초록 ▼

A cold plate for cooling electronic modules and devices is disclosed which incorporates an intersecting flow network. The flow network is designed and devised such that flow paths are arranged in a rectilinear fashion surrounding blocks of material which act as heat sinks. Supply conduits and return

A cold plate for cooling electronic modules and devices is disclosed which incorporates an intersecting flow network. The flow network is designed and devised such that flow paths are arranged in a rectilinear fashion surrounding blocks of material which act as heat sinks. Supply conduits and return conduits for supplying and returning cooling fluid are disposed orthogonally to the flow directions within the flow paths and such that each supply channel is circumscribed by a plurality of return channels, and each return channel is circumscribed by a plurality of supply channels. The arrangement of the supply and return channels insures the shortest possible flow path for the cooling fluid thereby insuring maximum cooling efficiency and minimizing and localizing the temperature rise in the cooling fluid during passage from the supply conduit to the return conduit. With a minimum temperature rise of the cooling fluid over a short flow path, conduction in the cold plate insures optimum uniformity of cooling to the electronic components. The components of the cold plate either may be assembled and clamped or may be rigidly affixed to one another by means of either soldering or braising to form the structure defining the flow channels, conduits and manifold connections necessary for the consistent and uniform circulation of the cooling fluid.

대표청구항 ▼

A cold plate for cooling a structure engageable with said cold plate by conduction, said cold plate comprising: a plate of highly heat conductive material having a first surface for engagement with a structure to be cooled, said first surface substantially planar in form; a second surface of substan

A cold plate for cooling a structure engageable with said cold plate by conduction, said cold plate comprising: a plate of highly heat conductive material having a first surface for engagement with a structure to be cooled, said first surface substantially planar in form; a second surface of substantially planar form, spaced from said first surface; a plurality of edge surfaces extending between said first and said second surfaces, defining said plate; a plurality of flow channels formed into said plate and having directions of flow substantially parallel to said first surface of said plate forming a plurality of intersections; a plurality of supply and return conduits formed into said plate and each of said conduits having an axis extending from said second surface and toward said first surface and further intersecting said flow channels at said intersections, whereby said flow channels may be supplied a cooling fluid through selected ones of said conduits and said cooling fluid may be collected at and conducted away from said channels through others of said conduits.