Method for fabricating printed circuits
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
출원번호
US-0581030
(1990-09-12)
발명자
/ 주소
Bengston Jon E. (Newington CT) Larson Gary B. (Cheshire CT)
출원인 / 주소
MacDermid, Incorprated (Waterbury CT 02)
인용정보
피인용 횟수 :
195 인용 특허 :
0
초록
▼
Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nic
Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths. The invention renders the so-treated areas readily susceptible to the soldering of components thereat, thereby avoiding the need for hot air solder levelling.
대표청구항
▼
In a printed circuit comprising conductive areas affixed to an insulating substrate, said conductive areas including particular exposed conductive surfaces to which electronic components are to be electrically connected by soldering, the improvement wherein the particular exposed conductive surfaces
In a printed circuit comprising conductive areas affixed to an insulating substrate, said conductive areas including particular exposed conductive surfaces to which electronic components are to be electrically connected by soldering, the improvement wherein the particular exposed conductive surfaces comprise: (a) copper; (b) a first coating, over said copper, which consists essentially of (i) a first layer selected from the group consisting of electrolytic nickel, electrolytic cobalt, nickel-boron, and cobalt-boron, and (ii) a second layer, over said first layer, selected from the group consisting of nickel-phosphorus and cobalt-phosphorus; and (c) a second coating, over said first coating, which consists essentially of a protective metal, other than solder, which protects the first coating from oxidation, is wettable by solder, and does not adversely affect the solder connection between the particular exposed conductive surfaces and the electronic components electrically connected thereto by soldering.
이 특허를 인용한 특허 (195)
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