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Method of fabricating electronic circuits

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/34
출원번호 US-0712021 (1991-06-07)
발명자 / 주소
  • Goldman Paul D. (Marlboro MA)
출원인 / 주소
  • Norton Company (Worcester MA 02)
인용정보 피인용 횟수 : 37  인용 특허 : 0

초록

The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond substrate, and loose or lost via elements, are

대표청구항

A method for producing a circuit board having a multiplicity of conductive vias, comprising the steps of: providing a diamond substrate; forming a multiplicity of via holes through said substrate; loading said via holes with a conductive reactive braze material; and heating said braze material and s

이 특허를 인용한 특허 (37)

  1. Chiou, Wen-Chih; Wu, Weng-Jin, Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips.
  2. Petkie, Ronald R., Brazeable metallizations for diamond components.
  3. Yamazaki, Takahisa; Suzumura, Akio, Brazing-filler material and method for brazing diamond.
  4. Hoover,David S.; Petkie,Ronald R., CVD diamond enhanced microprocessor cooling system.
  5. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S.; Thomas, Kurt, Faucet.
  6. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  7. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  8. Brondum, Klaus; Welty, Richard P.; Jonte, Patrick B.; Richmond, Douglas S., Faucet component with coating.
  9. Brondum, Klaus, Faucet with wear-resistant valve component.
  10. Fjelstad, Joseph C., Forming conductive posts by selective removal of conductive material.
  11. Lemelson Jerome H. (868 Tyler Way Incline Village NV 89540) Conley James G. (443 Jefferson Ave. Glencoe IL 60022), Method of depositing synthetic diamond coatings with intermediates bonding layers.
  12. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  13. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  14. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  15. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  16. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  17. Fjelstad, Joseph, Method of electrically connecting a microelectronic component.
  18. Fjelstad,Joseph, Method of electrically connecting a microelectronic component.
  19. Welty,Richard P.; Brondum,Klaus; Richmond,Douglas S.; Jonte,Patrick B., Method of forming a wear resistant component.
  20. Kim, Keun-Ho; Yang, Dek-Gin; Kim, Jong-Guk; Jeon, II-Kyoon; Lee, Eung-Suek, Method of manufacturing a circuit board.
  21. Anton, Bryce; Welty, Richard P.; Sullivan, Patrick, Method of producing an article having patterned decorative coating.
  22. Jeffrey M. Calvert ; Pehr E. Pehrsson ; Martin C. Peckerar, Methods for and products of modification and metallization of oxidizable surfaces, including diamond surfaces, by plasma oxidation.
  23. Petkie, Ronald, Methods for preparing brazeable metallizations for diamond components.
  24. DiGiovanni, Anthony A.; Ozbayraktar, Serdar; Naidoo, Kaveshini, Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element.
  25. DiGiovanni, Anthony A.; Ozbayraktar, Serdar; Naidoo, Kaveshini, Methods of forming earth-boring tools.
  26. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectonic packages and methods therefor.
  27. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.
  28. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectronic packages and methods therefor.
  29. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.
  30. Kang, Teck-Gyu; Wang, Wei-Shun; Sato, Hiroaki; Hashimoto, Kiyoaki; Nakadaira, Yoshikuni; Masuda, Norihito; Haba, Belgacem; Mohammed, Ilyas; Damberg, Philip, Semiconductor chip assembly and method for making same.
  31. Lemelson Jerome H. ; Conley James G., Synthetic diamond coatings with intermediate amorphous metal bonding layers and methods of applying such coatings.
  32. Brondum, Klaus; Welty, Richard P.; Richmond, Douglas S.; Jonte, Patrick B.; Thomas, Kurt, Valve component for faucet.
  33. Brondum, Klaus; Welty, Richard P.; Richmond, Douglas S.; Jonte, Patrick B.; Thomas, Kurt, Valve component for faucet.
  34. Welty,Richard P.; Brondum,Klaus; Richmond,Douglas S.; Jonte,Patrick B., Valve component with improved wear resistance.
  35. Welty, Richard P.; Brondum, Klaus; Richmond, Douglas S.; Jonte, Patrick B., Valve component with multiple surface layers.
  36. Haba, Belgacem; Smith, John W., Vapor phase connection techniques.
  37. Parker, Jr., John L.; Miscikowski, Pamela L., Via connector and method of making same.
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