이 특허를 인용한 특허 (64)

1. Davis Charles R. (Wappingers Falls NY) Egitto Frank D. (Binghamton NY) Skarvinko Eugene R. (Binghamton NY), Design of high density structures with laser etch stop.

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2. Smart, Donald V., Energy efficient, laser-based method and system for processing target material.

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3. Smart, Donald V., Energy-efficient, laser-based method and system for processing target material.

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4. Smart, Donald V., Energy-efficient, laser-based method and system for processing target material.

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5. Beste Russell D., Excimer laser ablation process control of multilaminate materials.

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6. Russell D. Beste, Excimer laser ablation process control of multilaminate materials.

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7. Shu Jing Shing ; Hwang Ming-Jang ; Moslehi Mehrdad M. ; Davis Cecil J., High throughput optical curing process for semiconductor device manufacturing.

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8. Jain, Kanti; Chae, Junghun; Appasamy, Sreeram, High throughput, low cost dual-mode patterning method for large area substrates.

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9. Gerner, Bradley J.; Andrews, John R.; Dolan, Bryan R.; Lin, Pinyen; DeCrescentis, Antonio, Inkjet ejector having an improved filter.

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10. Gerner, Bradley J.; Andrews, John R.; Dolan, Bryan R.; Lin, Pinyen; DeCrescentis, Antonio, Inkjet ejector having an improved filter.

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11. Smayling Michael C. (Missouri City TX), Integrated circuits formed in radiation sensitive material and method of forming same.

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12. Smayling Michael C. (Missouri City TX), Integrated circuits formed in radiation sensitive material and method of forming same.

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13. Sauerbrey Roland ; Smayling Michael C., Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture.

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14. Swenson Edward J. ; Sun Yunlong ; Harris Richard S., Laser based method and system for integrated circuit repair or reconfiguration.

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15. Egitto, Frank D.; Kresge, John S., Laser excision of laminate chip carriers.

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16. Brandinger, Jay J.; Hoffman, Brian D.; Polkowski, Edward T., Laser method for shaping of optical lenses.

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17. Datta Saswati, Laser repair process for printed wiring boards.

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18. Datta Saswati, Laser repair process for printed wiring boards.

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19. Gu, Bo; Smart, Donald V.; Cordingley, James J.; Lee, Joohan; Svetkoff, Donald J.; Johnson, Shepard D.; Ehrmann, Jonathan S., Laser-based method and system for removing one or more target link structures.

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20. Gu, Bo; Smart, Donald V.; Cordingley, James J.; Lee, Joohan; Svetkoff, Donald J.; Johnson, Shepard D.; Ehrmann, Jonathan S., Laser-based method and system for removing one or more target link structures.

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21. Gu, Bo; Smart, Donald V.; Cordingley, James J.; Lee, Joohan; Svetkoff, Donald J.; Johnson, Shepard D.; Ehrmann, Jonathan S., Laser-based system for memory link processing with picosecond lasers.

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22. Brandinger, Jay J., Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation.

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23. Rose Paul B. (Winter Park FL) Lamanna John L. (Winter Park FL), Method and system for fabricating a multilayer laminate for a printed wiring board, and a printed wiring board formed th.

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24. Benson, Peter A.; Watkins, Charles M., Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies.

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25. Benson, Peter A.; Watkins, Charles M., Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies.

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26. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate.

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27. Farnworth, Warren M.; Wood, Alan G.; Hembree, David R., Method for fabricating semiconductor components and interconnects with contacts on opposing sides.

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28. Akram,Salman; Farnworth,Warren M.; Wood,Alan G., Method for fabricating semiconductor components by forming conductive members using solder.

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29. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating semiconductor components using focused laser beam.

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30. Lee, Sung-Gue; Jang, Yong-Soon; Jin, Won-Hyeog, Method for forming exposed portion of circuit pattern in printed circuit board.

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31. Richard M. Graves ; Martin C. Herber, Method for preparing a high definition window in a conformally coated medical device.

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32. Sun, Yunlong; Swenson, Edward J.; Harris, Richard S., Method for processing a memory link with a set of at least two laser pulses.

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33. Collins David Robert ; Pergande Paul Earl ; Zaluzec Matthew John ; Joaquin Armando Mateo ; Kinane Jeffrey Alan, Method of depositing a dielectric onto electrically conductive elements.

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34. Takanabe Shoichi,JPX ; Ura Masashi,JPX ; Nakamura Nobuhiro,JPX ; Itoh Osamu,JPX ; Endoh Yukio,JPX, Method of forming contact hole and multilayered lines structure.

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35. Schofield Kevin H., Method of laser ablation of semiconductor structures.

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36. Lin, Charles W. C., Method of manufacturing a multilayer interconnect substrate.

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37. Weng,Jian Gang; Prasad,Ravi; Addington,Cary G.; Nyholm,Peter S., Method to form an interconnect.

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38. Chit Hwei Ng SG; Xu Yi SG; Sanford Chu SG, Method to form fuse using polymeric films.

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39. Cordingley, James J.; Ehrmann, Jonathan S.; Filgas, David M.; Johnson, Shepard D.; Lee, Joohan; Smart, Donald V.; Svetkoff, Donald J., Methods and systems for thermal-based laser processing a multi-material device.

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40. Cordingley, James J.; Ehrmann, Jonathan S.; Filgas, David M.; Johnson, Shepard D.; Lee, Joohan; Smart, Donald V.; Svetkoff, Donald J., Methods and systems for thermal-based laser processing a multi-material device.

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41. Cordingley,James J.; Ehrmann,Jonathan S.; Filgas,David M.; Johnson,Shepard D.; Lee,Joohan; Smart,Donald V.; Svetkoff,Donald J., Methods and systems for thermal-based laser processing a multi-material device.

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42. Cordingley,James J.; Ehrmann,Jonathan S.; Griffiths,Joseph J.; Johnson,Shepard D.; Lee,Joohan; Smart,Donald V.; Svetkoff,Donald J., Methods and systems for thermal-based laser processing a multi-material device.

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43. Tuttle, Mark E., Methods for forming semiconductor device structures.

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44. Tuttle, Mark E., Methods for forming through-wafer interconnects and structures resulting therefrom.

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45. Farnworth,Warren M.; Wood,Alan G., Methods of forming through-wafer interconnects and structures resulting therefrom.

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46. Mauro Ferrari ; Peter J. Dehlinger ; Francis J. Martin ; Carl F. Grove ; David R. Friend, Particles for oral delivery of peptides and proteins.

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47. Sun, Yunlong; Hainsey, Robert F.; Sun, Lei, Passivation processing over a memory link.

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48. Chue-San Yoo TW, Planarization using laser ablation.

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49. Yoo Chue-San,TWX, Planarization using laser ablation.

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50. Sun, Yunlong; Swenson, Edward J.; Harris, Richard S., Processing a memory link with a set of at least two laser pulses.

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51. Sun,Yunlong; Swenson,Edward J.; Harris,Richard S., Processing a memory link with a set of at least two laser pulses.

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52. Eisele, Pete John; Hart, Brian Christopher; Maher, Colin Geoffrey, Removal of debris from laser ablated nozzle plates.

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53. Tatah Abdelkrim, Repair of dielectric-coated electrode or circuit defects.

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54. Farnworth, Warren M.; Wood, Alan G.; Hembree, David R., Semiconductor component and interconnect having conductive members and contacts on opposing sides.

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55. Salman Akram ; Warren M. Farnworth ; Alan G. Wood, Semiconductor components having lasered machined conductive vias.

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56. Farnworth, Warren M.; Wood, Alan G., Semiconductor device including through-wafer interconnect structure.

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57. Tuttle, Mark E., Semiconductor device structures.

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58. Tuttle, Mark E., Semiconductor device structures and printed circuit boards comprising semiconductor devices.

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59. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Semiconductor interconnect having laser machined contacts.

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60. Akram, Salman; Farnworth, Warren M.; Wood, Alan G., Semiconductor package having interconnect with conductive members.

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61. Akram, Salman; Farnworth, Warren M.; Wood, Alan G., Stacked semiconductor package having laser machined contacts.

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62. Tuttle Mark E. (Boise ID), Test fixture and method for producing a test fixture for testing unpackaged semiconductor die.

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63. Akram,Salman; Kirby,Kyle K., Through-substrate interconnect fabrication methods.

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64. Muramatsu, Shigetsugu; Kobayashi, Tsuyoshi; Kurihara, Takashi, Wiring substrate and manufacturing method thereof, and semiconductor apparatus.

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