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Hybird cooling system for electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0830952 (1992-02-06)
발명자 / 주소
  • Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 202  인용 특허 : 0

초록

An improved method for removing heat from electronic devices, such as computer modules, is described. A flow of gas, such as air, cools the components. The gas flow is sufficient to cool so called “hot”components to their maximum operating temperature, and to cool the other components to their norma

대표청구항

An electrical apparatus comprising: a circuit board; a heat generating electronic component mounted on said circuit board, said electronic component having a maximum operating temperature, said electronic component having a substantially planar surface; and a heat sink composed of a thermally conduc

이 특허를 인용한 특허 (202)

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AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

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