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Leadless pad array chip carrier 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-023/28
  • H05K-007/00
출원번호 US-0976720 (1992-11-16)
발명자 / 주소
  • Mullen
  • III William B. (Boca Raton FL) Urbish Glenn F. (Coral Springs FL) Freyman Bruce J. (Plantation FL)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 193  인용 특허 : 0

초록 ▼

A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the

대표청구항 ▼

A leadless pad array chip carrier package, comprising: a leadless circuit carrying insulating substrate having opposing planar first and second sides; a semiconductor device electrically and mechanically mounted on the first side of the circuit carrying substrate; the substrate second side having a

이 특허를 인용한 특허 (193)

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