최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Edison 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
---|---|
국제특허분류(IPC7판) |
|
출원번호 | US-0806096 (1991-12-11) |
발명자 / 주소 |
|
출원인 / 주소 |
|
인용정보 | 피인용 횟수 : 298 인용 특허 : 0 |
A method and apparatus for chemically mechanically planarizing (CMP) a semiconductor wafer includes directing acoustic waves at the wafer and receiving reflected acoustic waves from the wafer during the (CMP) process. By analyzing the acoustic waves and reflected acoustic waves a thickness of the wa
A method and apparatus for chemically mechanically planarizing (CMP) a semiconductor wafer includes directing acoustic waves at the wafer and receiving reflected acoustic waves from the wafer during the (CMP) process. By analyzing the acoustic waves and reflected acoustic waves a thickness of the wafer can be determined and an endpoint and thickness of films formed on the wafer can be monitored in real time during the (CMP) process. The process parameters of the (CMP) process can then be adjusted as required to improve the uniformity of the process.
A method of chemical mechanical planarization (CMP) comprising: planarizing a semiconductor wafer on a rotating polishing platen; directing acoustic waves at the wafer during planarization; receiving reflected acoustic waves from the wafer; analyzing the acoustic waves and reflected acoustic waves t
A method of chemical mechanical planarization (CMP) comprising: planarizing a semiconductor wafer on a rotating polishing platen; directing acoustic waves at the wafer during planarization; receiving reflected acoustic waves from the wafer; analyzing the acoustic waves and reflected acoustic waves to determine a thickness of the wafer by analyzing a round trip time of acoustic waves directed at the wafer and reflected from the wafer by the formula x=V(T1-T2)/2 where V is an acoustic velocity through the wafer and (T1-T2) is a round trip time of the acoustic waves; controlling planarizing of the wafer in response to analysis of the acoustic waves.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.