초록 ▼

The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate the need fo

The invention relates to an electrical interconnect device with power and ground lines interwoven about signal line layers and capacitive vias between signal layers so as to make efficient use of otherwise undedicated area between signal lines and signal layers and to reduce or eliminate the need for separate power and ground layers while providing decoupling capacitance within the wiring structure.

대표청구항 ▼

An electrical interconnect device, comprising: a plurality of spaced, parallel, conductive upper lines in an upper horizontal plane comprising upper signal lines and upper power distribution lines wherein an upper signal line is between each pair of upper power distribution lines and an upper power

An electrical interconnect device, comprising: a plurality of spaced, parallel, conductive upper lines in an upper horizontal plane comprising upper signal lines and upper power distribution lines wherein an upper signal line is between each pair of upper power distribution lines and an upper power distribution line is between each pair of upper signal lines; a plurality of spaced, parallel, conductive lower lines in a lower horizontal plane comprising lower signal lines and lower power distribution lines wherein a lower signal line is between each pair of lower power distribution lines and a lower power distribution lines is between each pair of lower signal lines, and the lower lines are positioned beneath, spaced from and orthogonal to the upper lines; a plurality of vertical, conductive vias between and connected to the upper and lower lines comprising signal vias located at selected overlapping regions of the upper and lower signal lines and power distribution vias located at selected overlapping regions of the upper and lower power distribution lines; and a plurality of vertical, capacitive vias between and connected to selected upper and lower power distribution lines.