method and apparatus.
  188. Adams John A. ; Smith Everett D. ; Schultz Stephen C., Oscillating orbital polisher and method.
  189. John A. Adams ; Everett D. Smith ; Stephen C. Schultz, Oscillating orbital polisher and method.
  190. Martin, Michael H.; Crump, Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.
  191. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, E.G., for microelectronic component test systems.
  192. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.
  193. Martin,Michael H.; Crump,Brett, Planarity diagnostic system, e.g., for microelectronic component test systems.
  194. Eugene P. Marsh, Planarization of non-planar surfaces in device fabrication.
  195. Marsh Eugene P., Planarization of non-planar surfaces in device fabrication.
  196. Doan Trung T. ; Blalock Guy T. ; Durcan Mark ; Meikle Scott G., Planarization process for semiconductor substrates.
  197. Doan, Trung T.; Blalock, Guy T.; Durcan, Mark; Meikle, Scott G., Planarization process for semiconductor substrates.
  198. Carpenter Craig M., Planarized base assembly and flat panel display device using the planarized base assembly.
  199. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.
  200. Joslyn, Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.
  201. Joslyn,Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.
  202. Wright, David Q., Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.
  203. Agarwal, Vishnu K.; Chopra, Dinesh, Planarizing pads for planarization of microelectronic substrates.
  204. Dapeng Wang, Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies.
  205. Li, Shijian; Birang, Manoocher; Emami, Ramin; Nagengast, Andrew; Brown, Douglas Orcutt; Wang, Shi-Ping; Scales, Martin; White, John, Platen for retaining polishing material.
  206. Akira Kubo JP, Polishing apparatus.
  207. Ito Kenya,JPX ; Aizawa Hideo,JPX, Polishing apparatus.
  208. Katsuoka, Seiji; Sekimoto, Masahiko; Miyazaki, Mitsuru; Noji, Naoki; Chiba, Kazuki; Fujimoto, Kenji, Polishing apparatus.
  209. Kunihiko Sakurai JP; Tetsuji Togawa JP; Nobuyuki Takada JP; Satoshi Wakabayashi JP; Kenichiro Saito JP; Masahiko Sekimoto JP; Takuji Hayama JP; Daisuke Koga JP, Polishing apparatus.
  210. Sakurai, Kunihiko; Togawa, Tetsuji; Takada, Nobuyuki; Wakabayashi, Satoshi; Saito, Kenichiro; Sekimoto, Masahiko; Hayama, Takuji; Koga, Daisuke, Polishing apparatus.
  211. Sakurai, Kunihiko; Togawa, Tetsuji; Takada, Nobuyuki; Wakabayashi, Satoshi; Saito, Kenichiro; Sekimoto, Masahiko; Hayama, Takuji; Koga, Daisuke, Polishing apparatus.
  212. Sakurai, Kunihiko; Togawa, Tetsuji; Takada, Nobuyuki; Wakabayashi, Satoshi; Saito, Kenichiro; Sekimoto, Masahiko; Hayama, Takuji; Koga, Daisuke, Polishing apparatus.
  213. Togawa, Tetsuji; Nabeya, Osamu, Polishing apparatus.
  214. Tolles,Robert D.; Shendon,Norm; Somekh,Sasson; Perlov,Ilya; Gantvarg,Eugene; Lee,Harry Q., Polishing apparatus having a trough.
  215. Kimura Norio (Fujisawa JPX) Sakata Fumihiko (Yokohama JPX) Takahashi Tamami (Yamato JPX), Polishing endpoint detection method.
  216. Elledge, Jason B., Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
  217. Phillip R. Sommer ; Paul B. Butterfield, Polishing media stabilizer.
  218. Sommer,Phillip R.; Butterfield,Paul, Polishing media stabilizer.
  219. Sommer,Phillip R.; Butterfield,Paul D., Polishing media stabilizer.
  220. Chiu, Allen; Chen, Shao-Yu; Jeng, Yu-Lung, Polishing pad.
  221. Dunn,Freddie L., Polishing pad conditioners having abrasives and brush elements, and associated systems and methods.
  222. Anjur Sriram P. ; Downing William C., Polishing pad for a semiconductor substrate.
  223. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  224. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pads for a semiconductor substrate.
  225. Hudson Guy F. ; Walker Michael A., Polishing polymer surfaces on non-porous CMP pads.
  226. Bohr Mark T. ; Brigham Lawrence N. ; Moon Peter K. ; Morimoto Seiichi, Polysilicon polish for patterning improvement.
  227. Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q. ; Somekh Sasson ; Tolles Robert D., Radially oscillating carousel processing system for chemical mechanical polishing.
  228. Lin Juen-Kuen,TWX ; Lai Chien-Hsin,TWX ; Peng Peng-Yih,TWX ; Chiu Hao-Kuang,TWX ; Wu Kun-Lin,TWX, Retainer ring design for polishing head of chemical-mechanical polishing machine.
  229. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.
  230. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.
  231. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
  232. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
  233. Taylor,Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.
  234. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods.
  235. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.
  236. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.
  237. Oliver Michael R., Slurry injection and recovery method and apparatus for chemical-mechanical polishing process.
  238. Talieh Homayoun, Substrate polishing apparatus.
  239. Talieh Homayoun, Substrate polishing apparatus.
  240. Talieh, Homayoun, Substrate polishing apparatus.
  241. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., System for chemical mechanical polishing having multiple polishing stations.
  242. Klein, Rita J., System for planarizing microelectronic substrates having apertures.
  243. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  244. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  245. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  246. Gurtej S. Sandhu ; Trung Tri Doan, System for real-time control of semiconductor wafer polishing.
  247. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  248. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  249. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  250. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing.
  251. Sandhu, Gurtej S.; Doan, Trung Tri, System for real-time control of semiconductor wafer polishing.
  252. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including heater.
  253. Sandhu Gurtej S. (Boise ID) Doan Trung Tri (Boise ID), System for real-time control of semiconductor wafer polishing including optical monitoring.
  254. Sandhu Gurtej S. ; Doan Trung Tri, System for real-time control of semiconductor wafer polishing including optical montoring.
  255. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
  256. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.
  257. Elledge, Jason B.; Chandrasekaran, Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
  258. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
  259. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
  260. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
  261. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.
  262. Bastian, Joseph A.; Reukauf, Jeremey T., Systems and methods for removing microfeature workpiece surface defects.
  263. Bastian,Joseph A.; Reukauf,Jeremey T., Systems and methods for removing microfeature workpiece surface defects.
  264. Moore,Carter; Folkes,Elon; Castor,Terry, Systems for planarizing workpieces, e.g., microelectronic workpieces.
  265. Kirchner, Eric J., Through-pad drainage of slurry during chemical mechanical polishing.
  266. Chopra Dinesh ; Meikle Scott G., Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing .
  267. Chopra Dinesh ; Meikle Scott G., Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing .
  268. Meikle Scott ; Schultz Laurence D., Under-pad for chemical-mechanical planarization of semiconductor wafers.
  269. Wright David Q. ; Skrovan John K., Variable abrasive polishing pad for mechanical and chemical-mechanical planarization.
  270. Wright David Q. ; Skrovan John K., Variable abrasive polishing pad for mechanical and chemical-mechanical planarization.
  271. Clover Richmond B. (1199 W. Vanderbilt Ct. Sunnyvale CA 94087), Vertically stacked planarization machine.
  272. Hudson Guy F. ; Robinson Karl M., Wafer backing member for mechanical and chemical-mechanical planarization of substrates.
  273. Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA) Talieh Homayoun (San Jose CA), Wafer polishing machine with fluid bearings and drive systems.
  274. White, John M.; Sommer, Phillip R.; Somekh, Sasson, Web lift system for chemical mechanical planarization.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트