이 특허를 인용한 특허 (111)

1. Taylor,Theodore M., Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization.

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2. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.

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3. Chandrasekaran,Nagasubramaniyan, Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces.

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4. Wright David Q., Apparatus and method for polishing a semiconductor wafer in an overhanging position.

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5. Wright David Q., Apparatus and method for polishing a semiconductor wafer in an overhanging position.

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6. Blalock,Guy T., Apparatus and method for removing material from microfeature workpieces.

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7. Holzapfel Paul ; Yednak ; III Andrew ; Natalicio John ; Goudie Chad, Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing.

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8. Agarwal, Vishnu K., Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

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9. Taylor, Theodore M., Apparatus for planarizing microelectronic workpieces.

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10. Kimura,Norio; Ishii,Yu; Hiyama,Hirokuni; Okumura,Katsuya; Yano,Hiroyuki, Apparatus for polishing a substrate.

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11. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

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12. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

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13. Ramarajan, Suresh, Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces.

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14. Agarwal,Vishnu K., Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

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15. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.

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16. Ramarajan,Suresh, Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece.

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17. Agarwal,Vishnu K., Apparatuses for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies.

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18. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

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19. Castor, Terry, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

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20. Chandrasekaran, Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

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21. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

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22. Chandrasekaran,Nagasubramaniyan, Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces.

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23. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.

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24. Elledge,Jason B., Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces.

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25. Talieh Homayoun (San Jose CA), Chemical mechanical polishing apparatus with improved slurry distribution.

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26. Li Leping (Poughkeepsie NY) Barbee Steven George (Dover Plains NY) Halperin Arnold (Cortlandt Manor NY), Chemical mechanical polishing endpoint process control.

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27. Richard J. Lebel ; Rock Nadeau ; Martin P. O'Boyle ; Paul H. Smith, Jr. ; Theodore G. van Kessel ; Hemantha K. Wickramasinghe, Chemical mechanical polishing in-situ end point system.

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28. Lebel Richard J. ; Maurer Frederic ; Nadeau Rock ; Smith ; Jr. Paul H. ; Wickramasinghe Hemantha K. ; van Kessel Theodore G., Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement.

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29. Doan, Trung T., Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates.

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30. Sabde, Gundu M.; Hofmann, James J.; Joslyn, Michael J.; Lee, Whonchee, Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids.

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31. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.

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32. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.

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33. Robinson Karl M., Method and apparatus for increasing chemical-mechanical-polishing selectivity.

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34. Robinson Karl M., Method and apparatus for increasing-chemical-polishing selectivity.

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35. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.

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36. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.

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37. Kistler,Rodney C.; Carswell,Andrew, Method and apparatus for removing material from microfeature workpieces.

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38. Haggart, Jr., David Weston; Glashauser, Walter, Method for determining an endpoint and semiconductor wafer.

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39. Lenkersdorfer Paul, Method for obtaining a desired film thickness using chemical mechanical polishing.

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40. Taylor,Theodore M., Method for planarizing microelectronic workpieces.

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41. Holzapfel Paul ; Schlueter James ; Karlsrud Chris ; Lin Warren, Methods and apparatus for detecting removal of thin film layers during planarization.

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42. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical mechanical planarization of microelectronic substrates.

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43. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

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44. Blalock, Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

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45. Blalock,Guy T., Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates.

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46. Lu, Jin, Methods and apparatuses for removing polysilicon from semiconductor workpieces.

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47. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

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48. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

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49. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

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50. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

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51. Chandrasekaran,Nagasubramaniyan, Methods and systems for conditioning planarizing pads used in planarizing substrates.

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52. Elledge, Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

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53. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

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54. Elledge,Jason B., Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

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55. Moore,Carter; Folkes,Elon; Castor,Terry, Methods and systems for planarizing workpieces, e.g., microelectronic workpieces.

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56. Taylor,Theodore M., Methods for planarizing microelectronic workpieces.

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57. Moore,Carter; Folkes,Elon; Castor,Terry, Methods for planarizing workpieces, e.g., microelectronic workpieces.

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58. Allen Robert F. ; Holzapfel Paul ; Bartels Anthony L. ; Lin Warren, Methods for the in-process detection of workpieces in a CMP environment.

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59. Bartels Anthony L. ; Allen Robert F. ; Holzapfel Paul ; Lin Warren, Methods for the in-process detection of workpieces with a monochromatic light source.

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60. Elledge,Jason B., Methods of manufacturing carrier heads for polishing micro-device workpieces.

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61. Schietinger, Charles W.; Hoang, Ahn N., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

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62. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

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63. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

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64. Schietinger,Charles W.; Hoang,Anh N.; Bakin,Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.

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65. Herbert E. Litvak, Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.

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66. Robert Summers, PZT microactuator processing.

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67. Moore, Scott E., Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates.

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68. Joslyn, Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.

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69. Joslyn,Michael J., Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces.

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70. Wright, David Q., Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies.

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71. Taylor, Theodore M.; Chandrasekaran, Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.

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72. Taylor,Theodore M.; Chandrasekaran,Nagasubramaniyan, Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions.

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73. Elledge, Jason B., Polishing machines including under-pads and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

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74. Kitajima,Tomohiko; Yasuhara,Gen, Polishing method and apparatus.

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75. Nyui Masaru,JPX ; Ban Mikichi,JPX ; Takahashi Kazuo,JPX, Polishing method and polishing apparatus using the same.

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76. Dunn,Freddie L., Polishing pad conditioners having abrasives and brush elements, and associated systems and methods.

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77. Beardsley Gary Joseph ; Bullard Timothy Scott ; Huynh Cuc Kim ; van Kessel Theodore Gerard ; Walker David Louis, Post CMP clean brush with torque monitor.

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78. Gary Joseph Beardsley ; Timothy Scott Bullard ; Cuc Kim Huynh ; Theodore Gerard van Kessel ; David Louis Walker, Post CMP cleaning method using a brush cleaner with torque monitor.

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79. Kobayashi Thomas S. (Austin TX), Process for polishing and analyzing an exposed surface of a patterned semiconductor.

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80. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.

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81. Chandrasekaran,Nagasubramaniyan, Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces.

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82. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

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83. Taylor, Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

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84. Taylor,Theodore M., Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces.

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85. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods.

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86. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.

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87. Taylor,Theodore M., Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods.

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88. Talieh Homayoun, Substrate polishing apparatus.

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89. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

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90. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

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91. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

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92. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.

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93. Brunelli, Thad L., System and method for reducing surface defects in integrated circuits.

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94. Brunelli,Thad L., System and method for reducing surface defects in integrated circuits.

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95. Thad L. Brunelli, System and method for reducing surface defects in integrated circuits.

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96. Thad L. Brunelli, System and method for reducing surface defects integrated in circuits.

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97. Klein, Rita J., System for planarizing microelectronic substrates having apertures.

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98. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

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99. Elledge,Jason B., Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces.

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100. Elledge, Jason B.; Chandrasekaran, Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

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101. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

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102. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

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103. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

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104. Elledge,Jason B.; Chandrasekaran,Nagasubramaniyan, Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces.

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105. Bastian, Joseph A.; Reukauf, Jeremey T., Systems and methods for removing microfeature workpiece surface defects.

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106. Bastian,Joseph A.; Reukauf,Jeremey T., Systems and methods for removing microfeature workpiece surface defects.

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107. Moore,Carter; Folkes,Elon; Castor,Terry, Systems for planarizing workpieces, e.g., microelectronic workpieces.

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108. Cesna Joseph V., Wafer polishing with improved end point detection.

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109. Brouillette, Donald W.; Ference, Thomas G.; Linde, Harold G.; Hibbs, Michael S.; Mendelson, Ronald L., Wafer thickness control during backside grind.

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110. Brouillette,Donald W.; Ference,Thomas G.; Linde,Harold G; Hibbs,Michael S.; Mendelson,Ronald L., Wafer thickness control during backside grind.

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111. Donald W. Brouillette ; Thomas G. Ference ; Harold G. Linde ; Michael S. Hibbs ; Ronald L. Mendelson, Wafer thickness control during backside grind.

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