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Cathode assembly for cathodic sputtering apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/34
출원번호 US-0875967 (1992-04-29)
발명자 / 주소
  • Fan Jia S. (Columbus OH)
출원인 / 주소
  • Tosoh SMD, Inc. (Grove City OH 02)
인용정보 피인용 횟수 : 27  인용 특허 : 23

초록

Elastic and plastic deformation of backing plate members in target-backing plate cathode assemblies for cathodic sputter coating apparatus are minimized by the provision of a concave surface portion located at the target/backing plate interface and by provision of a backing plate material having a y

대표청구항

Cathode assembly for use in a cathodic sputter coating apparatus, said assembly including a backing plate in contact with a pressurized flow of cooling fluid and being deformable upon application of pressure thereto by said pressurized cooling fluid, a target member carrying material to be sputter c

이 특허에 인용된 특허 (23)

  1. Hurwitt Steven D. (Park Ridge NJ), Cathode and target design for a sputter coating apparatus.
  2. Hartig Klaus (Ronneburg DEX) Seiler Reiner (Hanau DEX), Cathode sputtering apparatus.
  3. Hartig Klaus (Ronneburg DEX) Szczyrbowski Joachim (Goldbach DEX), Cathode sputtering device.
  4. Hillman Gary (Livingston NJ), Cooling device for a sputter target and source.
  5. Eilers Carl-Ernst (Heidenheim DEX) Pachonik Horst (Taufkirchen DEX), Device for cathode sputtering of at least two different materials.
  6. Brors Daniel L. (Los Altos CA), Magnetron sputter cathode assembly.
  7. Boys Donald R. (Cupertino CA) Graves Walter E. (San Jose CA), Magnetron sputter coating source for both magnetic and non magnetic target materials.
  8. dos Santos Pereiro Ribeiro Carlos A. (Von Stauffenbergstrasse 12 7470 Albstadt 15 DEX), Magnetron sputtering cathode.
  9. Meckel Benjamin B. (Del Mar CA) Bromley Emily I. (Del Mar CA), Magnetron sputtering of magnetic materials.
  10. Class Walter H. (Yonkers NY) Unterkofler George J. (Nanuet NY) Hurwitt Steven D. (Park Ridge NJ), Magnetron sputtering target and cathode assembly.
  11. Hartsough Larry D. (Berkeley CA), Method and apparatus for attaching a target to the cathode of a sputtering system.
  12. Fielder Kenneth B. (Columbus OH) Belli Robert L. (Columbus OH) Fuchs Conrad E. (Grove City OH), Quick change sputter target assembly.
  13. Qamar, Sohail S.; Conard, Harry W.; Hamilton, Lowell E., Sputter target design.
  14. Lamont ; Jr. Lawrence T. (Mountain View CA), Sputter target for use in a sputter coating source.
  15. Kuehnle Manfred R. (Lexington MA), Sputtering apparatus.
  16. Nagashima Setsuo (Kawasaki JPX), Sputtering apparatus.
  17. Nishiyama Hiroshi (Mukou JPX) Nakamura Takeshi (Uji JPX) Kato Suehiro (Nagaokakyo JPX) Ando Kenji (Kyoto JPX), Sputtering apparatus.
  18. Clarke Peter J. (760 Arcady Road Santa Barbara CA 93108), Sputtering apparatus and method.
  19. Pierce Danny A. (Columbus OH) Heisler Joseph A. (Timberlake OH) Self Roger D. (Mount Sterling OH), Target assemblies of special materials for use in sputter coating apparatus.
  20. Wickersham Charles E. (Columbus OH), Target assembly for sputtering magnetic material.
  21. Rille Eduard (Dornbirn ATX) Kaiser Erich (Vaduz LIX) Grnenfelder Pius (Buelweg CHX), Target plate for cathode sputtering.
  22. Rainey ; Robert M., Target profile for sputtering apparatus.
  23. Mintz Donald M. (Sunnyvale CA), Targets for magnetron sputter device having separate confining magnetic fields to separate targets subject to separate d.

이 특허를 인용한 특허 (27)

  1. Forster, John C.; Tang, Xianmin, Apparatus and method for improved darkspace gap design in RF sputtering chamber.
  2. Okabe, Takeo; Miyashita, Hirohito, Copper or copper alloy target/copper alloy backing plate assembly.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  4. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  5. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  6. Ivanov,Eugene Y.; Conard,Harry W., Friction fit target assembly for high power sputtering operation.
  7. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  8. Ivanov, Eugene Y.; Conard, Harry W., Low temperature sputter target bonding method and target assemblies produced thereby.
  9. Ivanov,Eugene Y., Low temperature sputter target/backing plate method and assembly.
  10. Ivanov, Eugene Y.; Conard, Harry W., Method of assembling target and backing plates.
  11. Wickersham, Jr.,Charles E.; Workman,David P., Method of forming a sputtering target assembly and assembly made therefrom.
  12. Ivanov, Eugene Y., Method of manufacturing sputter targets with internal cooling channels.
  13. Ivanov, Eugene Y., Method of manufacturing sputter targets with internal cooling channels.
  14. Ivanov Eugene Y. (Grove City OH) Grigoriva Tatyana F. (Spartaka RUX) Boldyrev Vladimir V. (Tereshkove RUX), Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded there.
  15. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  16. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  17. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  18. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  19. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  20. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  21. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  22. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  23. Demaray Richard Ernest ; Hosokawa Akihiro ; Herrera Manuel J., Preparation and bonding of workpieces to form sputtering targets and other assemblies.
  24. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  25. Kim, Sung Eun; Lim, Tae Hyun; Yoo, Hwan Kyu; Yoo, Kwang Jong; Moon, Yang Sik; An, Byeong Cheol, Sputtering apparatus and driving method thereof.
  26. Yoshikazu Kumahara JP; Keiichi Ishizuka JP, Sputtering target.
  27. Daxinger Helmut,CHX ; Haag Walter,CHX ; Kugler Eduard,ATX, Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source.
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