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Electronic unit 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0042205 (1993-04-02)
발명자 / 주소
  • Collins Hugh M. (Nepean CAX) Hayes Hasler R. (Munster Hamlet CAX) Moss John S. (Ottawa CAX) Read Clifford D. (Stittsville CAX) Nicoletta Tristano F. (Nepean CAX) Drayton John B. (Nepean CAX) Pell Dav
출원인 / 주소
  • Northern Telecom Limited (Montreal CAX 03)
인용정보 피인용 횟수 : 45  인용 특허 : 0

초록

Electronic unit of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The units are mountable in a support frame with

대표청구항

An electronic unit comprising a printed circuit board and a heat sink means, the printed circuit board assembled to a surface of the heat sink means which also has a heat release projection means exposed for contact by a flow of cooling fluid across the heat release projection means, the projection

이 특허를 인용한 특허 (45)

  1. Myszka Robert V. ; Vancha John ; Utzerath James H., Breadmaker circuit board mounting method.
  2. Giannatto Carl J. ; Cornish Kevin C., Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger.
  3. Schneider Michael G. (Rockford IL) Bland Timothy J. (Rockford IL), Cooling apparatus for an electronic component.
  4. Schneider Michael G. ; Bland Timothy J., Cooling apparatus for an electronic component.
  5. Matsui Toshinori,JPX ; Niimi Yukihide,JPX ; Kobayashi Toshiki,JPX, Cooling device for electronic parts of vehicle.
  6. Mahler Hans,SEX, Device for cooling of electronics units.
  7. Nelson Daryl James, Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.
  8. Hashikura, Manabu; Shimizu, Tatsuya; Nishida, Futoshi, Electric connection box.
  9. Matsui, Yuusuke, Electric device having first and second electric elements.
  10. Foulonneau,Stephane, Electronically controlled electric fan cooled by pressurized ambient air.
  11. Moore, Christopher Todd, Enclosure with duct mounted electronic components.
  12. Dornauer, Frank P.; Kramer, Greg P.; Smalc, Martin D., Flexible graphite sheet support structure and thermal management arrangement.
  13. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Taylor, Joseph Daniel, Flexible thermal conduit for an electronic device.
  14. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Taylor, Joseph Daniel, Flexible thermal conduit for an electronic device.
  15. Asai, Nobuhiro; Saito, Yoshitami, Heat dissipating device for electronic components of electronic control devices.
  16. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Hodge, Andrew, Heat dissipation structure for an electronic device.
  17. Shuy, Geoffrey Wen Tai, Heat exchange enhancement.
  18. Shuy, Geoffrey Wen-Tai, Heat exchange enhancement.
  19. Shuy, Geoffrey Wen-Tai, Heat exchange enhancement.
  20. Shuy, Geoffrey Wen-Tai, Heat exchange enhancement.
  21. Shuy,Geoffrey Wen Tai, Heat exchange enhancement.
  22. Okada, Akira; Imabayashi, Hirofumi; Yajima, Hideaki; Kanasaki, Katsumi; Miyazaki, Takehide; Nishida, Kazuya, Heat radiator.
  23. Markow Paul A. ; Shock Karl W. ; Chupp Bradley S. ; Morenilla Luis J. ; Holmes Frank R. ; Burcham Stephen W., Heat sink assembly for electrical components.
  24. Duesman Kevin G. ; Bissey L. Jan, Heat sink for chip stacking applications.
  25. Duesman, Kevin G.; Bissey, L. Jan, Heat sink for chip stacking applications.
  26. Pavlovic Slobodan, Heat sink for printed circuit board.
  27. Abbay, Samuel; Kim, Jeong Hun; Le, Don, Heat transfer system, method, and computer program product for use with multiple circuit board environments.
  28. Phillips, Alton H., High heat load optics with a liquid metal interface for use in an extreme ultraviolet lithography system.
  29. Phillips, Alton H., High heat load optics with a liquid metal interface for use in an extreme ultraviolet lithography system.
  30. Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
  31. Giannatto Carl J. ; Cornish Kevin C., Housing for diverse cooling configuration printed circuit cards.
  32. Albert,Roland, Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein.
  33. Barna, Kyle Steven, Mechanical heat pump for an electrical housing.
  34. Phillips, Alton H., Method and apparatus for aligning mirror blocks of a multi-element mirror assembly.
  35. Roman M. Katchmar CA, Method and device for heat dissipation in an electronics system.
  36. Suppa Vito,FRX ; Begnis Noel,FRX ; Aldon Jean-Claude,FRX, Method for fabricating an electronics board with thermal-conduction cooling.
  37. Kunz, Felix, Passively cooled computer.
  38. Spivey,Thomas; Winn,Tracy, Portable data routing device and method of use.
  39. Goebl, Christian, Power semiconductor module.
  40. Giannatto Carl J. ; Cornish Kevin C. ; Straub Walter H., Printed circuit board-mounted, sealed heat exchanger.
  41. Matsuda,Shuichi, Semiconductor device having resin-sealed area on circuit board thereof.
  42. Matsuda,Shuichi, Semiconductor device having resin-sealed area on circuit board thereof.
  43. Cai, Li; Van Hove, James M.; Jepson, Amanda Jo, Semiconductor devices with improved heat dissipation and method for fabricating same.
  44. Mertol Atila ; Celik Zeki Z. ; Ghahghahi Farshad ; Kutlu Zafer S., Thermally-enhanced flip chip IC package with extruded heatspreader.
  45. Kuwahara, Shinichi, Transmitter and electronic device.
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