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Microwave heating structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-006/80
출원번호 US-0717884 (1991-06-17)
발명자 / 주소
  • Beckett D. Gregory (Oakville CAX)
출원인 / 주소
  • Beckett Industries Inc. (Oakville CAX 03)
인용정보 피인용 횟수 : 131  인용 특허 : 0

초록 ▼

The structure includes a layer of flexible electroconductive material normally opaque to microwave radiation and having a plurality of apertures therethrough dimensioned to permit microwave energy to pass through to the interior of the foodstuff and to produce thermal energy at the surface of the fo

대표청구항 ▼

A multiple layer article of manufacture, for formation into a packaging structure for heating a foodstuff by microwave energy to an edible condition comprising: a layer of flexible electroconductive material supported on a substrate layer, said layer of flexible electroconductive material having a t

이 특허를 인용한 특허 (131)

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