초록

An electronic assembly contains a semiconductor chip, a metal heat spreading layer, a dielectric layer and a metal heat sink wherein superior heat dissipation is present.

대표청구항 ▼

An electronic assembly comprising in order: (a) a semiconductor chip having a surface area AC, (b) a metal heat spreading layer having a first edge and a second edge, said heat spreading layer having a thickness T and a surface area AM, where AM>AC, (c) a layer of an electrically insulating dielectr

An electronic assembly comprising in order: (a) a semiconductor chip having a surface area AC, (b) a metal heat spreading layer having a first edge and a second edge, said heat spreading layer having a thickness T and a surface area AM, where AM>AC, (c) a layer of an electrically insulating dielectric material having a surface area AD, where AD>AM, and (d) a metal heat sink layer having a surface area AS, where AS>AD, wherein said chip is located at a distance D1 from the first edge of the metal heat spreading layer and a distance D2 from the second edge of the metal heat spreading layer and angles f1, f2 and fave are defined by the relationships [Figure] [Figure] fave=1/2[f1+f2] wherein angle f1) a line from an edge of the chip to the edge of an upper surface of the heat spreading layer, which is parallel to a surface of the heat spreading layer, and (2) a line connecting an edge of the chip to an edge of a lower surface of the heat spreading layer, angle f1 is the angle using the smallest distance, D1 and angle f2 is the angle using the largest distance D2 and further wherein one of the following dimensional relationships exists: (1) T=5-9 mils and f2°to 3°, (2) 9>T>15 mils and f4°to 9°, or (3) T=15-20 mils and f7 to 8°.