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A light emitting diode exposure head for a recording apparatus which comprises an aligned assembly of a plurality of diode modules, each module including an array of said diodes and associated circuit boards mounted on a common base, the diode modules being supported in elevated position above the b

A light emitting diode exposure head for a recording apparatus which comprises an aligned assembly of a plurality of diode modules, each module including an array of said diodes and associated circuit boards mounted on a common base, the diode modules being supported in elevated position above the base, and interconnection circuit strips for the modules disposed on the base in partial overlapping relation beneath the margins of the elevated modules, the interconnection strips having a line of bonding pads for making wire-bonded connections with the circuit boards.

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In a light emitting diode exposure head for linewise recording information on a photoreceptor in a recording apparatus, in which the head is elongated in length and comprises an assembly of a plurality of generally rectangular-shaped diode modules mounted on a common base in alignment along a common

In a light emitting diode exposure head for linewise recording information on a photoreceptor in a recording apparatus, in which the head is elongated in length and comprises an assembly of a plurality of generally rectangular-shaped diode modules mounted on a common base in alignment along a common axis extending lengthwise of the head length, each said diode module of said assembly having two opposite side edges located laterally of said axis, each module comprising a substantially rigid generally rectangular base plate, an elongated row of LED dice mounted on a generally centrally-located locus of the base plate extending lengthwise of the head, each said dice row having two opposite sides, a row of integrated circuit chips disposed on said base plate laterally of each side of the LED dice row, each row of said circuit chips having one side adjacent one side of said LED dice row and an opposite side remote from said LED dice row, and a circuit board in common to the integrated circuit chips of each of said rows of integrated circuit chips arranged on said base plate along the remote side of each said row of circuit chips, each circuit board having a side adjacent said remote side of each chip row and an opposite side spaced laterally of said remote side; and wherein an elongated interconnection circuit strip extends over substantially the length of said exposure head adjacent to the laterally spaced opposite side of each of the circuit boards, in combination, the improvement wherein a) said rectangular base plate of each module has two opposite side edges thereof that are parallel to the axis of the LED row of said module and located proximate to the laterally spaced opposite sides of said circuit boards, whereby said circuit boards are supported respectively on opposite side margins of said base plate; b) said common base of the head has an elongated central region defined between opposite side limits that are spaced apart a predetermined distance transversely of the head length, said central region having a generally flat surface lying in a given plane, and side regions on opposite sides of said central region beyond the side limits of the central region, each side region defining a generally flat surface that lies in a plane that is generally parallel to the plane of said central region and spaced therefrom in a direction perpendicular to said plane to define a clearance space between the plane of said central region and the plane of each of said side regions, whereby the flat surface of each side region is depressed relative to the flat surface of the central region; c) said generally rectangularly-shaped modules are mounted on the flat surface of said central region of said base; d) each of said modules has a dimension perpendicular to the length of the head that is sufficiently larger than said predetermined distance between the side limits of said elongated central region of said base that the opposite side margins of each said base plate carrying said circuit boards thereon project in cantilevered fashion beyond said side limits of said elevated central region of the base, e) said elongated interconnection circuit strips are disposed on the depressed flat surfaces of said opposite side regions of the base so that each side margin of each of said module base plates overlaps in spaced relation with a portion of one of said interconnection circuit strips with a clearance space therebetween while another portion of said strip is free of said overlap; f) each of said interconnection circuit strips has bonding pads located on the portion of said circuit strip that is free of said overlap; and g) each of said circuit boards has bonding pads generally adjacent said opposite side margin thereof, said bonding pads of each of said circuit boards being connected by wire-bonding to bonding pads on one of said interconnection strips.