이 특허를 인용한 특허 (42)

1. Kitamura, Yukihiro; Takahashi, Takayuki; Ohta, Mitsuru; Ogawa, Yuji, Ceramic circuit board and power module.

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2. Suzuki, Toshio; Kanayama, Masami; Hattori, Akiyoshi; Kitou, Masanori, Ceramic package with brazing material near seal member.

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3. Suzuki, Toshio; Kanayama, Masami; Hattori, Akiyoshi; Kitou, Masanori, Ceramic package with brazing material near seal member.

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4. Hirai, Takami; Yano, Shinsuke; Nanataki, Tsutomu; Yamaguchi, Hirofumi, Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board.

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5. Floyd, Philip D.; Arbuckle, Brian W., Device having patterned spacers for backplates and method of making the same.

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6. Hoffman Paul R. ; Popplewell James M. ; Braden Jeffrey S., Edge connectable metal package.

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7. Tsujino, Mahiro; Kawazu, Yoshiki, Electronic component housing package and electronic apparatus.

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8. Kawazu, Yoshiki, Element-accommodating package and mounting structure.

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9. Baillin, Xavier; Diem, Bernard; Polizzi, Jean-Philippe; Rouzaud, Andre, Encapsulation structure including a mechanically reinforced cap and with a getter effect.

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10. Bivona Kevin G. ; Coffin Jeffrey T. ; Drofitz ; Jr. Stephen S. ; Goldmann Lewis S. ; Interrante Mario J. ; Iruvanti Sushumna ; Sherif Raed A., Hermetic CBGA/CCGA structure with thermal paste cooling.

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11. Tanaka, Tsuyoshi; Yamamoto, Masaharu, Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap.

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12. Krause, Jens; Heimann, Thomas, Hermetically sealed housing.

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13. Takagi, Kazutaka, High frequency package device with internal space having a resonant frequency offset from frequency used.

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14. Evans, Robert D.; Bronson, David, Hydrogen diffusion hybrid port and method of forming.

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15. Evans,Robert D.; Bronson,David, Hydrogen diffusion hybrid port and method of making.

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16. Dunaway, Thomas J.; Spielberger, Richard K., IC package lid for dose enhancement protection.

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17. Hamilton, Douglas Campbell; Smith, Jerry Wayne; Stahlman, Larry Earl; Mizushima, Kiyoshi; Hujimoto, Hisakazu; Aoki, Makoto, Large area alumina ceramic heater.

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18. Hamilton,Douglas Campbell; Smith,Jerry Wayne; Stahlman,Larry Earl; Mizushima,Kiyoshi; Hujimoto,Hisakazu; Aoki,Makoto, Large area alumina ceramic heater.

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19. Bita, Ion; Hong, John H.; Alam, Khurshid S., Light-based sealing and device packaging.

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20. Natarajan, Bangalore R.; Ganti, Surya, MEMS devices and processes for packaging such devices.

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21. Christopher F. Gallmeyer ; Larry G. Waterfield, Method and apparatus for controlling a piezoelectric device.

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22. Palmateer, Lauren; Cummings, William J.; Gally, Brian; Miles, Mark; Sampsell, Jeffrey B.; Chui, Clarence; Kothari, Manish, Method and device for packaging a substrate.

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23. Palmateer, Lauren; Cummings, William J.; Gally, Brian; Miles, Mark; Sampsell, Jeffrey B.; Chui, Clarence; Kothari, Manish, Method and device for packaging a substrate.

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24. Tyger, Karen, Method and device for providing electronic circuitry on a backplate.

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25. Tyger, Karen, Method and device for providing electronic circuitry on a backplate.

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26. Miles, Mark W.; Sampsell, Jeffrey B., Method and system for packaging a MEMS device.

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27. Miles, Mark W.; Sampsell, Jeffrey B., Method and system for packaging a MEMS device.

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28. Gally, Brian J.; Cummings, William J.; Palmateer, Lauren; Floyd, Philip D.; Chui, Clarence, Method and system for packaging a display.

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29. Hamilton, Douglas Campbell; Smith, Jerry Wayne; Stahlman, Larry Earl; Mizushima, Kiyoshi; Hujimoto, Hisakazu; Aoki, Makoto, Method for forming a ceramic laminate.

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30. Tsai, Hsiung-Kuang, Optical interference display panel.

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31. Tsai,Hsiung Kuang, Optical interference display panel.

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32. Lin, Wen Jian; Arbuckle, Brian; Gally, Brian; Floyd, Philip; Palmateer, Lauren, Optical interference display panel and manufacturing method thereof.

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33. Lin, Wen-Jian; Arbuckle, Brian; Gally, Brian; Floyd, Philip; Palmateer, Lauren, Optical interference display panel and manufacturing method thereof.

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34. Hori, Motohito; Ikeda, Yoshinari, Power semiconductor module and composite module.

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35. Jin, Gil Ju; Park, Jung Lim; Kim, Jae Yk, Printed circuit board and probe therewith.

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36. Jin, Gil Ju; Park, Jung Lim; Kim, Jae Yk, Printed circuit board and probe therewith.

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37. Okada, Takahiro; Murata, Hideaki, Semiconductor device package.

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38. Huang, Chien-Ping, Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same.

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39. Palmateer, Lauren; Cummings, William J.; Gally, Brian; Chui, Clarence, System and method for protecting micro-structure of display array using spacers in gap within display device.

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40. Gally,Brian; Palmateer,Lauren; Cummings,William J., System and method for protecting microelectromechanical systems array using back-plate with non-flat portion.

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41. Gally,Brian; Palmateer,Lauren; Cummings,William J., System and method for protecting microelectromechanical systems array using structurally reinforced back-plate.

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42. Sampsell,Jeffrey B., System and method of providing a regenerating protective coating in a MEMS device.

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