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Process for electroless plating tin, lead or tin-lead alloy 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-002/00
출원번호 US-0843015 (1992-02-28)
우선권정보 JP-0059642 (1991-03-01)
발명자 / 주소
  • Uchida Hiroki (Hirakata JPX) Kubo Motonobu (Hirakata JPX) Kiso Masayuki (Hirakata JPX) Hotta Teruyuki (Hirakata JPX) Kamitamari Tohru (Hirakata JPX)
출원인 / 주소
  • C. Uyemura and Company, Limited (Osaka JPX 03)
인용정보 피인용 횟수 : 175  인용 특허 : 0

초록 ▼

The invention provides a process for electroless plating tin, lead or tin-lead alloy on copper or copper alloy using an electroless plating bath containing a water soluble tin and/or lead salt, an acid capable of dissolving the salts, and a complexing agent. The tin and/or lead content in the bath i

대표청구항 ▼

A process for electroless plating tin, lead, or tin-lead alloy comprising the steps of: (a) electroless plating tin, lead, or tin-lead alloy on copper or copper alloy using an electroless plating bath comprising a water soluble tin salt, a water soluble lead salt, or a combination thereof, an acid c

이 특허를 인용한 특허 (175)

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