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System for performing work on workpieces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-005/12
  • B05C-013/02
출원번호 US-0810820 (1991-12-19)
발명자 / 주소
  • Litteral Mary O. (Kokomo IN)
출원인 / 주소
  • Delco Electronics Corporation (Kokomo IN 02)
인용정보 피인용 횟수 : 73  인용 특허 : 18

초록

Work is performed on workpieces, e.g., coating circuit boards, of different types in random order in assembly line fashion on a rotary table of an apparatus under programmed control. The table is rotated stepwise to move successive sections thereof from a load-unload station at which the respective

대표청구항

A method for performing work on workpieces of different types in random order in assembly line fashion, the method comprising: rotating stepwise at intervals a rotary table comprising circumferentially spaced apart table sections to move each table section stepwise in cycles from a load-unload stati

이 특허에 인용된 특허 (18)

  1. Nativi Larry A. (Rocky Hill CT), Conformal coating systems.
  2. Wong Ching-Ping (Lawrence Township ; Mercer County NJ), Encapsulated electronic circuit.
  3. Henninger, Albert S., Method and apparatus for applying solder masking to a circuit board.
  4. Weiswurm Klaus D. (818 E. Myrtle St. San Antonio TX 78212), Method and apparatus for coating of circuit boards.
  5. Shimada Takaji (Kawaguchi JPX), Method for applying a moistureproof insulative coating to printed circuit boards using triangular or dovetail shaped liq.
  6. Shimada Takaji (Kawaguchi JPX), Method for applying a moistureproof insulator coating on packaged circuit boards.
  7. Heiss ; Jr. John Herbert (Bethlehem PA) Schoen Joel Mark (Freehold NJ), Method for selective encapsulation.
  8. Cargill Don A. (Bloomfield Hills MI) Fisher Lee K. (Birmingham MI), Non-synchronous rotary manufacturing system.
  9. Ikuta ; Yasuo, Packaging method of a circuit for an electronic watch.
  10. Moeller Werner (Ulm DEX) von Luettichau Harald (Kirchheim-Oetlingen DEX), Process for encapsulating microelectronic semi-conductor and layer type circuits.
  11. Pirvics Juris (Wayne PA) Vazirani Hargovind N. (Stirling NJ), Process for producing cover coated electronic circuits.
  12. Drain Kieran F. (Meridan CT) Summers Robert (Middletown CT) Nativi Larry A. (Rocky Hill CT), Radiation curable temporary solder mask.
  13. Sparrowhawk Bryan L. (2524 130th St. SE. Everett WA 98204) Redfield ; Jr. John M. (17048 3rd Ave. NE. Seattle WA 98155), Removable controlled thickness conformal coating.
  14. Matsuyama Taizo (Sayama JPX) Goto Kaname (Sayama JPX) Hyuga Masao (Sayama JPX) Ozawa Akira (Sayama JPX) Kousaka Tomomi (Sayama JPX) Asuma Minoru (Sayama JPX) Watari Jyun (Sayama JPX), Rotary transfer system.
  15. Piazza John R. (East Amwell Township ; Hunterdon County NJ), Strippable resists.
  16. Rohde Robert R. (Apalachin NY) Bedard Joseph J. (Endicott NY), Surface locating and dispensed dosage sensing method and apparatus.
  17. Ida Jinsei (Sayama JPX) Fujita Tsutomu (Kawagoe JPX) Matsuo Kenzaburo (Kawagoe JPX) Higuchi Fumio (Kawagoe JPX) Tamura Mitsuo (Kawagoe JPX), Transfer type working system.
  18. Hudock John S. (Hempfield Township ; Westmoreland County PA), U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coatin.

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  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
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  4. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
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  6. Adamczyk Anthony P. ; Bowley Glenn E. ; Dahill John ; Edwards Richard ; Hall Lonzell ; Payette Michael ; Senethep Sout ; Wilcox Peter ; Wilson Heather, Apparatus for coating a surface of one or more lenses.
  7. Robert W. Batz, Jr. ; Scot Conrady ; Thomas L. Ritzdorf, Apparatus for high deposition rate solder electroplating on a microelectronic workpiece.
  8. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Apparatus for processing the surface of a microelectronic workpiece.
  9. Pedersen, John M.; Erickson, James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  10. Pedersen,John M.; Erickson,James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  11. Gochnour, Derek J.; Mess, Leonard E., Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  12. Jacob David E., Apparatus method for determining the presence or absence of a wafer on a wafer holder.
  13. Betzner, Timothy M., Battery capacity and durability prediction method.
  14. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  15. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  16. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  17. Hynes Anthony J. ; Urquhart Jonathan Neal, Conformal coating using multiple applications.
  18. Anthony J. Hynes ; Jonathan Neal Urquhart, Conformal coating using multiple applicators.
  19. Batz, Jr., Robert W.; Pedersen, John M.; Klocke, John L.; Chen, LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
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  21. Batz, Jr.,Robert W.; Pedersen,John M.; Klocke,John L.; Chen,LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
  22. Fyffe, Roger L.; Marc, Etienne, Conveyance system and method for underwater seismic exploration.
  23. Woodward, Jr., Reagan Neil; Thompson, James N., Conveyance system and method for underwater seismic exploration.
  24. Thompson, James N.; Ray, Clifford H.; Fisseler, Glenn D.; Fyffe, Roger L., Deployment method for ocean bottom seismometers.
  25. Pedersen, John M.; Willey, Jeremy; Woodruff, Daniel J., Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces.
  26. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  27. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  28. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating reactor.
  29. Fyffe, Roger L.; Marc, Etienne, Helical conveyor for underwater seismic exploration.
  30. Muster, Kenneth F.; Palleva, William M.; Blaricom, Terry Van; Green, Patrick M., Lens coating apparatus.
  31. Fyffe, Roger L.; Marc, Etienne, Loading a helical conveyor for underwater seismic exploration.
  32. Thompson, James N.; Ray, Clifford H.; Fisseler, Glenn D.; Fyffe, Roger L., Method and apparatus for deployment of ocean bottom seismometers.
  33. Thompson, James N.; Ray, Clifford H.; Fisseler, Glenn D.; Fyffe, Roger L.; Mitchell, Stephen W.; Boone, William E., Method and apparatus for deployment of ocean bottom seismometers.
  34. Bath,William R.; Sayle,Frank, Method and apparatus for installing a sensor array.
  35. Gochnour, Derek J.; Mess, Leonard E., Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  36. Thompson, James N.; Ray, Clifford H.; Fisseler, Glenn D.; Fyffe, Roger L., Method and system for deployment of ocean bottom seismometers.
  37. Thompson, James N.; Ray, Clifford H.; Fisseler, Glenn D.; Fyffe, Roger L., Method for deployment of ocean bottom seismometers.
  38. Batz, Jr., Robert W.; Conrady, Scot; Ritzdorf, Thomas L., Method for high deposition rate solder electroplating on a microelectronic workpiece.
  39. Stevens, Blake L.; Sorenson, Max E.; Chason, Marc K., Method for manufacturing an electronic device.
  40. Pedersen,John M.; Erickson,James J., Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  41. Gochnour Derek J. ; Mess Leonard E., Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  42. Gochnour, Derek J.; Mess, Leonard E., Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  43. Gochnour, Derek J.; Mess, Leonard E., Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  44. Gochnour,Derek J.; Mess,Leonard E., Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board.
  45. Hooker Jeff ; Simmons Steve, Method of determining the planar inclination of a surface.
  46. High, Colin J., Method of manufacture of aerofoil assemblies having datum features located in complementary fixtures.
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  48. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
  49. Woodruff Daniel J. ; Hanson Kyle M. ; Oberlitner Thomas H. ; Chen LinLin ; Pedersen John M. ; Zila Vladimir,CAX, Methods and apparatus for processing the surface of a microelectronic workpiece.
  50. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
  51. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Methods and apparatus for processing the surface of a microelectronic workpiece.
  52. Stevens, Blake; Sorenson, Max; Clayson, Paul S.; Gordon, Scott B., Methods for applying protective coatings to internal surfaces of fully assembled electronic devices.
  53. Stevens, Blake; Sorenson, Max; Martin, III, Sidney Edward, Methods for masking and applying protective coatings to electronic assemblies.
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  58. Woodward, Jr., Reagan Neil; Thompson, James N., Multiple receiver line deployment and recovery.
  59. Ramanan, Harikrishnan; Wang, Yongqian J., Nozzle array configuration to facilitate deflux process improvement in chip attach process.
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  65. Fyffe, Roger L.; Marc, Etienne, Skid structure for underwater seismic exploration.
  66. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
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  68. Stevens, Blake; Sorenson, Max; Chason, Marc, Systems for assembling electronic devices with internal moisture-resistant coatings.
  69. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  70. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  71. Fyffe, Roger L.; Marc, Etienne, Underwater seismic exploration with a helical conveyor and skid structure.
  72. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
  73. Hooker Jeffrey A. ; Spencer ; Jr. James E., Workpiece treating apparatus and method of treating same.
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