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Method for manufacturing an encapsulated IC card having a molded frame and a circuit board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/52
  • H01L-021/54
  • H01L-021/56
  • H01L-021/58
출원번호 US-0963699 (1992-10-20)
우선권정보 JP-0129302 (1989-05-23)
발명자 / 주소
  • Kodai Shojiro (Itami JPX) Ochi Katsunori (Itami JPX) Baba Fumiaki (Amagasaki JPX)
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha (Tokyo JPX 03)
인용정보 피인용 횟수 : 50  인용 특허 : 0

초록

A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both side

대표청구항

A method of manufacturing an IC card comprising: injecting a synthetic resin into a mold so that a frame is formed, said frame integrally comprising a periphery having a thickness corresponding to the thickness of said IC card and a circuit board disposed intermediate the thickness of said frame and

이 특허를 인용한 특허 (50)

  1. Karmazyn, Michael J., Angular encapsulation of tandem stacked printed circuit boards.
  2. Chang, Hwa-Hsiang, Anti-ultraviolet memory device and fabrication method thereof.
  3. Sugimoto, Keiichi; Nakagawa, Mitsuru, Card key having function of performing radio communication with on-vehicle device.
  4. Melzer Roland,DEX ; Houdeau Detlef,DEX, Data card, process for manufacturing a data card and apparatus for manufacturing a data card.
  5. Zhang, Yudong, Displaying device and method thereof.
  6. Park, Chul Woo; Ko, Suk Gu; Jang, Sang Jae; Park, Sung Su; Lee, Choon Heung, Double mold memory card and its manufacturing method.
  7. Centofante,Charles A., Electronic device housing.
  8. Kanzaki, Shozo; Arimai, Fumiaki; Nishizaki, Hiroyoshi; Nakanishi, Masato, Electronic equipment unit and manufacturing mold assembly thereof.
  9. Fuergut,Edward; Goller,Bernd; Hagen,Robert Christian; Jerebic,Simon; Pohl,Jens; Woerner,Holger; Strobel,Peter, Electronic module having plug contacts and method for producing it.
  10. Singleton, Robert, Embedded electronic device and method for manufacturing an embedded electronic device.
  11. Prince David G. ; Principe Daniel D., Encapsulated printed circuit assembly and method and manufacturing the same.
  12. Kyouichi Kohama JP; Yusuke Hirai JP; Kaname Tamada JP; Toshinobu Sueyoshi JP; Ryuzo Fukao JP; Kazuhiko Daido JP, Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module.
  13. Smith, Lee J.; Miks, Jeffrey Alan; Zwenger, Curtis Michael; Miles, Barry Michael, High density memory card using folded flex.
  14. Koh, Wei, High-capacity memory card and method of making the same.
  15. Leighton, Keith R., Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process.
  16. Hoppe, Joachim; Gauch, Wolfgang, Injection-moulded card with decorative layer.
  17. Centofante,Charles A., Insert molding electronic devices.
  18. Sakurai Keizoh,JPX, Interconnection card and methods for manufacturing and connecting the card.
  19. Hauser, Christian; Schmidt, Helge; Winderl, Johann, Lead frame for the installation of an integrated circuit in an injection-molded package.
  20. Ladyansky, Stephen Joseph, Media cipher smart card.
  21. Pomerantz, Itzhak; Yairi, Rahav; Ponte, Gad, Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device.
  22. Pomerantz, Itzhak; Yairi, Rahav; Ponte, Gad, Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device.
  23. Herbst Richard,DEX, Method for producing a plastic material composite component, a plastic material composite component and a mold for inje.
  24. Weber Patrick O. (San Jose CA), Method for transfer molding standard electronic packages and apparatus formed thereby.
  25. Kimura Ryan ; Farquhar James ; Allen Jeffrey ; Chao Michael ; Hatch Stephen ; Herbert Scott ; Weibezhan Brandt ; Fajardo Iggoni, Method of assembling a peripheral device printed circuit board package.
  26. Koh, Wei, Method of fabricating a chip.
  27. Koh, Wei, Method of fabricating a chip.
  28. Tsutomu Higuchi JP; Tomoharu Fujii JP; Shigeru Okamura JP; Tsuyoshi Sato JP; Takayoshi Wakabayashi JP; Masatoshi Akagawa JP, Non-contact type IC card and process for manufacturing same.
  29. Iwasaki Hiroshi,JPX, Plate-shaped external storage device and method of producing the same.
  30. Iwasaki Hiroshi,JPX, Plate-shaped external storage device and method of producing the same.
  31. Wallace Robert F. ; Miller Robert C., Portable memory card for storage of personal information.
  32. Wallace Robert F. ; Miller Robert C., Portable memory card for storage of personal information.
  33. Wallace Robert F. ; Miller Robert C., Portable memory card for storage of personal information.
  34. Wallace Robert F. ; Miller Robert C., Portable memory card for storage of personal information.
  35. Vinciarelli, Patrizio; Curhan, Jeffrey A., Protective coating for an electronic device.
  36. Singleton, Robert, RFID bracelet and method for manufacturing a RFID bracelet.
  37. Robert F. Wallace ; Robert C. Miller, Removable memory card for use with portable electronic devices.
  38. Robert F. Wallace ; Robert C. Miller, Removable memory card for use with portable electronic devices.
  39. Robert F. Wallace ; Robert C. Miller, Removable memory card for use with portable electronic devices.
  40. Wallace Robert F., Removable memory card for use with portable electronic devices.
  41. Utsumi, Yoshimasa, Semiconductor memory card.
  42. Yoshimasa Utsumi JP, Semiconductor memory card.
  43. Takeda Mitsunori,JPX ; Igarashi Eiichi,JPX ; Yoshida Hideyo,JPX, Sheet-framed IC carrier and method for producing the same.
  44. Takeda, Mitsunori; Igarashi, Eiichi; Yoshida, Hideyo, Sheet-framed IC carrier and method for producing the same.
  45. Kimura, Ryan; Farquhar, James; Allen, Jeffrey; Chao, Michael; Hatch, Stephen; Herbert, Scott; Weibezhan, Brandt; Fajardo, Iggoni, Shielded PC card packages.
  46. Song Man-gon,KRX ; Kim Si-han,KRX ; Lee Seung-bae,KRX, Smart card.
  47. Singleton,Robert, Smart card and method for manufacturing a smart card.
  48. Weber Patrick O. ; Brueggeman Michael A., Transfer molded PCMCIA standard cards.
  49. Leighton,Keith R., Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices.
  50. Shiu, George; Koh, Wei, Waterproof USB drives and method of making.
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