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Enclosure for electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/29
  • H01L-023/31
  • H01L-023/16
출원번호 US-0818880 (1992-01-10)
발명자 / 주소
  • Shores A. Andrew (212 Carroll Canal Venice CA 90291)
인용정보 피인용 횟수 : 98  인용 특허 : 0

초록

A sealed enclosure of an electronic device incorporates a coating or adhesive with desiccant properties. The coating or adhesive comprises a protonated alumino silicate powder dispersed in a polymer.

대표청구항 ▼

A sealed enclosure surrounding an electronic device and a coating or adhesive with desiccant properties, said coating or adhesive comprising a powder dispersed in a polymer containing the elements carbon and hydrogen and one or more of the elements oxygen, nitrogen, sulfur, halogen, and silicon in i

이 특허를 인용한 특허 (98)

  1. Egron, Francois; Liptawat, Pat; Mei, Junfeng; Mousavi Nazari, Hooman; Quan, Xina; Rosenthal, Marcus A.; Sutherland, William D.; Weaber, Chris A.; White, III, Luther L., Automated manufacturing processes for producing deformable polymer devices and films.
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