초록 ▼

A composite article comprising a silicon body and a glass body bonded directly thereto by electrostatic bonding. The glass composition consists essentially of oxides of silicon, aluminum, and lithium, and the glass has a coefficient of thermal expansion approximating that of silicon, etches at a rat

A composite article comprising a silicon body and a glass body bonded directly thereto by electrostatic bonding. The glass composition consists essentially of oxides of silicon, aluminum, and lithium, and the glass has a coefficient of thermal expansion approximating that of silicon, etches at a rate of at least 100 mg/cm2 in 20 minutes in 48% HF, and may be electrostatically bonded to silicon at a voltage not over 1,000 volts/mm of glass thickness at a temperature not over 440°C.

대표청구항 ▼

A composite article comprising a silicon body and a glass body electrostatically bonded directly to the silicon body, the glass having a composition consisting essentially of oxides of silicon, aluminum, and lithium, having a coefficient of thermal expansion (CTE) in the range of 32-40×10-7/°C., tha

A composite article comprising a silicon body and a glass body electrostatically bonded directly to the silicon body, the glass having a composition consisting essentially of oxides of silicon, aluminum, and lithium, having a coefficient of thermal expansion (CTE) in the range of 32-40×10-7/°C., that has an etchability rate by 48% HF of at least 100 mg/cm2 in 20 minutes, and that has a resistivity at 350°C. of not over 106 ohms/cm, whereby the glass has the capability of being electrostatically bonded to silicon at a voltage not over 1,000 volts/mm and at a temperature not over 440°C.