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Method for fabricating printed circuits

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/00
출원번호 US-0581030 (1990-09-12)
발명자 / 주소
  • Bengston Jon E. (Newington CT) Larson Gary B. (Cheshire CT)
출원인 / 주소
  • MacDermid, Incorprated (Waterbury CT 02)
인용정보 피인용 횟수 : 195  인용 특허 : 0

초록

Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nic

대표청구항

In a printed circuit comprising conductive areas affixed to an insulating substrate, said conductive areas including particular exposed conductive surfaces to which electronic components are to be electrically connected by soldering, the improvement wherein the particular exposed conductive surfaces

이 특허를 인용한 특허 (195)

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