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Ceramic bonding method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-031/00
출원번호 US-0804285 (1991-12-09)
발명자 / 주소
  • Li Chou H. (379 Elm Dr. Roslyn NY 11576)
인용정보 피인용 횟수 : 42  인용 특허 : 0

초록

A method for coating a ceramic with a strong, adherent, substantially defect-free, and thermomechanically shock resistant metallized layer for practical use at over 630°C. comprising selecting a ceramic metallizing composition; preparing the composition by proportioning the differing sizes of the mi

대표청구항

A method for making a thermally stable, liquid-diffusion formed joint capable of being used in solid form over 630°C., comprising: providing a first solid body of a first material; providing a second solid body of a second material; at least said first material being a ceramic; selecting and prepari

이 특허를 인용한 특허 (42)

  1. Tao, Yong Xin; Moreno, Ryan; Hao, Yingli; Jones, W. Kinzy, 3-dimensional high performance heat sinks.
  2. Malshe Ajay P. ; Naseem Hameed A. ; Brown William D., Apparatus for and method of polishing and planarizing polycrystalline diamonds, and polished and planarized polycrystal.
  3. Noda, Iwao; Ikeda, Junji; Nakanishi, Takefumi; Kitano, Hiroyuki; Masuda, Shingo, Biomedical implant material and method of producing the same.
  4. Chou H. Li, Ceramic coating method.
  5. Marcus A. Ritland ; Dennis W. Readey ; Richard N. Kleiner ; Jack D. Sibold ; Kyle Knudson ; Steven Landin ; Paul Thoen, Ceramic filter element.
  6. Li, Chou H., Chemical mechanical polishing.
  7. Li, Chou H.; Li, Suzanne C., Chemical mechanical polishing slurry.
  8. Li Chou H., Composite with non-segregating reinforcing elements.
  9. Fernie, John Andrew; Roberts, Martyn David; Wang, Yong; Kavilveedu, Narayanan Rajesh; Brown, David J., Double transition joint for the joining of ceramics to metals.
  10. Ritland Marcus A. ; Readey Dennis W. ; Stephan James E. ; Rulis Dean A. ; Sibold Jack D., Electronic components incorporating ceramic-metal composites.
  11. Roger Duffield GB; Randall M. German ; Teh Fu Yen ; Ronald G. Iacocca, Fuel filter and production process.
  12. Li Chou H., Heat-resistant electronic systems and circuit boards.
  13. Li, Chou H., Heat-resistant electronic systems and circuit boards.
  14. Chou H. Li, Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal.
  15. Roper, Christopher S.; Jacobsen, Alan J., Lightweight sandwich panel heat pipe.
  16. Marcus A. Ritland ; William Todd Howe, Metal-infiltrated ceramic seal.
  17. Ritland Marcus A. ; Landin Steven M., Method for producing filled vias in electronic components.
  18. Gaynes Michael Anthony ; Pierson Mark Vincent ; Zubelewicz Aleksander, Method for reinforcing a semiconductor device to prevent cracking.
  19. Ritland Marcus A. ; Readey Dennis W. ; Kleiner Richard N. ; Sibold Jack D. ; Knudson Kyle ; Landin Steven ; Thoen Paul, Method for sealing and/or joining an end of a ceramic filter.
  20. Roper, Christopher S.; Jacobsen, Alan J., Method of forming a lightweight sandwich panel heat pipe.
  21. Reddy, Srinivasa S. N.; Wall, Donald R., Method of forming features on a ceramic substrate using platible pastes.
  22. Li Chou H., Method of making a heat-resistant system.
  23. Adachi, Kazumasa; Takada, Motoo; Ono, Kozo, Method of manufacturing optical component and optical component.
  24. Ivanov Eugene Y. (Grove City OH) Grigoriva Tatyana F. (Spartaka RUX) Boldyrev Vladimir V. (Tereshkove RUX), Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded there.
  25. Clark, Daniel; Allen, Jeffrey, Methods of forming metal matrix composites and metal matrix composites formed thereby.
  26. Roper, Christopher S.; Carter, William B.; Jacobsen, Alan J., Micro-architected materials for heat exchanger applications.
  27. Roper, Christopher S.; Carter, William B., Micro-architected materials for heat sink applications.
  28. Yang, Sophia S.; Jacobsen, Alan J., Micro-truss materials having in-plane material property variations.
  29. Carter, William B.; Gross, Adam F.; Guinn, Keith V.; Jacobsen, Alan J.; Kisailus, David, Microtruss based thermal heat spreading structures.
  30. Carter, William B.; Brewer, Peter D.; Gross, Adam F.; Rogers, Jeffrey L.; Guinn, Keith V.; Jacobsen, Alan J., Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments.
  31. Jin, Sungho; Mavoori, Hareesh; Ramirez, Ainissa G, Oxidation-resistant reactive solders and brazes.
  32. Bruck, Gerald J., Pack heat treatment for material enhancement.
  33. Roper, Christopher S.; Carter, William B., Personal artificial transpiration cooling system.
  34. Chou H. Li ; Suzanne C. Li, Planarizing method.
  35. Reddy Srinivasa S. N. ; Wall Donald R., Platible non-metallic filler material for metallurgical screening paste.
  36. Roper, Christopher S.; Carter, William B., Power generation through artificial transpiration.
  37. Ikeda Tsutomu,JPX ; Yagi Takayuki,JPX ; Shimada Yasuhiro,JPX, Probe and a cantilever formed with same material.
  38. Wienand Karlheinz,DEX ; Soll Eva,DEX ; Muziol Matthias,DEX, Process for producing a sensor arrangement for measuring temperature.
  39. Lewis, Brian G.; Singh, Bawa; Laughlin, John; Pandher, Ranjit, Reducing joint embrittlement in lead-free soldering processes.
  40. Gabbrielli, Ruggero; Turner, Irene Gladys; Bowen, Christopher Rhys; Magalini, Emanuele, Relating to joints and/or implants.
  41. Strömberg, Håkan, Restoring of strength and wear resistance of a metal matrix composite (MMC).
  42. Michael Anthony Gaynes ; Mark Vincent Pierson ; Aleksander Zubelewicz, Structure for reinforcing a semiconductor device to prevent cracking.
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